V-net AAEON List of News Articles

●21.5-inch TFT LCD display (1920 x 1080) ●Equipped with Intel N50/97 ●Projected capacitive multi-touch support ●Aluminum chassis design ●Front panel compliant with IP65 (dustproof and waterproof) ●Fanless structure ●VESA mount / mount bracket compatible ●Supports wide power input of 9-30V DC *Memory, storage, and OS not included

●NVIDIA Jetson Orin NX 8GB/16GB ●Fanless structure ●8GB/16GB onboard memory ●128GB M.2 2280 onboard (for OS boot) ●GMSL2×8 (supports FAKRA connector) ●Giga LAN×5 ●TPM, 9-axis sensor, GPS ●Supports 9V to 48V DC input with ACC ignition delay On/Off capability ●Jetpack 6.0.0 pre-installed

● Equipped with NVIDIA Jetson AGX Orin 32GB/64GB ● Fanless design ● 32GB/64GB onboard memory ● USB 3.2 Gen 2 (Type A) x8 (independent 10Gbps support) ● GbE LAN x2 ● RS-232/422/485 (Rx/Tx) x2 (one port shared with CANBus FD) ● Models with AC adapter included and wireless LAN support are also available ● Jetpack 5.1.1 pre-installed

●NVIDIA Jetson Orin NX 8GB/16GB ●Fanless design ●8GB/16GB onboard memory ●PoE/PSE GbE LAN x 8 *4 ports of PoE share one MAC address and Giga bandwidth *Supports a total of 120W PoE with input of 24V or more, 80W PoE with input of 12-24V, and 80W PoE with input of 12V or less. ●Giga LAN x 2 ●Supports 9V~36V DC input and can accommodate ACC ignition delay On/Off ●Jetpack 6.0.0 pre-installed

● Equipped with Intel N200/N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 32GB) ● HDMI 2.0b x1 ● M.2 2242/3042/3052 B+M-Key (USB 3.2/SATA III/PCIe 3.0 x2), M.2 2230 E-Key x1 (PCIe 3.0 x1 + USB 2.0) ● USB 3.2 Gen 2 x1 + USB 2.0 x4 ● RS-232/422/485 x2 * This model does not include memory, storage, or OS.

● Equipped with Intel Core Ultra 7 155U / Intel Core(TM) Ultra 5 125U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● 2.5GbE LAN x2 ● Supports 4-screen output: 4K outputs x3 (DP Type-C, DP, HDMI), LVDS x1 (DP Type-C and USB 3.2 share the same port) ● USB 3.2 Gen2x2 x1, USB 3.2 Gen 2 x3, USB 2.0 x4, COM x4 * This model does not include memory, storage, or OS.

● Equipped with Intel(R) Atom x7433RE ● DDR5 4800MHz SO-DIMM x1 slot (up to 32GB) ● 4K compatible HDMI x2, 4K USB Type-C DP, LVDS/eDP x1 ● SATA III x1, M.2 M-key x1, M.2 B-key x1, M.2 E-Key x1 ● USB 3.2 Gen 2 x1, USB Type-C (ALT) x1, USB 2.0 x8, COM x6 ● DC 12~28V input * This model does not include memory or OS * There are models available with storage included

Features: ● Equipped with Intel Core Ultra 9/7/5 processors ● DDR5 5600MHz Dual Channel SODIMM x 2 (up to 96GB) ● VGA switch DDI × 1, LVDS colay eDP × 1, DDI × 2 ● USB 2.0 × 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] × 4, PCIe [x4] × 1, PEG [x8] + [x4] + [x4] ● Intel(R) Ethernet Controller I226, 2.5GbE × 1 ● AT/ATX power supply 9V–16V input ● COM Express Type 6, 3.75 inches × 3.75 inches (95mm × 95mm)

● Equipped with Intel(R) Xeon D-1712TE/D-1848TER ● Supports DDR4 SODIMM x4, up to 128GB ● USB 2.0 x4, USB 3.2 Gen 1 x4 ● Fan-equipped heatsink available for separate purchase ● Carrier board available for separate purchase

