兼松ＰＷＳ Product Lineup

We handle the "Automatic Analysis System for Semiconductor Plating Solutions" manufactured by NOVA, which is used by major semiconductor and electronic component manufacturers. *In 2023, NOVA, a measurement equipment manufacturer for semiconductors in Israel, acquired Ancosys and integrated it into the CMD division (Chemical Measurement Division). We offer the following lineup of automatic analysis systems for plating solutions in each process. Post-process, Advanced Packaging - Nova ANCOLYZER The Nova ANCOLYZER is the industry-standard fully automated online chemical measurement platform for advanced packaging processes. The Nova ANCOLYZER provides excellent analytical performance and supports various analytical techniques for process control. This platform can be configured to meet specific process analysis and replenishment requirements, designed with the most flexible and scalable structure. The Nova ANCOLYZER offers outstanding accuracy and precision, as well as uncompromising reliability and high availability. Basic information follows.

• Other semiconductor manufacturing equipment
• Analytical Equipment and Devices

"NANO" is a device that enables bonding of ultra-high precision diced chips to wafers/substrates/chips using the company's patented alignment technology. It also features a unique laser irradiation method during bonding and is equipped with a mechanism to suppress vibrations during the bonding process. 【Features】 - Alignment accuracy: ±0.3µ@3σ - Alignment technology (patented) - Bonding method during bonding - Equipped with vibration suppression mechanism - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications of the Device】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Bonding methods: eutectic solder, epoxy, UV-curable resin, laser bonding * Ultrasonic bonding is not supported.

• Bonding Equipment

Kanematsu PWS Corporation is a company primarily engaged in the development, design, manufacturing, and sales of semiconductor manufacturing and inspection equipment. Our main products include equipment-related units and parts such as "wafer probe cards," "polishing films," and "Post CMP Blush." In addition, we provide technical services such as the design and manufacturing of various labor-saving devices, installation and maintenance of our own equipment, and imported semiconductor manufacturing and inspection equipment. Please feel free to contact us if you have any requests. 【Business Introduction】 ■ Development, design, manufacturing, and sales of semiconductor manufacturing/inspection equipment ■ Technical services ■ Sales, brokerage, maintenance services, setup, and modification of used semiconductor manufacturing equipment *For more details, please refer to our catalog or feel free to contact us.

• Wafer
• Contract manufacturing
• Other electronic parts