レジナス化成 List of Products and Services

<Features> - It is an adhesive with a high glass transition temperature and low expansion and contraction. - It is suitable for bonding areas exposed to high temperatures or where stress from expansion and contraction needs to be reduced. - Heat cycle resistance can be expected. - An environmentally friendly adhesive that complies with SDGs. - A low halogen product managed for total chlorine and total bromine content.

• Other polymer materials

BA-1880BE is an adhesive that contains over 50wt% of bio-based biomass materials. <Features> 　■ Contains over 50wt% of bio-based biomass materials 　■ Maintains practical mechanical properties and glass transition temperature 　■ Environmentally friendly adhesive in line with SDGs 　■ Customizable biomass material ratio available upon request

• Other polymer materials

UVA-6150 K1 is an adhesive that allows dual curing with UV and thermal curing. <Features> ■ Temporary curing with UV and strength development with heat ■ Areas not exposed to UV can be cured with heat ■ Quick curing for positioning with UV ■ Low-temperature curing is possible with a thermal process at 80°C

• Other polymer materials

We offer a variety of grades such as "low-temperature curing" and "flexibility"! We will propose products tailored to your needs. Additionally, we are skilled in customization, so if you have any issues with adhesives, please do not hesitate to let us know.

• plastic

"A-5410-11, H-2410-11" is an adhesive characterized by a high glass transition temperature (Tg) of 269°C, excellent heat resistance, and low linear expansion. Due to its minimal expansion and contraction, it has good heat cycle resistance, making it suitable for use in harsh temperature environments. 【Features】 ■ High Tg and low linear expansion coefficient ■ Good workability for casting applications due to low viscosity ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

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The FC Hard UV Curing Adhesive Series includes the following grades: 【Product Group (Acrylic Type)】 ■ High Shear Adhesive Grade 【UVA-6223BE】 An adhesive with high tensile shear adhesion strength as a UV curing resin. ■ Low Elasticity Grade 【UVA-6260K3】 An adhesive characterized by low elasticity, low shrinkage, and low distortion. 【Product Group (Epoxy Type)】 ■ Low Viscosity Grade 【UVA-400-9】 Among our grades, this adhesive has low viscosity and excellent workability. ■ Water and Solvent Resistant Grade 【UVA-6910】 An adhesive with good resistance to various solvents such as water and alcohol. ■ High Heat Resistance Grade 【UVA-6800 Series】 An adhesive with a Tg of over 180°C, offering a selection of different workability lines.

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The thermally conductive one-component epoxy adhesive has the following features: 【Features】 ■ It has a high thermal conductivity (3.1~3.3 W/m·k), making it suitable for thermal dissipation applications. ■ There are grades with a high glass transition temperature of 200°C. ■ It can be considered for heat generation measures and thermal interface materials (TIM). ■ Being a one-component adhesive, there is no need for weighing or mixing, resulting in good workability. ■ It excels in workability, stability, and electrical insulation. ■ Two grades with different reactivity and glass transition temperatures are available for selection.

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We would like to introduce our UV-curable acrylic marking ink, 'UVCR-175BNRLC'. It can be used as a marking agent in a ben gal red color. It excels in heat resistance, plating resistance, adhesion, and electrical insulation properties, and is suitable for screen printing. 【Features】 ■ Suitable for screen printing. ■ Appropriate for marking ink. ■ Excellent adhesion and electrical insulation properties. ■ Thick film curing is possible with the use of a dedicated heat curing agent. *For more details, please refer to the related link page or feel free to contact us.

• Other markings

The flexible epoxy adhesive series includes the following grades: 【Product Range】 ■ White Grade [A-8511WLC] ■ Black Low-Temperature Curing Grade [A-8530BKLC] We have improved the hardness changes during thermal history, which were a challenge with conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. Both are one-component, thermosetting adhesives that are low-halogen compliant, offering good workability and can be used for bonding various shapes of components. They are suitable for applications where silicone cannot be used due to siloxane, as well as for bonding materials and structures that require stress relief.

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The epoxy adhesive series for difficult-to-bond materials includes the following grades: 【Product Group】 ■ Liquid Crystal Polymer (LCP) Grade 【A-7373BKLC】 ■ PA9T Grade 【A-2230BK】 Both are one-component thermosetting adhesives with good workability, suitable for bonding various shapes of components.

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The high heat-resistant epoxy adhesive series includes the following grades: 【Product Group (Thermosetting)】 ■ High Strength Grade 【A-1806BKLC】 This adhesive achieves both high shear adhesion and high peel strength, while also maintaining good adhesion at elevated temperatures. ■ Ultra High Tg Grade 【A-1809BKLC】 This grade has the highest level of Tg in our lineup and maintains adhesion even at elevated temperatures. 【Product Group (UV Curing)】 ■ 【UVA-6800 Series】 This adhesive series features a Tg of over 180°C and offers a selection of adhesives with different workability (K15, K16).

