アイエルテクノロジー List of Products and Services

This product is a laser bond tester designed specifically for gold or copper wire bond magazine supply. It can be used for efficient sampling inspections and complete bond inspections of medium lots. It comes standard with a function that corrects to an optimal measurement position using image processing based on bond position information. For further details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating bonding interface measurement method ■ Measurement Targets - Gold/Copper wire bonding interface condition - Wire diameter: φ15μm to φ40μm ■ Measurement Laser: Semiconductor laser, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Tester

This product is a laser bond tester designed specifically for large-diameter aluminum wire bonds with a magazine supply system. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections for medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Targets - Aluminum wire bonding interface condition - Wire diameter: φ200μm to φ400μm ■ Measurement Laser: Semiconductor laser, etc. *For more information, please refer to the PDF document or feel free to contact us.

• Tester

This product is a manual measurement laser bond tester specifically for gold or copper wire bonds. It can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and testing all bonds in small lots. The measurement method is a laser periodic heating joint interface measurement method. The device safety standards comply with ISO 13849 / JIS B 9705. For further details, please contact us. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Gold/copper fine diameter wire specification *For more details, please refer to the PDF document or feel free to contact us.

• Tester

This product is a highly versatile tester that allows for manual specification of suitable measurement positions. As a result, this product can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and full bond inspections for small lots. The standard measurement target is thick aluminum wire bonds in the post-process of power semiconductor manufacturing. It is used in industries such as automotive, railway vehicles, industrial equipment, and aerospace, where high reliability is required. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Thick aluminum specification *For more details, please refer to the PDF materials or feel free to contact us.

• Tester

The product is a laser bond tester capable of non-contact, non-destructive, and instantaneous measurement of gold wire bonds. It comes standard with a function to correct the measurement position to an optimal location using image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Target: Gold or copper wire bonding interfaces ■ Measurement Laser: Semiconductor laser ■ Measurement Area: 300mm (X)・300mm (Y) ■ Power Supply: Three-phase AC 200V 30A/max, requires grounding (Type D), etc. *For more details, please refer to the PDF document or feel free to contact us.

• Tester

This product is a laser bond tester that can perform non-contact, non-destructive, and instantaneous measurements of aluminum wire bonds. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. The measurement method is a laser periodic heating joint interface measurement method. 【Features】 ■ Automatic measurement ■ Non-contact ■ Non-destructive ■ Instantaneous measurement *For more details, please refer to the PDF materials or feel free to contact us.

• Tester