We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for gold or copper wire bond magazine supply. It can be used for efficient sampling inspections and complete bond inspections of medium lots. It comes standard with a function that corrects to an optimal measurement position using image processing based on bond position information. For further details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating bonding interface measurement method ■ Measurement Targets - Gold/Copper wire bonding interface condition - Wire diameter: φ15μm to φ40μm ■ Measurement Laser: Semiconductor laser, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Overview Specifications (Partial)】 ■ Device Laser Class (during normal operation): Equivalent to Class 1 ■ Device Safety Standards: Compliant with ISO 13849 / JIS B 9705 ■ Device Main Body Dimensions: W 1300mm・D 1280mm・H 1534mm (provisional specifications) ■ Weight: Approximately 400kg (provisional specifications) ■ Operating Environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less; no dust, etc. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.
