Industrial Machinery

兼松ＰＷＳ

EstablishmentSeptember 1982
capital3000Ten thousand
number of employees80
addressKanagawa/Kohoku-ku, Yokohama-shi/Shinba-cho 925
phone045-544-1811
last updated：
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兼松ＰＷＳ List of Products and Services

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Exposure device Exposure device
Dual-Sided Position Accuracy Measuring Device DSM8Gen2 Dual-Sided Position Accuracy Measuring Device DSM8Gen2
Inkjet device Inkjet device
Automatic analysis device for semiconductor plating solution Automatic analysis device for semiconductor plating solution
Multi-Laser Dicing Equipment ICA1205 Multi-Laser Dicing Equipment ICA1205
Die Bonder & Flip Chip Bonder Die Bonder & Flip Chip Bonder
Wire bonding device Wire bonding device
Package Post-Inspection Device Skyhawk Package Post-Inspection Device Skyhawk
Package

Package Post-Inspection Device Skyhawk

One-stop automatic optical inspection package post-inspection device Features: - Capable of inspecting up to 33 items - Advanced 2D and 3D all-in-one vision system - Ball height measurement - Measurement of wire loops and wire lengths - Dual head with two independent inspection systems Applications: Semiconductor-related devices 〇 Other ASM equipment handled - ALSI: Multi-laser dicing equipment - ASM PT: Wire bonder equipment - ASM PT: 2D and 3D package appearance inspection equipment - ASM PT: Other die bonder equipment (alignment accuracy of 0.2µm to 25µm) 〇 ASM equipment installation achievements (total domestic and international): 2,000 units of die bonders annually, 4,000 units of wire bonders annually