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The RKB series is a product that uniformly disperses core-shell rubber particles in epoxy resin and solvents, allowing it to maintain heat resistance without the typical decline seen in conventional flexible resins, thereby imparting toughness and flexibility to the cured material. 【Features】 ■ It is possible to achieve both toughness and heat resistance. ■ It enhances impact resistance, heat cycle resistance, and adhesion. ■ It has a low impurity content, making it suitable for electrical and electronic applications. ■ There is a solvent-dispersed type available to improve the toughness of films. ■ It is also possible to disperse rubber particles and other fillers in specified resins or solvents.

• plastic

The PB series adhesive for civil engineering and construction materials, "PB Set," has the following features: 【Features】 ■ It is a room temperature curing epoxy mortar suitable for pouring and filling holes, consisting of a two-component system plus silica sand. ■ It strongly adheres to concrete, asphalt, and metals. ■ It excels in adhesion, water resistance, oil resistance, and impact resistance. ■ It has stable curing with minimal shrinkage. ■ There are different package sizes available: PB Set (1.4kg) and PB-07 (7kg), allowing for selection based on usage amount. Please download and refer to the catalog and instruction manual from the related links.

• plastic

The PB series adhesive for civil engineering and construction materials, 'PB-L', has the following features: 【Features】 ■ It is a two-component, room temperature curing epoxy adhesive that excels in workability and is suitable for flat bonding. ■ It strongly adheres to concrete, asphalt, and metals. ■ It has excellent adhesion, water resistance, oil resistance, and impact resistance. ■ It cures stably with minimal shrinkage. ■ It is available in two types with different curing properties: S (for summer) and W (for winter), allowing for seasonal use. ■ Available in 1kg and 10kg sets, allowing for selection based on usage amount. Please download and refer to the catalog and instruction manual from the related links.

• plastic

The high-strength one-component epoxy adhesive "A-180~BKLC Series" is available in the following grades. 【Product Range】 ■ Standard high-strength grade [A-1805BKLC] ■ High peel strength grade [A-1804BKLC] ■ High toughness grade [A-1807BKLC] ■ High Tg grade [A-1806BKLC・A-1809BKLC] 【Features】 ■ Capable of achieving both high shear adhesion and high peel strength ■ Good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) ■ Suitable for bonding areas where stress relief is required ■ Improved grade with enhanced peel adhesion and adhesion to platings from [A-1805BKLC] ■ Low halogen compliant *For more details, please refer to the PDF document or feel free to contact us.

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The flexible liquid epoxy adhesive "UD S 70" has the following features: 【Features】 ■ The cured product has excellent flexibility. ■ It is suitable for bonding areas where stress has been relieved.

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The water-resistant and solvent-resistant UV-curable epoxy adhesive 'UVA-6910' has the following features: [Features] ■ A cured product with a balanced resistance to water and solvents is obtained. ■ A cured product that is less likely to swell or soften due to immersion in various solvents is obtained.

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High heat resistance and high gloss epoxy ink has the following characteristics: 【Features】 ■ Screen printing is possible. ■ It has high heat resistance and shows minimal changes in properties even under humid conditions. ■ It has a high surface gloss. ■ It has excellent adhesion to ceramics and glass. ■ It is a low halogen product with controlled total chlorine and total bromine levels.

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The high heat-resistant one-component thermosetting epoxy resin ink "C-8888-7" has the following features: 【Features】 ■ Screen printing is possible. ■ It has high heat resistance. ■ It has excellent adhesion to ceramics and glass. ■ It is a low-halogen product with controlled total chlorine and total bromine content.

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The high heat-resistant, low halogen UV-curable epoxy adhesive UVA-6800 series has the following features: 【Features】 ■ A highly heat-resistant cured product can be obtained with UV irradiation alone. ■ Excellent adhesion to glass and other materials. ■ A lineup with different workability can be selected according to your application. ■ A low halogen product managed for total chlorine and total bromine content.

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The thermally conductive adhesive [developed product] has the following features: [Features] ■ It is a one-component adhesive, making it easy to work with. ■ It has a high thermal conductivity.

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The high heat-resistant ultraviolet curing adhesive "UVA-6219" has the following features: 【Features】 ■ Can be cured with ultraviolet light. ■ Can be cured in a short time. ■ Has a high tanδ peak temperature.

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The low-temperature fast-curing epoxy adhesive "A-2201BKLC" has the following features: 【Features】 ■ Can cure at low temperatures of 70-80°C. ■ Can cure in a short time of 30-60 minutes. ■ Compliant with low halogen standards.

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The adhesive for electrical and electronic components, FC Hard, is a highly reliable adhesive that can be proposed according to various adhesive materials and required characteristics. FC Hard offers products that address the following concerns and requests regarding adhesives: ■ I want an adhesive with high shear and high peel strength. ■ I want to use a heat-resistant adhesive. ■ I want to bond materials with low heat resistance. ■ I want to prevent material damage when bonding dissimilar materials and adhesive peeling at temperatures above 150°C. ■ I want a high Tg UV adhesive. ■ I want an adhesive that can be temporarily fixed with ultraviolet light during the process and then fully cured with heat. You can download a list of physical properties and a map categorized by features. In addition to the products listed in the table, we also offer product introductions and customization to meet your required characteristics. If you have any other concerns or issues regarding adhesives, please feel free to contact us.

• Other polymer materials

The high transparency rubber-modified epoxy resin "Reginas Bond RKB-5810" has the following features: [Features] ■ It can impart crack resistance to alicyclic epoxy resin formulations. ■ It does not hinder the transparency and heat resistance of alicyclic epoxy resin formulations. ■ It alleviates the stress generated during heat cycle testing. ■ It allows for thixotropic properties without compromising the curing ability of UV-curable resins. *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials

The flexible epoxy adhesive "A-8511WLC" has the following features: 【Features】 ■ It improves the hardness changes during thermal history, which were a challenge for conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. ■ It has low viscosity and excellent workability. ■ It is also compliant with low halogen standards.

• Composite Materials

We would like to introduce our LCP-compatible epoxy adhesive, 'A-7373BKLC.' It can be used for adhesion to liquid crystal polymers (LCP) and has excellent adhesive properties. It is also compliant with low halogen requirements, with a viscosity of 62,000 mPa.s and a gel time of 80 seconds. 【Features】 ■ Excellent adhesion to liquid crystal polymers (LCP) ■ Compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us.

• glue

The A-1809BKLC is a high-strength, high-heat epoxy adhesive that is compliant with low halogen standards. It improves the adhesive performance changes during thermal history, which has been a challenge with conventional heat-resistant epoxy adhesives, achieving both adhesion and reliability during thermal history. It has good adhesion to various types of plating (Sn, Zn, Ni) that are considered difficult to bond, making it suitable for bonding components and structures that require strong adhesion and high heat resistance. 【Features】 ■ Improves adhesive performance changes during thermal history, achieving both adhesion and reliability ■ Highest level of high Tg (compared to our conventional products) ■ Good adhesion to various types of plating (Sn, Zn, Ni) that are considered difficult to bond ■ Compliant with low halogen standards *For more details, please refer to the PDF document or feel free to contact us.

• glue

The A-8530BKLC is a flexible, low-temperature curing one-component epoxy adhesive that can cure at low temperatures. It improves the hardness changes during thermal history, which were a challenge for conventional flexible epoxy adhesives, achieving both flexibility and reliability during thermal history. It is suitable for applications where silicone cannot be used due to siloxane, as well as for bonding components and structures that require stress relief. 【Features】 - Improves hardness changes during thermal history, achieving both flexibility and reliability during thermal history - Can cure at low temperatures - Low viscosity for excellent workability - Also compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us. Epoxy resin, thermosetting, low temperature, curing, low viscosity, flexible, stress relief, electrical, electrical materials, adhesive, small quantity, custom, customization, electronic components, low halogen, bonding, adhesive.

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We would like to introduce our nylon-compatible epoxy adhesive 'A-2230BK'. The gel time is 70 seconds, and the tensile shear adhesive strength is 600 PA9T N/cm². It has low viscosity, excellent workability, and good adhesion to nylon (such as PA9T). 【Features】 ■ Good adhesion to nylon (such as PA9T) ■ Excellent workability with low viscosity *For more details, please refer to the PDF document or feel free to contact us.

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The "A-1806BKLC" is a high Tg grade, one-component thermosetting high-strength and high Tg epoxy adhesive that has been improved from the "A-1805BKLC." It possesses high shear and peel adhesion strength, as well as moderate heat resistance, maintaining adhesion even around 170°C. It has good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) and is also compliant with low halogen requirements. 【Features】 ■ High shear and peel adhesion strength ■ Good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) ■ Moderate heat resistance, maintaining adhesion around 170°C ■ Improved high Tg grade from "A-1805BKLC" ■ Compliant with low halogen requirements *For more details, please refer to the PDF document or feel free to contact us.

