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The "Mirror Mezz Connector" is a hermaphroditic mezzanine connector that achieves excellent signal integrity (SI) and high-speed data transmission performance. It addresses the increasing data transfer requirements in high-density applications such as telecommunications, networking, and Open Compute Project (OCP) compliant systems. The self-mating hermaphroditic design simplifies bill of materials (BOM) and inventory management, while also reducing tooling requirements. 【Features】 ■ Achieves high-speed data transfer rates for applications ■ Cost reduction through hermaphroditic design ■ Shortened lead times and simplified product matrix ■ Uses OCP recommended specification 15×11 column pins to enhance design flexibility ■ Maximizes PCB footprint and alleviates design challenges *For more details, please download the PDF or feel free to contact us.

The "Mirror Mezz Pro Connector" is a product that provides 112Gbps performance with the OCP recommended form factor. Its robust, stab-less contact interface and blind mating capability facilitate assembly, allowing for three stack height options with up to 270 differential pairs in a high-density layout. Recommended by OCP for 15x11 mezzanine board-to-board interconnect applications, it ensures interoperability within OCP standard systems. 【Features】 ■ Achieves reliable high-speed data transfer rates ■ Enhances design flexibility with 15x11 OCP-compliant design ■ Provides relaxed tolerances and architectural flexibility through flexible cable links *For more details, please download the PDF or feel free to contact us.

The "Mirror Mezz Enhanced Connector" is a product that meets challenges with a maximum data rate of 224Gbps PAM-4 for applications, as the use of AI drives accelerates. It features high signal integrity (SI), a robust structure, and pharmaceutical design, supporting design flexibility and system reliability. The precise arrangement of wide ground pins and electrically adjusted signal contacts improves SI and helps balance the electric field. 【Features】 ■ Provides high-speed data transfer rates for applications ■ Maximizes high-speed transmission processing performance and clean routing away from the connector's footprint ■ Allows for seamless upgrades to 224Gbps ■ Optimizes PCB real estate with higher differential pair (DP) density *For more details, please download the PDF or feel free to contact us.