The standard measurement target is the thick aluminum wire bond in the post-process of power semiconductor manufacturing.
This product is a laser bond tester that can perform non-contact, non-destructive, and instantaneous measurements of aluminum wire bonds. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. The measurement method is a laser periodic heating joint interface measurement method. 【Features】 ■ Automatic measurement ■ Non-contact ■ Non-destructive ■ Instantaneous measurement *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Overview Specifications (Partial)】 ■Measurement Method: Laser Periodic Heating Joint Interface Measurement Method ■Measurement Target: Aluminum Wire Joint Interface ■Equipment Safety Standards: Compliant with ISO 13849 / JIS B 9705 ■Main Unit Dimensions: 800mm(W)・1000mm(D)・1500mm(H) (Provisional Specifications) ■Weight: Approximately 350kg ■Operating Environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less; dust-free, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.