AEMtec GmbH List of Products and Services

AEMtec GmbH offers advanced chip direct mounting technology for optoelectronics and sensor systems. We possess various mounting technologies, including wafer processing, high-precision chip mounting, component mounting, unitization, and modularization. These technologies can be applied to various ultra-small sensor systems, wearable electronic medical devices, and optoelectronic device mounting. 【Mounting Technologies We Offer】 ■ Wafer Processing: UBM, balls, die processing ■ High-Precision Chip Mounting: Flip chip, chip on board ■ Component Mounting: Surface mounting ■ Unitization and Modularization: Providing mounted substrates in special shapes *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

Our company provides advanced chip direct mounting technology for optoelectronics and sensor systems, offering a consistent contract manufacturing development process from design, process development, prototyping to mass production. We provide advanced mounting technology for various fields including electronic medical devices, industrial equipment, automatic control equipment, data processing and information communication, as well as semiconductor manufacturing equipment. In the case of unitization, high-quality unit assembly with semi-automated processes can be achieved. 【Business Content】 ■ Product and Process Development ■ Mass Production ■ Supply Chain Management *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts