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We would like to introduce a case where our "Desktop Color Label Printer" was implemented in the chemical industry, successfully addressing label challenges arising from regulatory changes through the realization of printing extremely small text. With changes in regulations such as CLP, the amount of text information (multilingual) required has increased, leading to challenges such as the need for fine printing in limited label space. Our product can print extremely small text of about 2pt with high-resolution printing at 1200dpi. Additionally, we offer free sample printing and free loan of demo units. [Challenges] - The amount of text information (multilingual) required increases with each regulatory change such as CLP, necessitating fine printing in limited label space. - There is a possibility that alcohol-based chemicals, such as GHS labels, may come into contact with the labels, and it is necessary to freeze store the containers. - It is necessary to maintain inventory of pre-printed labels with various colors for color-coding labels for each shipping destination. *For more details, please refer to the PDF document or feel free to contact us.
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We would like to introduce a case where our "Desktop Color Label Printer" was implemented in the precision machinery industry, enabling high-speed printing of color labels and white text printing. There were challenges such as a high volume of prints affecting productivity depending on printing speed, and the need for fine text printing on a limited printing area of label sizes. With the introduction of our product, the durability of the main unit can withstand nearly 10,000 prints per day, and it achieved faster printing during continuous printing compared to existing inkjet printers. Additionally, we offer free sample printing and free demo unit rentals. [Challenges] - A high volume of prints affects productivity depending on printing speed. - Fine text printing is required on a limited printing area of label sizes. - There are cases where printing on colored labels is necessary, requiring white text. *For more details, please refer to the PDF document or feel free to contact us.
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We would like to introduce a case study on the introduction of our "Desktop Color Label Printer" in the food manufacturing industry, which allows for the immediate creation of original color labels in the necessary quantities whenever needed, even for small lots and a wide variety of products. There were challenges such as high demand for small lots and a wide variety of products leading to increased costs for outsourced labeling, the need for labels to be water-resistant against frost in low-temperature environments like refrigeration, and abrasion resistance during transportation. Our product enables on-demand, immediate creation of the necessary quantities starting from just one piece for original products, promotional items for events, etc. Compared to inkjet printing, it offers improved water resistance and abrasion resistance, making it suitable for the environment of food display shelves. [Challenges] - High demand for small lots and a wide variety of products leading to increased costs for outsourced labeling - Labels need to be water-resistant against frost in low-temperature environments like refrigeration and abrasion-resistant during transportation - Frequent label changes required due to legal regulations (Food Labeling Act) *For more details, please refer to the PDF materials or feel free to contact us.
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The 『Pro1050』 is a color label printer that can reproduce colors corresponding to W (white) that cannot be achieved with CMYK. It has high opacity with white toner, allowing for the in-house production of stylish labels in small quantities. It enables printing on various media such as colored labels and transparent films. If you want to expand your design options using colored paper or film labels, and are facing issues with long lead times due to outsourcing or unnecessary costs from discarding leftover labels, this product will solve your problems. 【Features】 ■ Sample distribution ■ Demonstrations available ■ Excellent environmental resistance (waterproof and alcohol-resistant) due to toner technology ■ Supports W (white) that cannot be reproduced with CMYK ■ Compatible with transparent film labels and colored labels ■ Capable of reflecting white on objects such as bottles and aluminum bags *For more details, please download the PDF or feel free to contact us.
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We would like to introduce a case where our "Desktop Color Label Printer" was implemented in the manufacturing industry, improving work efficiency through color-coded labels for consignment goods and inventory management. There were challenges such as manually color-coding labels with markers for consignment goods and inventory management, the high threshold for obtaining acceptance approval from delivery destinations, and the difficulty in easily changing existing label materials. With the introduction of our product, the color-coding of labels enhanced visibility for first-in-first-out processes and expiration dates in consignment goods and inventory management, leading to improved work efficiency. Additionally, we offer free sample printing and free demo unit rentals. [Challenges] ■ Manual color-coding of labels with markers for consignment goods and inventory management ■ High threshold for obtaining acceptance approval from delivery destinations, making it difficult to easily change existing label materials ■ Concerns about print peeling due to friction between packages during transportation *For more details, please refer to the PDF document or feel free to contact us.
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We would like to introduce our "Assembly Support System" <Projection Assembly System>. With work instructions projected by a projector, we achieve zero mistakes (poka-yoke). It enables the visualization of work processes through data utilization. It addresses various challenges in current operations, such as reducing the time required for set changes and meal preparation, preventing work errors, and minimizing travel distances and space usage. Please feel free to contact us if you have any inquiries. 【Features】 ■ Poka-yoke measures ■ Quality improvement ■ Increased productivity ■ Reduced training time ■ Skill transfer from experienced workers *For more details, please refer to the PDF document or feel free to contact us.
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The "Assembly Support System (Projection Assembly System)" visualizes improvement points from digital data and realizes QCD (Quality Improvement and Production Efficiency Improvement) in the manufacturing field. By providing clear part retrieval instructions and projecting work instructions via a projector, it achieves "zero work errors." It clarifies bottleneck tasks and processes, extracts waste from work videos, and enables visualization of problem areas. 【Features】 ■ "Zero work errors" - Clear part retrieval instructions and projection of work instructions via a projector ■ Data recording of work performance - Saving part retrieval results and work videos ■ Visualization of problem areas - Clarifying bottleneck tasks and processes, extracting waste from work videos *For more details, please refer to the PDF document or feel free to contact us.
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This document introduces the "Projection Assembly System." It is a system that supports the improvement of QCD (Quality, Cost, Delivery) in manufacturing sites, enhancing both quality and production efficiency. It addresses challenges in current operations and improves production and work efficiency. It includes information on the "desired state and expected effects" as well as the system configuration. Please make use of this information when considering implementation. [Included Content (Partial)] ■ Overview of the system ■ Usage image ■ Scope of provision ■ Desired state and expected effects ■ System configuration (work shelf image, IT equipment configuration) *For more details, please refer to the PDF document or feel free to contact us.
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This product is a development platform for Zynq UltraScale+ MPSoC. It enables the development of autonomous driving and autonomous control robots through the implementation of object recognition, spatial awareness, and pathfinding algorithms. By referring to the included reference design, you can build a video design framework and utilize it for multi-camera system development and application development. 【Features】 ■ High-performance development platform/hardware ■ Flexible platform development ■ Efficient development environment *For more details, please refer to the PDF materials or feel free to contact us.
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We would like to introduce our "Assembly Support System" <Projection Assembly System>. With work instructions projected, we achieve zero mistakes. Data utilization allows for the visualization of work processes. We solve various issues in current operations, such as reducing the time for set changes and meal preparation, preventing work errors, and minimizing movement distances and space. Please feel free to contact us if you have any inquiries. 【Features】 - Visually navigates work procedures and mistakes to achieve mistake-proofing. - Visualization and data recording of work history to improve quality. - Enables the transfer of skills from experienced workers and reduces training time for newcomers and foreign workers. *For more details, please refer to the PDF materials or feel free to contact us.
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The "PLAVI Pro1050/1040" is a desktop color LED label printer that uses a toner system. It can print in color on plain labels such as ordinary paper, film, and synthetic paper, allowing for the creation of waterproof color labels at a low cost. 【Do you have any of these concerns?】 ◆ Cost and print quality are strict when in-house label printing ◆ Issues with labels peeling off or rubbing (water and weather resistance) ◆ Print clarity is poor, leading to difficulties in barcode scanning It excels in weather resistance, abrasion resistance, and alcohol resistance, enabling the production of "the necessary quantity at the necessary time" while keeping costs down. <※ We are currently offering free sample printing using customer data/media and free demo machine rentals.> If you would like to see the actual product or try it out in a production environment, please take this opportunity to consult us through "Contact Us." ★ For product details, please view the catalog from "PDF Download."
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We will be holding an online seminar aimed at companies considering outsourcing the design, manufacturing, and maintenance of medical devices. We will support our customers' entry into the medical market from a manufacturing perspective, as many wish to enter the medical device market using their own technology but face hurdles due to a lack of knowledge about regulations and quality management systems (QMS) for medical device manufacturing. We will introduce case studies to facilitate early entry. We will present our "comprehensive services," which provide one-stop solutions for design and reliability evaluation, as well as examples of DMS usage for medical devices. This content is also recommended for those who feel that the hurdles to entry are high due to a lack of knowledge about regulations and QMS for medical device manufacturing. 【Event Overview】 "OKI's Design, Manufacturing, and Maintenance Services for Shaping Medical Devices" Seminar Date: April 19, 2022 (Tuesday) 15:00 - 15:50 Location: Online (Zoom Webinar) Capacity: 100 participants (Pre-registration required, free of charge) Pre-registration deadline: April 18 (Monday) at noon Seminar program: Please check our website or download the materials for details. *For more information, please refer to the PDF materials or contact us via the inquiry button.
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Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.
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Our company provides one-stop services from development to manufacturing, reliability, and evaluation. We are capable of handling design and manufacturing contracts (EMS) for CV-ECUs, which are difficult for major manufacturers to accommodate. With our high development and production technology cultivated through extensive experience, we support manufacturing from small quantities. For more details, please refer to the related links below. 【OKI-EMS's Commitment to Automotive Electronics】 ■ One-stop service provision from development to manufacturing, reliability, and evaluation ■ Achieving flexible production of various small quantities to respond to demand fluctuations ■ Smoothly reviewing production bases without investing management resources in factory construction, equipment investment, or securing personnel ■ Possessing a car electronics test lab to meet standard testing and evaluation needs *For more details, please refer to the PDF materials or feel free to contact us.
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Our company provides high-quality and highly reliable design and manufacturing contract services using mechatronics technology cultivated through ATMs/printers and fluid control technology developed through contract manufacturing of medical, beauty, and beverage equipment. Utilizing control systems that leverage motors and sensors developed in high-precision financial mechatronic terminals, we offer various services for specimen transport and drug injection in medical device specimen testing equipment. Additionally, we combine the core technology of mechatronics, specifically media transport technology, with the know-how gained from our EMS business in medical and beauty devices to provide high-precision liquid transport. For more details, please refer to the related links below. 【Examples of medical specimen testing equipment】 ■ Clinical chemistry automatic analyzers - Quantitative analysis devices for chemical components and electrolytes in specimens such as blood and urine ■ Blood gas analyzers - Measurement of oxygen and carbon dioxide partial pressures and pH in blood ■ Immunoserological testing devices - Quantitative analysis of antigen/antibody levels or qualitative analysis of the presence of antigens/antibodies in specimens *For more details, please refer to the PDF materials or feel free to contact us.
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We would like to introduce the features and benefits of OKI's pattern design. Our scope of work ranges from simulation to artwork, allowing us to accommodate various circuit board designs tailored to customer needs. Leveraging approximately 10,000 design achievements from communication and measurement equipment to space and defense products, we can handle a diverse range of designs from single-sided boards to IVH and build-up. 【Features】 ■ Close contact with the manufacturing site to achieve high-difficulty design and production ■ Immediate assembly of relevant departments in case of issues to prevent circuit board defects ■ Accurate interpretation of circuit diagram intentions, proposing pattern designs that do not compromise electrical characteristics ■ All designers hold a Level 2 or higher certification in printed wiring board design skills *For more details, please refer to the PDF document or feel free to contact us.
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You can eliminate wiring constraints with OKI's flex-rigid printed circuit boards. We solve customer issues such as "I can't find space for connectors to connect cables" and "I want to eliminate variations in contact resistance due to connectors." Our products can be used for miniaturization and high density without connectors, as well as for reducing cable connection errors and wiring labor. 【Features】 ■ Proposal for flex-rigid printed circuit boards ■ Suggestion to adopt rigid structure into the inner layer of flexible material ■ No mold costs required → Supported by router processing (cost-effective) ■ Proposal for multilayer structure of flexible layers *For more details, please refer to the PDF document or feel free to contact us.