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The A-1805BKLC is a one-component, heat-curing high-strength epoxy adhesive that is also compatible with low halogen content. It has high shear and high peel adhesion strength, demonstrating good adhesion to various difficult-to-bond platings (Sn, Zn, Ni). It possesses moderate heat resistance (Tg: 140°C) and can maintain stable adhesion strength at elevated temperatures. 【Features】 - High shear and high peel adhesion strength - Good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) - Maintains adhesion strength up to around 120°C - Compatible with low halogen content *For more details, please refer to the PDF document or feel free to contact us. Epoxy resin, heat curing, high strength, high shear, high peel, adhesion strength, plating, Sn, Zn, Ni, tin, zinc, nickel, 120°C, high heat resistance, thermal adhesion strength, one-component, electrical, electrical materials, adhesive, small quantity, custom, customization, electronic components, low halogen, bonding, adhesive.

• glue

The "A-1804BKLC" is a one-component, heat-curing high-strength epoxy adhesive that enables the coexistence of high shear adhesion and high peel strength, addressing the challenges of conventional epoxy resins. It is an improved grade that enhances peel adhesion and adhesion to plating compared to "A-1805BKLC," and it is compliant with low halogen standards. It is also suitable for bonding areas where stress relief is needed and shows good adhesion to various difficult-to-bond platings (Sn, Zn, Ni). 【Features】 ■ Enables the coexistence of high shear adhesion and high peel strength ■ Good adhesion to various difficult-to-bond platings (Sn, Zn, Ni) ■ Suitable for bonding areas where stress relief is needed ■ Improved grade that enhances peel adhesion and adhesion to plating compared to "A-1805BKLC" ■ Compliant with low halogen standards *For more details, please refer to the PDF document or feel free to contact us.

• glue

The "C-886GLC" is a resin separation suppressing epoxy ink that addresses the issues of traditional one-component curing epoxy inks, specifically the suppression of resin separation on copper plates. It has low viscosity, excellent workability, and is compliant with low halogen standards. It is suitable for printing on materials where resin separation is likely to occur and can also be used as a protective film for electronic components. 【Features】 ■ Suppresses resin separation on copper plates, which was an issue with traditional one-component curing epoxy inks ■ Low viscosity with excellent workability ■ Screen printing is possible ■ Compliant with low halogen standards *For more details, please refer to the PDF document or feel free to contact us.

• Ink/Toner

"UVA-6260K3" is a low shrinkage, low elasticity UV-curable acrylic adhesive that cures quickly with short exposure to light. It has adhesion properties to materials such as glass, PPS, and polycarbonate, and achieves low shrinkage (3.8%), low elastic modulus, and low distortion in the cured product. It is suitable for bonding in areas where heat cannot be applied and stress relief is needed, as well as for fixing and bonding optical components. 【Features】 ■ Cures quickly with short exposure to light ■ Produces a highly extensible cured product ■ Achieves low shrinkage (3.8%), low elastic modulus, and low distortion in the cured product ■ Has adhesion properties to glass, PPS, and polycarbonate *For more details, please refer to the related link page or feel free to contact us.

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"UVA-400-9" is a UV-curable epoxy adhesive with low viscosity that has excellent penetration even in narrow gaps. It achieves high strength even in thin films and cures quickly with short exposure. It is suitable for fixing and bonding optical components, as well as for pouring and bonding in narrow spaces between materials. [Features] - Cures quickly with short exposure - Excellent penetration in narrow gaps due to low viscosity - Achieves high strength even in thin films *For more details, please refer to the related link page or feel free to contact us.

• glue

We would like to introduce our UV-curable acrylic marking ink, 'UVCR-185WLC'. It can be used as a white marking agent. It excels in heat resistance, plating resistance, adhesion, and electrical insulation properties, and is suitable for screen printing. 【Features】 ■ Suitable for screen printing ■ Excellent heat resistance and plating resistance ■ Excellent adhesion and electrical insulation properties *For more details, please refer to the related link page or feel free to contact us.

• Other markings

We would like to introduce our heat-curing epoxy adhesive, 'UVA-6781K5'. It has low viscosity and excellent workability. It exhibits a high glass transition temperature (Tg) through a two-stage curing process using UV light and heat. It is suitable for pouring and bonding in narrow gaps between components, and can be used in assembly processes such as temporary fixing with UV light and final curing with heat. 【Features】 ■ Low viscosity and excellent workability ■ High glass transition temperature (Tg) achieved through two-stage curing with UV light and heat *For more details, please refer to the related link page or feel free to contact us.

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