We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for large-diameter aluminum wire bonds with a magazine supply system. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections for medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Targets - Aluminum wire bonding interface condition - Wire diameter: φ200μm to φ400μm ■ Measurement Laser: Semiconductor laser, etc. *For more information, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Overview Specifications (Partial)】 ■ Laser class of the device (during normal operation): Equivalent to Class 1 ■ Safety standards of the device: Compliant with ISO 13849 / JIS B 9705 ■ Dimensions of the device body: W 1300mm・D 1280mm・H 1534mm (provisional specifications) ■ Weight: Approximately 400kg (provisional specifications) ■ Operating environment ・Temperature: 20–30℃ ・Humidity: 85% RH or less; free of dust, etc. *For more details, please refer to the PDF materials or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is a venture firm composed of a small elite team of engineers, based on the core technologies of ultra-fast infrared measurement and laser control. Although we are a newly established company, our key engineers have many years of experience in measuring and analyzing the radiated infrared (temperature) at laser heating points, and possess the practical technology to instantaneously analyze bonding interface processes such as wire bonding, soldering, and welding in semiconductors, using non-destructive and non-contact methods.