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We are pleased to announce that we will be holding an online seminar titled "OKI's EMS/DMS Solutions Supporting Entry into the Medical Device Industry." Are you facing challenges such as wanting to enter the medical device market, wanting to respond to IoT and DX in medical devices, or wanting to improve the quality of medical devices? In this seminar, we will introduce the features of OKI with case studies. If you are considering entering the medical market or are facing challenges in the manufacturing of medical devices, please join us. 【Event Overview】 ■ Date: February 2, 2023 (Thursday) 15:00 - 16:00 ■ Location: Online (Zoom Webinar) ■ Capacity: 100 participants (Free, pre-registration required) ■ Pre-registration deadline: February 1 (Wednesday) at noon ■ Target audience: Companies with challenges in the design, manufacturing, and maintenance of medical devices ■ Seminar program: Please check our website or download the materials for details. *For more information, please refer to the PDF materials or contact us via the inquiry button.
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Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Resolving the following concerns】 ■ I would like to consider next-generation high-frequency application substrates ■ I want to reduce transmission loss and delay time ■ I want to match characteristic impedance accurately ■ I want to reduce the cost of high-speed high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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We provide printed circuit boards that support high-speed transmission, such as 5G infrastructure and high-frequency device test boards. We accommodate various low-loss materials both domestically and internationally, with high-precision impedance control for multilayer boards. We offer high-precision simulations based on the back data of our manufactured boards. 【Features】 ■ Manufacturing Process - High-precision impedance control - Back drill processing accuracy ■ Board Design - Support for various simulations *For more details, please refer to the PDF document or feel free to contact us.
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Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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1. Maintenance of performance for screen and metal mask versions Since the cleaning solution does not come into contact with the adhesive parts of the metal frame and mask, it prevents loosening of tension and detachment of adhesive parts. 2. Prevention of odor leakage By using a partial cleaning method, the odor of the cleaning solution is blocked throughout all processes from cleaning to drying. 3. High cleaning capability Adoption of a spray cleaning method with a nozzle arrangement that eliminates cleaning unevenness. 4. Consideration for worker health and the environment Using a cleaning solution that is harmless to the human body and does not pollute the atmosphere, while achieving high cleaning capability and quick drying. 5. High safety A structure that allows for reliable cleaning and drying with a safe cleaning solution that has no flash point. 6. Maintainability With a simple structure that does not require specialized maintenance personnel, it can operate stably for a long time with just the replacement of consumables. 7. Fully automated operation from cleaning to drying.
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Our company generates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs that prevent prototyping" and "the desire to ensure high reliability." Flex-rigid substrates contribute to miniaturization and high-density design without connectors, reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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To efficiently utilize the thermal conductivity of copper (390 W/m·K) for heat dissipation, we introduce a printed circuit board embedded with copper coins in the heat-generating area. In conventional methods, heat dissipation vias were arranged as much as possible, but due to the inability to increase the cross-sectional area of copper, there were limitations in heat dissipation. In the developed product, the thermal conductivity has been improved by embedding copper coins. 【Comparison of Conductor Cross-sectional Area】 ■ Through Hole (25μm) - φ3.0mm 1 hole: 0.23 mm² - φ8mm area: 1.41 mm² (φ0.4mm TH, 1.0mm pitch, 48 holes) ■ Copper Coin - φ3.0mm 1 hole: 7.07 mm² (approximately 30 times) - φ8mm area: 50.24 mm² (1 hole of φ8mm copper coin) (approximately 35 times) *For more details, please refer to the PDF document or feel free to contact us.
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Our company solves issues related to large currents, high voltages, and heat dissipation through a special structure. We address customer concerns such as defects caused by warping of printed circuit boards due to heat. Please feel free to contact us when you need our services. 【Features】 ■ Capable of conducting large currents (up to 400A) testing ■ Multi-layer structure with conductor thickness up to 500μm ■ Production of metal (with AL 2.5mm) products is possible ■ Proposals for suitable heat dissipation structures Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.
