JFE商事エレクトロニクス List of Products and Services

The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.

The prototype research device "TWPm Series" has the following features: ■ Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate small quantities of various types and fluctuations in production volume - Enhanced quality and yield through sheet processing (realization of precise processing without cross-contamination and improved uniformity and control within the plane) - Unique jet lift-off mechanism with high peeling performance - Achieved reduced footprint through compact size - Maintenance-free structure from the back - Functions inherited from conventional products - Dedicated device for one chamber * There is also a mass production "TWP Series." https://www.ipros.jp/product/detail/2000745622 * For more details, please refer to the PDF document or feel free to contact us.

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. We offer a variety of devices, including wafer (RCA) cleaning equipment, precision parts cleaning equipment, ingot cleaning equipment, etching equipment, and IPA dryer equipment. *For more details, please refer to the PDF materials or feel free to contact us.

At Takeda Industrial, we utilize clean technology, transport/control technology, and other methods backed by years of experience to design and manufacture optimal equipment for our customers with our total engineering capabilities. Using various engineering tools, including 3D CAD, we deliver space-saving and user-friendly equipment. The 'TID Series' device cleans and dries wafers in an IPA (isopropyl alcohol) vapor atmosphere and is equipped with an IPA quality control system and various safety systems. ■ Features - Clean drying using high-purity IPA is possible regardless of the material or shape, including devices, wafers, glass, and components. - Comprehensive safety measures including gas monitoring, N2 purging systems, automatic fire extinguishing systems, and emergency water injection systems in case of emergencies. - Clean drying using high-purity IPA is possible regardless of the material or shape. - The use of all stainless steel eliminates the risk of breakage. - Divided into paper zones and dry zones to reduce the use of IPA. *For more details, please refer to the PDF materials or feel free to contact us.

The "TFC Series" uses jets to remove tape adhesive and fingerprints attached to the dicing frame used in the wafer cutting (dicing) process. Since there are no contact items like brushes, there is no degradation of cleaning performance due to secondary adhesion of adhesives. ■ Features - Non-contact cleaning mechanism that employs a unique jet nozzle with high cleaning performance → Since it does not use brush cleaning or cloths like wipes, there is no decrease in cleaning power due to clogging or re-adhesion. - Chemical cleaning method using organic solvents - High recovery rate of cleaning solution achieved through a vertical rotating mechanism - Compact size of 1,000mm × 1,500mm × 2,000mm - UV irradiation unit and tape removal unit can be installed (optional) *For more details, please refer to the PDF document or feel free to contact us.