Standard feature for correcting to optimal measurement positions! It can be used for efficient sampling inspections and full bond inspections of medium lots.
The product is a laser bond tester capable of non-contact, non-destructive, and instantaneous measurement of gold wire bonds. It comes standard with a function to correct the measurement position to an optimal location using image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Target: Gold or copper wire bonding interfaces ■ Measurement Laser: Semiconductor laser ■ Measurement Area: 300mm (X)・300mm (Y) ■ Power Supply: Three-phase AC 200V 30A/max, requires grounding (Type D), etc. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Overview Specifications (Partial)】 ■ Laser class of the device (during normal operation): Equivalent to Class 1 ■ Safety standards of the device: Compliant with ISO 13849 / JIS B 9705 ■ External dimensions of the device: 800mm(W)・1000mm(D)・1500mm(H) (Provisional specifications) ■ Weight: Approximately 350kg (Provisional specifications) ■ Operating environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less; free of dust, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.
