レスター Product Lineup

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

Lester Corporation will be exhibiting at the "JANOG57 Meeting in Osaka" held at the Congrès Convention Center in Grand Front Osaka. This meeting is a forum for not only network operators and administrators but also a diverse range of participants to gather and discuss. We plan to showcase "Busbar," "Liquid-cooled demo units," "Expanded Beam Optical (EBO) connectors," and "other optical connectivity solutions." We sincerely look forward to your visit. 【Exhibited Items】 ■ Busbar ■ Liquid-cooled demo units ■ Expanded Beam Optical (EBO) connectors ■ Other optical connectivity solutions - High-density connections for data center AI applications *For more details, please download the PDF or feel free to contact us.

We would like to introduce advanced technologies for the rapidly expanding data center market in a webinar hosted by Molex. ■ Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers In this webinar, we will provide a clear explanation while comparing the evolution of technology and the latest solutions, including: - High-speed connection technologies supporting 112Gbps/224Gbps - High-density mezzanine connections for AI-oriented GPUs - Power connections for high current applications and heat dissipation products. This content will serve as hints for product selection and problem-solving for those involved in the design and development of data center equipment. We encourage you to participate in this opportunity. 【Event Overview】 ■ Date: April 22, 2026 (Wednesday) 15:00 - 16:00 ■ Format: Zoom Webinar ■ Cost: Free (Pre-registration required) ■ Registration Deadline: April 21, 2026 (Tuesday) by 12:00 *For more details, please refer to the related links or feel free to contact us. A catalog of the lineup products is also available for download.