● Equipped with Intel Atom(R) X 7835RE/7433RE/7213RE/7211RE ● DDR5 SODIMM x1, expandable up to 16GB ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● Fan-equipped heat sink available for separate purchase ● Carrier board available for separate purchase

Features: ● 10/100/1000/2500 Base-T(X) x4 and 1G/10Base-X SFP socket x2 ● Supports automatic speed negotiation and MDI/MDI-X automatic adaptation ● Adopts store-and-forward transmission method ● Flow control applied ● IP40 protection rating ● DIN rail mountable

Features: ● 10/100/1000 Base-T(X) x8 and 100/1000Base-X SFP x2 ● Maximum power per port is 30W, total power budget is 180W ● Supports 9.6K Bytes jumbo frames ● 4Mbit packet buffer ● Supports automatic speed negotiation and MDI/MDI-X auto-adaptation ● IP30 protection rating ● DIN rail mountable

Features: ● Compliant with IEEE 802.3cg SPE, supports 10Base-T1L ● Supports long-distance point-to-point transmission up to 1000m ● Compliant with IEEE 802.3bu SCCP PoDL (Power over Data Line) PSE type ● PoDL supports up to 50 watts/1A ● PoDL legacy mode ● Wide power input range of 20–30VDC ● Supports QoS and flow control ● IP-30 protection rating

Features: ● 21.5-inch TFT LCD display ● Equipped with Intel(R) N-series processor ● Projected capacitive multi-touch support ● Aluminum chassis design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless ● Built-in VESA mount / panel embedded mount bracket ● Supports a wide power input of 9-30V DC

Features: ● 15.6-inch TFT LCD display (1920×1080 / 1366×768) ● Equipped with Intel(R) Processor N series ● Projected capacitive multi-touch support ● Aluminum casing design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless ● Built-in VESA mount / panel embedded mount bracket ● Supports a wide power input of 9-30V DC

Features: ● 10.4-inch TFT LCD display ● Equipped with Intel(R) N-series processor ● Projected capacitive multi-touch support ● Aluminum chassis design ● Front panel compliant with IP65 (dustproof and waterproof) ● Fanless ● Built-in VESA mount / panel embedding mount bracket ● Supports a wide power input of 9-30V DC

● Equipped with Core Arm(R) Cortex(R)-A55 + Core Arm(R) Cortex(R)-M33 Processor ● Onboard LPDDR4 2GB ● Capable of supporting HDMI x1 or MIPI-DSI 4 lane x1, LVDS x1 ● USB 2.0 OTG x1, USB 2.0 HOST x4 ● Heat sink available for separate purchase ● Carrier board available for separate purchase

● Equipped with Intel Atom(R) Processor x7000RE Series ● Up to 64GB eMMC ● USB 3.2 Gen 2 x2, USB 2.0 x6 ● Fan-equipped heat sink available for separate purchase ● Carrier board available for separate purchase

●ARM MediaTek Genio 700/510 equipped ●LPDDR4 8GB onboard ●HDMI 2.0 x1, DP1.4 x1 ●USB 3.0 HOST x1, USB 2.0 OTG x1, USB 2.0 HOST x4 ●Heat sink available for separate purchase ●Carrier board available for separate purchase

Features: ● Compatible with 12th/13th/14th generation LGA1700 socket Core i3, i5, i7 processors (up to 65W) ● Wide temperature range support (operating temperature: -25°C to 70°C) ● HDMI output x 2, GbE LAN x 2 ● 2.5" SSD bay x 2 ● Wide voltage support 10 ~ 35 VDC ● Onboard TPM 2.0

Features: ● Equipped with Intel Core Ultra 5 processor 125H / Ultra 7 processor 155H ● DDR5 4800 MHz SODIMM x 2 (up to 64GB) ● M.2 2280 NVMe SSD tray, 2.5" SSD tray (accessible) ● M.2 3052 B-Key for 5G ● USB 3.2 Gen 2 (Type-A) x 4 ● Onboard TPM 2.0 ● DC 9-36V ● Operating temperature -20℃ to 70℃

