Takeda Industrial's mass production sheet-type wet processing equipment 'TWP Series'
Mass production sheet-type wet processing equipment "TWP Series"
A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!
The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.
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basic information
■Basic Specifications - Material: Si, compounds (GaAs, InP, Sapphire, SiC, GaN), etc. - Size: 2, 3, 4, 5, 6, 8 inches (compatible with 2 sizes) - Scrubbing treatment: High-pressure jet / 2-fluid jet / ultrasonic shower, etc. - Number of processing chambers: 2, 4 chambers - Processing liquids: Organic stripping solution, rinse solution, pure water - Chemical supply: Chemical circulation recovery, filtration, and temperature control system - Work transport: Double-arm SCARA robot - Spin chuck: Vacuum chuck *Mechanical chuck available as an option - Equipment dimensions (WxDxH): 1,900x2,700x2,200mm (2 chambers) 1,900x4,100x2,200mm (4 chambers) - Safety features including automatic fire extinguishing system and explosion-proof glass - Automatic cleaning function inside the chamber - Various nozzle specifications can be changed - Backside wraparound prevention function *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
Power devices, high-frequency devices, optical devices (such as LEDs), SAW devices, MEMS, etc.
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Company information
In this department, we provide total solutions for assembly by offering a diverse range of products and high technical capabilities to meet the challenges of our customers, who are globally expanding primarily in China, Thailand, Malaysia, and Vietnam. We focus on excellent assembly equipment from Panasonic Connect (formerly Panasonic Smart Factory Solutions) to support high performance, miniaturization, and lightweight electronics products, as well as peripheral equipment, technical support, and maintenance. Please take a look at our introduction video. https://www.youtube.com/watch?v=efdEd2BVT-A