Manual measurement laser bond tester specifically for thick aluminum wire bonds! It can be used for all bond inspections.
This product is a highly versatile tester that allows for manual specification of suitable measurement positions. As a result, this product can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and full bond inspections for small lots. The standard measurement target is thick aluminum wire bonds in the post-process of power semiconductor manufacturing. It is used in industries such as automotive, railway vehicles, industrial equipment, and aerospace, where high reliability is required. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Thick aluminum specification *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Overview Specifications (Partial)】 ■Measurement Method: Laser Periodic Heating Joint Interface Measurement Method ■Measurement Target: Aluminum Wire Joint Interface ■Equipment Safety Standards: Compliant with ISO 13849 / JIS B 9705 ■Main Unit Dimensions: 700(W)・850(D)・1390(H) ■Weight: Approximately 280kg ■Operating Environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less; no dust, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.
![[Test] Water Content (JIS K2601)](https://image.mono.ipros.com/public/product/image/26b/2001108882/IPROS05599355069231301070.png?w=280&h=280)
![[Example] I would like a dedicated measuring device, could you cooperate with me?](https://image.mono.ipros.com/public/product/image/091/2000579962/IPROS51345895489057403146.png?w=280&h=280)
![[Case Study] Drawing of Damaged Parts | Reverse Engineering](https://image.mono.ipros.com/public/product/image/2a4/2001352738/IPROS38664106368802437578.png?w=280&h=280)