We will be exhibiting at the "28th IoT and Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 23 (Wednesday) to April 25 (Friday), 2025! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, embedded boards and edge PCs featuring Intel's Amston Lake and Arrow Lake, ARM's i.MX8 series, touch panel PCs, tablet PCs, and other peripheral devices. We will also demonstrate AI software and actual implementation case studies. ■ Dates: April 23 (Wednesday) to April 25 (Friday), 2025 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, East Hall 3 ■ Booth Location: 22-2 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1317248095735309-ZPN

Features: ● Equipped with NVIDIA Jetson AGX Orin 32GB/64GB ● Fanless design ● 32GB/64GB onboard memory ● USB3.2 Gen2 (Type A) x 8 (independent 10Gbps support) ● GbE LAN x 2 ● RS-232/422/485 (Rx/Tx) x 2 (one port shared with CANBus FD) ● Models with AC adapter included and wireless LAN support are also available ● Jetpac 5.1.1 pre-installed

Features: ● NVIDIA Jetson Orin NX 8GB/16GB ● Fanless design ● 8GB/16GB onboard memory ● PoE/PSE GbE LAN x 8 * 4 ports of PoE share one MAC address and Giga bandwidth * Supports a total of 120W PoE with input over 24V, 80W PoE with input between 12-24V, and 80W PoE with input below 12V. ● Giga LAN x 2 ● Supports 9V~36V DC input and can accommodate ACC ignition delay On/Off ● Jetpack 5.1.2 pre-installed

Features ● Equipped with NVIDIA Jetson Orin Nano ● GbE PoE/PSE 802.3af/at x 4 + GbE LAN x 1 ● M.2 2230 E-Key x 1, M.2 2280 M-Key x 1, M.2 3042/3052 B-Key x 1 ● COM/CANBus/DIO ● Wide temperature range from -15℃ to 65℃

Features: ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz x 1 (up to 16GB) (sold separately) ● HDMI 1.4 x 1, eDP 1.4b/LVDS x 1 ● 2.5GbE x 1, GbE x 1 ● Full-Size mSATA, M.2 2230 E-key x 1 ● USB 3.2 Gen2 [x1] x 2, USB 2.0 x 4 ● RS-232/422/485 x 2, RS-232 x 2 ● TPM 2.0, SATA 6.0Gbps x 1, GPIO 4-bit, SMBUS/I2C x 1

Features: ● DDR5 4800 SO-DIMM x 1 (up to 16GB) (sold separately) ● HDMI 1.4 x 1, eDP 1.4b/LVDS x 1 ● 2.5GbE x 1, 1GbE x 1 ● Full-Sized mSATA, M.2 2230 E-Key x 1 ● USB 3.2 Gen 2 x 2, USB 2.0 x 4 ● RS-232/422/485 x 2, RS-232 x 2 ● TPM 2.0, SATA 6Gb/s, 4-bit GPIO, SMBUS/I2C

We are pleased to announce that we will be exhibiting at the "28th IoT and Edge Computing Exhibition [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 23 (Wednesday) to April 25 (Friday), 2025! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, embedded boards and edge PCs featuring Intel's Amston Lake and Arrow Lake, ARM's i.MX8 series, touch panel PCs, tablet PCs, and other peripheral devices. We will also demonstrate AI software and actual implementation case studies. ■ Dates: April 23 (Wednesday) - April 25 (Friday), 2025 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, East Hall 3 ■ Booth Location: 22-2 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1317248095735309-ZPN

Features: ● 12.1-inch (1024 x 768) TFT LCD display ● Equipped with Intel Alder Lake-P i7/i5/i3 / Celeron CPU (maximum 15W TDP) ● Supports capacitive/resistive touchscreen ● M.2 2280 M-Key x 1 (PCIe [x4] NVMe storage) (sold separately) ● Aluminum design ● Front bezel compliant with IP65 ● Fanless structure ● VESA mount / built-in panel mount bracket ● DC 9-30V input (terminal block) * Memory, storage, and OS are sold separately.

