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It is a UV-NIL resist. It has excellent spin coating characteristics. It has excellent NIL characteristics. It has high etching resistance. ❖ No need for a primer treatment before coating. ❖ Easily forms a thin film with superior thickness uniformity by spin coating. ❖ Low volatility during vacuum defoaming on wafer. ❖ Low volatility during hot-air drying on wafer. For more details, please refer to the brochure or contact us.
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This is a solvent-free photo-curable resin suitable for creating fine optical elements from the μm to nm order using imprint technology. It is a material suitable for imprinting without solvents. It can also accommodate solvent-diluted thin films in the nm order. It has excellent spin-coating suitability. Low curing shrinkage. High heat resistance (solder reflow resistance). High transparency. Can be prepared with nD 1.46 - 1.68. For more details, please refer to the brochure or contact us.
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- Solvent free, low shrinkage UV-curable resins - High Tg and excellent heat resistance (up to 300˚C/572˚F reflow compatible) - Adjustable refractive index (nD = 1.5 – 1.6) - High optical transparency and durability - Spin-coatable, imprintable formulations suitable for sub-100 nm patterns For more details, please refer to the brochure or contact us.
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As next-generation optical materials AR/MR displays Sensors Meta-optics Silicon photonics and more can be created using imprint technologies such as DOE, MLA, WLO, and waveguides.
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High Refractive Index (nD 1.93) Imprint Material nD 1.93 High Refractive Index UV Imprint Material for Metaoptics and Photonics - For meta lenses, meta surfaces, and other metaoptics - DOE - Silicon Photonics - AR / XR
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Solvent-free with a viscosity of approximately 3000 mPa·s (25°C), suitable for thick applications. nD1.69, high refractive index. Suitable for WLO, MLA, AR/MR waveguides, and metamaterials.
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