三菱ケミカル List of Products and Services

Phenol CF-SMC is a composite material made of carbon fibers (short fibers) and phenolic resin. Phenolic resin has high heat resistance (over 300°C) and can be used in high-temperature environments that conventional CFRP (epoxy resin) cannot handle. It also meets the fire resistance evaluation standards for railway applications. **Benefits of using Phenol CF-SMC:** - Higher heat resistance compared to epoxy resin (over 300°C), allowing for use in high-temperature environments. - Lightweight due to low specific gravity, enabling weight reduction of aluminum and SUS. - Allows for lightweight design of parts requiring fire resistance. - Capable of molding complex product shapes through pressing. **Common needs:** - Desire to reduce the weight of aluminum or SUS parts used in high-temperature environments. - Need to lighten parts that require fire resistance. **Expected applications of Phenol CF-SMC:** Components for aircraft, automobiles, railway vehicles, machine tools, thermal protection materials, etc. **What Mitsubishi Chemical can offer:** In addition to the manufacturing and sales of carbon fibers and prepregs, we can also handle molding, processing, assembly, coating, and inspection of these materials for delivery. *For more details, please refer to the PDF document or feel free to contact us.*

Phenol CFRP is a composite material made of carbon fibers (long fibers) and phenolic resin. Phenolic resin has high heat resistance (over 300°C) and can be used in high-temperature environments that conventional CFRP (epoxy resin) cannot handle. **Benefits of Using Phenol CFRP** - Higher heat resistance compared to epoxy resin (over 300°C), allowing for use in high-temperature environments. - High specific modulus (modulus of elasticity divided by weight), enabling lightweight parts, thin-walled designs, and reduced deflection. - Excellent vibration damping properties, allowing for high-speed operation. **Common Needs** - Want to reduce the weight of ceramic parts. - Considering cost reduction for polyimide-based material parts. - Want to make products thinner while minimizing deflection. - Due to increased weight of the workpiece, want to adopt materials with a higher Young's modulus. **Expected Applications of Phenol CFRP** Parts for FPD manufacturing equipment, semiconductor manufacturing equipment, medical device parts, etc. **What Mitsubishi Chemical Can Do** In addition to manufacturing and selling carbon fibers and prepregs, we can also mold, process, assemble, coat, and inspect these materials for delivery. *For more details, please refer to the PDF materials or feel free to contact us.*

The demand for lightweight materials is increasing in mobility applications such as aircraft and automobiles, as well as in industrial machinery applications that require responses to the sophistication and complexity of manufacturing processes along with efficiency improvements. The use of CFRP, which combines lightness and strength, is expected to advance further in the future. Mitsubishi Chemical has developed a CFRP with high heat resistance that maintains its properties with minimal degradation even at 300°C by using phenolic resin as the base resin. This CFRP, which uses phenolic resin, not only possesses the high thermal conductivity, high rigidity, and lightweight characteristics typical of CFRP based on epoxy resin but also offers high heat resistance, enabling solutions to customer challenges that have been difficult to address until now. [Contents] ■ Introduction ■ Applications of Mitsubishi Chemical's CFRP ■ High heat-resistant CFRP using phenolic resin ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

Mitsubishi Chemical Corporation has developed a carbon fiber reinforced plastic (CFRP) that balances lightweight properties, rigidity, and high heat resistance. This developed product achieves high heat resistance that does not degrade its physical properties even at 300°C by using phenolic resin as the base resin. By adding high heat resistance to its characteristic high thermal conductivity, high rigidity, and lightweight properties, it becomes possible to provide solutions to customer challenges that have been difficult to resolve until now. 【Features】 ■ Uses phenolic resin as the base resin ■ Achieves high heat resistance that does not degrade its physical properties even at 300°C ■ Adds high heat resistance in addition to high thermal conductivity, high rigidity, and lightweight properties ■ Capable of providing solutions to customer challenges that have been difficult to resolve ■ Already confirmed adoption by some customers *For more details, please refer to the PDF document or feel free to contact us.