It is possible to accommodate various package styles! Achieving easier data management is possible.
The "System650" is a universal bond tester that enables easy data management through the Windows-based software "Bond Test Manager." It is equipped with an image capture function that allows monitoring of the fracture conditions after the shear test on a screen. It supports bump shear tests on 300mm wafers. 【Features】 ■ Various tests such as wire pull, ball shear, die shear, stud pull, tweezer pull, and ball pull can be performed by exchanging modules. ■ It has high accuracy and resolution that eliminates the need for module exchange for each measurement range. ■ It can accommodate various package styles. ■ Easy data management is possible through network connectivity. *For more details, please refer to the external link or feel free to contact us.
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basic information
【Product Overview】 ■ Bond Test Manager (Software) - By using it, you can utilize excellent capabilities more broadly. - Enables real-time data analysis and efficient machine setup. - Capable of displaying min, max, average, standard deviation, Cpk, X-bar, and range of measurement results. ■ Image Capture - Allows monitoring of the situation after the shear test on a screen. - Enables accurate analysis and storage of fracture conditions. ■ 300mm Wafer Compatibility - Capable of conducting bump shear tests on 300mm wafers. *For more details, please refer to the external link or feel free to contact us.
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Company information
Hugle started in 1969 as the Far East branch of the American company Hugle Industries, a world leader in semiconductor manufacturing equipment during the early days of the semiconductor industry. Taking advantage of this first-mover advantage, it established a foundation as an independent manufacturer in 1971. Since then, in the ever-evolving world of semiconductors and flat panels such as LCDs, we have consistently developed and provided numerous innovative products ahead of the times. What we particularly want to highlight is our unwavering commitment to originality, focusing on equipment and devices related to a "pure and clean production environment," which are not commonly addressed by others and significantly impact quality. As you know, semiconductor technological innovation aims for limitless miniaturization, which inevitably requires "ultra" levels of cleanliness and purity in production and inspection environments. Therefore, we have prominently embraced the philosophy of "Clean & Quality," striving to refine our available technologies to realize a more advanced production environment.
