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Silver nanoparticles that can be sintered at low temperature and low pressure / without applied pressure.
Achieve a dense silver sintering layer at low temperature/without pressure! A lineup of silver nanoparticles ranging from nano to sub-micron diameters. We introduce Osaka Soda Co., Ltd.'s new product, 'Silver Nanoparticles.' By applying silver nanoparticle synthesis technology, we have developed a lineup of silver nanoparticles with particle sizes not available in conventional commercial products while maintaining high low-temperature sinterability. As an application example, by combining with commercially available silver particles for a densely packed design, we can achieve high reliability, bonding strength, and conductivity with a dense and low-shrinkage sintered bonding layer even under low-temperature/pressure-free bonding conditions. **Features of silver sintering layers with added silver nanoparticles:** - High thermal conductivity - Low electrical resistance - High bonding strength - Improved thermal reliability