JFE商事エレクトロニクス Product Lineup

The "MR2535H2T" manufactured by Meibun Technica is a high-performance turntable circuit board cutting machine capable of high-speed processing. Since it allows for the setup of the next workpiece in parallel during circuit board processing, it eliminates waiting time during board exchanges. Additionally, it shortens cycle times, thereby improving productivity without increasing the number of operators. With the turntable positioned at the front, it allows for robot access and can be applied to general inline specifications. 【Features】 ■ Equipped with two tables for automatic turn setup that allows for parallel preparation ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time by setting Z-axis height for each router location ■ Improved operational efficiency by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector achieves compact device size *For more details, please download the PDF or contact us. ★ Free seminar here▽ 　http://www.mtco-web.co.jp/products/web_seminar.html

The "MR2535H2" is a substrate cutting machine that achieves high-efficiency division and low running costs for a large number of small, complex-shaped substrates. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. Leveraging the experience cultivated at the Mitsubishi Electric Nagoya Works, we support your company's productivity and quality improvement! 【Features】 ■ Achieves high rigidity, high quality, and low running costs! ■ Cuts unnecessary parts of complex shapes of printed circuit boards after mounting using a router bit. ■ Improves setup efficiency by widening the opening width of the equipment's access door. ■ Realizes space-saving by integrating a dust collector into the bottom of the equipment. ■ Significantly improves productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models). ■ Allows for Z-axis position settings for each cutting point, enabling takt time reduction. ■ Supports image teaching functions, allowing for quick setting of cutting points for various types of substrates. * Inline and turntable types are also available. * For more details, please refer to the PDF document or feel free to contact us.

Automatically cuts various printed circuit boards inline while maintaining the manufacturing line. This achieves labor reduction by eliminating the need to constantly have an operator at the board cutting machine. 【Features】 ■ Monitors the usage distance of the bits and automatically replaces them to improve operational efficiency. ■ Waste boards are automatically collected into a waste board box located at the bottom of the device. ■ Selecting a twin spindle allows for simultaneous cutting, achieving high productivity. *For more details, please refer to the PDF document or feel free to contact us.

【Features】 - Automates the process from substrate supply to substrate cutting, palletizing onto the discharge tray, and substrate discharge. - Uses a multi-joint robot for substrate discharge after cutting, allowing for the setting of substrate placement positions within the discharge tray, which is effective for substrate positioning in the next automation process. - The automatic turn system with two tables enables simultaneous retrieval of cut substrates and setting of the next substrate while cutting, reducing the waiting time of the cutting machine and shortening the cycle time. * For more details, please refer to the PDF document or feel free to contact us.

In the LED lighting industry, there is a demand for the efficient production of high-quality products. In particular, the occurrence of defective products during the substrate splitting process leads to a decrease in yield and an increase in costs. The MR2535H2T eliminates waiting time during substrate exchange and shortens cycle time, thereby improving productivity. This contributes to yield improvement without increasing the number of operators. 【Usage Scenarios】 - Substrate splitting process for LED lighting - Small-batch production of various types - Application in inline production 【Benefits of Implementation】 - Increased productivity through reduced cycle time - Improved yield through reduced defects - Optimization of the number of operators