Features: ● 7-inch WSVGA (1024 x 600) color TFT LCD display ● Equipped with Intel Processor N50 / N97 ● Aluminum front bezel compliant with IP65 ● Fanless system ● VESA/panel mount compatible ● DC 12V jack

The event will be held from April 23 (Wednesday) to 25 (Friday), 2025, at Tokyo Big Sight. We are pleased to announce our participation in the "28th IoT and Edge Computing Exhibition [Spring]" within Japan IT Week! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, embedded boards and edge PCs featuring Intel's Amston Lake and Arrow Lake, ARM's i.MX8 series, touch panel PCs, tablets, and other peripheral devices. We will also demonstrate AI software and actual implementation case studies. ■ Dates: April 23 (Wednesday) to 25 (Friday), 2025 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the last day) ■ Venue: Tokyo Big Sight, East Hall 3 ■ Booth Location: 22-2 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1317248095735309-ZPN

Features: ● Equipped with Intel processor N100/N97 ● LPDDR5 6400 4/8/16GB onboard ● eMMC 32/64/128GB onboard ● GbE x 2 ● USB 3.2 Gen 2 x3 ● DP 1.2 x 1, HDMI x 1, eDP 1.3 x 1 ● RS-232/422/485 x 2 ● M.2 2280 M-Key x 2 ● M.2 2230 E-Key x 1 ● TPM 2.0 onboard ● DC 12V/5A input (DC jack) ● Technical support available on the community site https://forum.up-community.org/?utm_source=up-board_homepage&utm_medium=web&utm_campaign=community_upboard_nav *OS sold separately

Features: ● Equipped with Intel processor N150/N250/Core i3-N355 ● LPDDR5 6400 8GB onboard ● eMMC 64GB onboard ● 2.5GbE x 2 ● USB 3.2 Gen 2 (Type A x 2, Type C x 1) ● DP 1.2 x 1, DP 1.4 x 1, HDMI x 1 ● RS-232/422/485 x 2 ● M.2 2280 M-Key x 2 ● M.2 3052 B-Key x 1 (5G compatible) ● M.2 2230 E-Key x 1 (Wi-Fi/BT compatible) ● TPM 2.0 onboard ● DC 12V/6A input (DC jack) ● Operating temperature -20~70℃ ● Heat sink included ● Technical support available on the community site https://forum.up-community.org/?utm_source=up-board_homepage&utm_medium=web&utm_campaign=community_upboard_nav *OS sold separately.

Features: ● Equipped with Intel Core Ultra 5 225H / Ultra 7 255H/265H ● LPDDR5 6400 16GB/32GB/64GB onboard ● Supports up to 4 simultaneous displays ● M.2 2280 M-Key x 2 ● M.2 3052 B-Key x 1 (5G compatible) ● M.2 2230 E-Key x 1 (Wi-Fi/BT compatible) ● 2.5GbE x 1, GbE x 1 ● USB 3.2 Gen 2 (Type A x 2, Type C x 1) ● Onboard TPM 2.0 ● DC 9-36V input (DC jack) ● Includes fan-equipped heatsink ● Technical support available on the community site https://forum.up-community.org/?utm_source=up-board_homepage&utm_medium=web&utm_campaign=community_upboard_nav *Storage and OS sold separately.

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, DP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-Key x 1, M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x 1, VGA x 1, HDMI x 1 ● Intel 2.5GbE x 2, SATA 6Gb/s x 1, 8bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

The event will be held from April 23 (Wednesday) to April 25 (Friday), 2025, at Tokyo Big Sight. We are pleased to announce our participation in the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week! We will showcase AI compact edge PCs equipped with NVIDIA's Jetson series, embedded boards and edge PCs featuring Intel's Amston Lake and Arrow Lake, ARM's i.MX8 series, touch panel PCs, tablets, and other peripherals. We will also demonstrate AI software and actual implementation case studies. ■ Dates: April 23 (Wednesday) to April 25 (Friday), 2025 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, East Hall 3 ■ Booth Location: 22-2 You can register for your visit at the following URL. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1317248095735309-ZPN

