シーエスワイ Product Lineup

The device is a high-frequency pulse welding machine designed and manufactured to facilitate the preparation of multilayer printed circuit boards by improving the pad welding speed while simultaneously reducing energy costs. The operating principle of the system consists of a high-frequency pulse HEAD that acts according to the number of inner layers favorable for local reactions of the prepreg, and by performing multiple soldering along both sides of the pad, it combines the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reduced bonding time and energy savings. 【Features】 ■ High energy efficiency due to special waveforms ■ The head is almost at room temperature ■ Capable of welding high multilayer products ■ Minimal dents and burn marks *For more details, please refer to the PDF document or feel free to contact us.

• Welding Machine

We would like to introduce the impedance measuring instruments from Zemetrix (USA) that we handle, the 'ST Series'. The measurement accuracy of the "ST600" is 1%, calibrated to reference standards of 25, 50, 75, and 100 ohms, and traceable to national standards. Additionally, the "ST808" includes not one, but two TDRs in tandem to meet both current and future measurement needs. 【Features】 ■ Scan TDR technology ■ Compliant with NIST traceable standards ■ Accurate across a wide measurement range ■ Powered by high-speed USB connection ■ Single and differential measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Time-frequency measurements

We would like to introduce the "Atmospheric Pressure Inline Plasma DRY FILM Lamination Pretreatment Device" manufactured by WISE (Italy), which we handle. This product has a lower environmental impact compared to chemical treatments, contributes to reducing process costs, and improves substrate quality. The high surface energy enables good wettability and high coating adhesion. 【Features】 ■ Manufactured by WISE (Italy) ■ Lower environmental impact compared to chemical treatments ■ Reduction of process costs ■ Contributes to improved substrate quality ■ Enables high coating adhesion *For more details, please refer to the PDF document or feel free to contact us.

• Plasma surface treatment equipment

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "THP35" from I.T.C. (Germany), which we handle, is a vertical vacuum permanent resin filling device with numerous delivery records to major domestic printed circuit board manufacturers. No screen plate is required. It accommodates various board sizes. It is capable of filling holes with an aspect ratio of 40:1, and the remaining paste on the board surface after filling is 8μ. Additionally, we also offer the "Double Screen Selective Hole Filling Machine." 【THP35 Features】 ■ No screen plate required ■ Capable of 40:1 aspect ratio hole filling ■ Accommodates various board sizes ■ 8μ remaining paste on the board surface after filling *For more details, please refer to the PDF materials or feel free to contact us.

• Filling and bottling machines

This device is a high-frequency pulse welding machine designed and manufactured for multilayer boards, aimed at improving the soldering speed of packets while simultaneously reducing energy costs, thereby facilitating the preparation of multilayer printed circuit boards. The operating principle of the system involves using a thermal introduction chip that acts with variable pressure according to the number of inner layers favorable for localized reactions of the prepreg, performing multiple soldering along both sides of the packet to bond the inner layers and the prepreg. Thanks to the synergy between the high-efficiency SHE (Smart Energy Head) and the "Smart Bonding" software, excellent results can be achieved in terms of reducing bonding time and saving energy. 【Features】 ■ Bonding speed improved up to 100% ■ Reduction of bonding area to maximize panel utilization ■ Elimination of special patterns in inner layers ■ Up to 80% high energy savings ■ Realization of intelligent computer control, etc. *For more details, please download the PDF or contact us.

• Welding Machine