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OKI, which handles custom specifications of printed circuit boards (PCBs) with various functions such as high multi-layering, heat dissipation, and high-frequency compatibility, will explain the basics of printed circuit boards. From the basics like "What is a printed circuit board?" to accommodating high current, high voltage, and high heat dissipation specifications, as well as supporting high-speed and large-capacity transmission, this guidebook is filled with valuable knowledge that we encourage you to read. [Contents (partial)] ■ What is a printed circuit board? ■ Types of printed circuit boards ■ Support for high-speed and large-capacity transmission ■ Support for high-density build-up structures, etc. *For more details, please download the PDF or contact us.
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We would like to introduce the analysis and reliability evaluation conducted by Oki Electric Industry Co., Ltd. Using the know-how accumulated over many years and well-equipped analysis and reliability evaluation facilities, we carry out rapid analysis and evaluation by our in-house engineers. In the visual observation of the mounting process, we observe solder joints using X-ray inspection equipment with CT functionality and monitor the heating process with a reflow simulator. Additionally, we also conduct analysis of mounting composition states and reliability evaluations. Please feel free to contact us if you have any inquiries. 【Analysis and Evaluation Contents】 ■ Visual observation of the mounting process ■ Analysis of mounting composition states ■ Compliance with RoHS and REACH ■ Reliability evaluation *For more details, please refer to the PDF materials or feel free to contact us.
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Our company generates many benefits with flex-rigid integrated printed circuit boards (wiring boards). We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers *For more details, please refer to the PDF document or feel free to contact us.
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Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Introducing the "920MHz Band Multi-Hop Wireless." - No license required for long-distance transmission, improving the reliability of wireless communication through multi-hop. - Customizable according to customer requirements. *For more details, please refer to the PDF document or feel free to contact us.
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At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.
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We would like to introduce a case where we achieved cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer. By applying simulation to a competitor's designed circuit board, we redesigned it in-house from a 3-layer to a single-layer build-up without compromising electrical and noise characteristics. Additionally, in a case where we utilized our small-diameter drilling technology to reduce crosstalk, the BGA extraction via section experienced reduced crosstalk. We proposed in advance that the coupling in the Z-axis direction between vias, which occurs in high-thickness boards, could be reduced through small-diameter φ0.15 drilling. [Case Studies] ■ Cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer ■ Utilization of our small-diameter drilling technology to reduce crosstalk *For more details, please refer to the PDF document or feel free to contact us.
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Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.
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We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.
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OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html
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The specifications required for the high performance of 5G-compatible communication devices and the development and design of infrastructure equipment and space industry equipment are significantly shifting towards higher sophistication and reliability. In particular, ensuring the absolute operational reliability of printed circuit boards is unavoidable. While redundant design of electrical circuits is possible, redundancy for a single printed circuit board is challenging. In response to such issues, our proposed printed circuit boards and assembly services have received high praise and have been adopted by a wide range of customers. We will continue to contribute as a trusted outsourcing manufacturer focused on solving challenges. Please feel free to contact us when needed. 【Service Overview】 ■ Manufacturing ・Development and Design ・Key Components ・Board Assembly ・Assembly Inspection ■ After-Service ・Standard Testing, Reliability Evaluation ・Maintenance * For more details, please refer to the PDF document or feel free to contact us. * We also respond to various consultations online.
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Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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At OKI Nextech, we provide comprehensive support from structural examination, design, and prototyping to mass production of devices. We possess environmental resistance technology that withstands harsh outdoor conditions (dustproof and waterproof standards, heat resistance technology, salt damage resistance, etc.). Through 3D-CAD design, we ensure quality from the design stage with 'structural analysis,' 'stress analysis' for strength confirmation, and 'thermal analysis' for temperature distribution and flow confirmation. *For more details, please refer to the PDF materials or feel free to contact us.
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Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
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At OKI Nextec, we provide high-value-added services that only a long-established EMS manufacturer can offer, such as alternative proposals for mounted components, optimal specifications for printed circuit boards, and quality assurance through design rules suitable for "monozukuri" (manufacturing). *For more details, please refer to the PDF materials or feel free to contact us.*
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