Features: ● ARM NXP i.MX8M Plus Quad-core Cortex-A53 1.6GHz (NPU: 2.3 TOPs) ● 2G/4G onboard memory ● 16G/32G onboard eMMC storage ● HDMI 2.0 x 1, LVDS x 1, GbE x 2, USB 3.0 Gen 1 x 2, USB 2.0 x 1 ● COM x 2, CAN x 2, TPM 2.0 (only for model 0002), GPIO x 8 ● M.2 2230 E-key x 1, full-size mini card x 1 ● Standard model comes with Debian 11 (without GUI) ● Debian 11 (with GUI), Android 13, Win 10 IoT, and Yocto support available on a project basis

Features: ● Equipped with NVIDIA Jetson AGX Orin 32GB/64GB ● Fanless design ● 32GB/64GB onboard memory ● USB3.2 Gen2 (Type A) x 8 (independent 10Gbps support) ● GbE LAN x 2 ● RS-232/422/485 (Rx/Tx) x 2 (one port shared with CANBus FD) ● Models with AC adapter included and wireless LAN support are also available ● Jetpack 5.1.1 pre-installed

Features: ● NVIDIA Jetson Orin NX 8GB/16GB ● Fanless design ● 8GB/16GB onboard memory ● PoE/PSE GbE LAN x 8 * 4 ports of PoE share one MAC address and Giga bandwidth * Supports a total of 120W PoE with input over 24V, 80W PoE with input of 12-24V, and 80W PoE with input below 12V. ● Giga LAN x 2 ● Supports 9V~36V DC input and can accommodate ACC ignition delay On/Off ● Jetpack 5.1.2 pre-installed

Features ● Equipped with NVIDIA Jetson Orin Nano ● GbE PoE/PSE 802.3af/at x 4 + GbE LAN x 1 ● M.2 2230 E-Key x 1, M.2 2280 M-Key x 1, M.2 3042/3052 B-Key x 1 ● COM/CANBus/DIO ● Wide temperature range from -15℃ to 65℃

Features: ● Supports 12th/13th/14th generation LGA1700 socket Core i3, i5, i7 processors (up to 65W) ● Wide temperature range support (operating temperature: -25°C to 70°C) ● HDMI output x 2, GbE LAN x 2 ● 2.5" SSD bay x 2 ● Wide voltage support 10 ~ 35 VDC ● Onboard TPM 2.0

Features: ● Equipped with Intel Core Ultra 5 processor 125H / Ultra 7 processor 155H ● DDR5 4800 MHz SODIMM x 2 (up to 64GB) ● M.2 2280 NVMe SSD tray, 2.5" SSD tray (accessible) ● M.2 3052 B-Key for 5G ● USB 3.2 Gen 2 (Type-A) x 4 ● Onboard TPM 2.0 ● DC 9-36V ● Operating temperature -20℃ ~ 70℃

Features ● Equipped with 13th generation Intel Core i7 / i5 / i3 / U series ● DDR5 SO-DIMM x 2 (up to 64GB) ● 2.5GbE x 1, GbE x 1, SATA 6Gb/s x 1, GPIO x 8-bit ● USB 3.2 Gen 2 x 3, USB 2.0 x 2, USB Type C x 1, RS-232/422/485 x 2 ● M.2 2280 M-Key x 1, M.2 2230 E-Key x 1, M.2 3052/3042/2242 B-Key x 1 ● Wide DC Input 9-36V

Features: ● Intel Core i3-N305/N97 equipped ● Hailo-8 edge AI processor ● LPDDR5 memory 8GB / 16GB onboard ● eMMC 64GB / 128GB onboard ● 2.5GbE x 2 (Intel I226-IT) ● USB 3.2 (Type-A) x 2 ● 40-pin GPIO x 1 ● DP 1.2 x 1, HDMI 2.0b x 1 ● RS-232/422/485 x 2 ● M.2 2230 E-Key/M.2 2280 M-Key ● TPM 2.0 onboard ● 12V~36V DC-in with Phoenix Connector