Non-contact, non-destructive, and instantaneous measurement is possible! You can specify the optimal measurement position.
This product is a manual measurement laser bond tester specifically for gold or copper wire bonds. It can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and testing all bonds in small lots. The measurement method is a laser periodic heating joint interface measurement method. The device safety standards comply with ISO 13849 / JIS B 9705. For further details, please contact us. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Gold/copper fine diameter wire specification *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Overview Specifications (Partial)】 ■ Measurement Method: Laser Periodic Heating Joint Interface Measurement Method ■ Measurement Target: Wire joint interface of gold or copper ■ Equipment Safety Standards: Compliant with ISO 13849 / JIS B 9705 ■ Main Unit Dimensions: 700(W)・850(D)・1390(H) ■ Weight: Approximately 280kg ■ Operating Environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less, no dust, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.
