沖電気工業 List of Products and Services

We would like to introduce the analysis and reliability evaluation conducted by Oki Electric Industry Co., Ltd. Using the know-how accumulated over many years and well-equipped analysis and reliability evaluation facilities, we carry out rapid analysis and evaluation by our in-house engineers. In the visual observation of the mounting process, we observe solder joints using X-ray inspection equipment with CT functionality and monitor the heating process with a reflow simulator. Additionally, we also conduct analysis of mounting composition states and reliability evaluations. Please feel free to contact us if you have any inquiries. 【Analysis and Evaluation Contents】 ■ Visual observation of the mounting process ■ Analysis of mounting composition states ■ Compliance with RoHS and REACH ■ Reliability evaluation *For more details, please refer to the PDF materials or feel free to contact us.

• Evaluation Board

Our company generates many benefits with flex-rigid integrated printed circuit boards (wiring boards). We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Introducing the PCI-Express compatible wiring board "T-SEC-Board." In addition to increasing the freedom of characteristic impedance wiring width, the use of inner layer metals (copper, aluminum) is possible. This is a high-function wiring board equipped with multi-pin BGA, which allows for partial control of the board thickness at the terminal connector section. 【Features】 ■ Layer count can be increased according to the number of pins of the mounted components ■ Increased freedom of characteristic impedance wiring width ■ Inner layer copper foil thickness can be increased for heat dissipation purposes ■ Adoption of inner layer metals is possible (improving strength and heat dissipation, etc.) Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

Introducing the "920MHz Band Multi-Hop Wireless." - No license required for long-distance transmission, improving the reliability of wireless communication through multi-hop. - Customizable according to customer requirements. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

• Other contract services

We would like to introduce a case where we achieved cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer. By applying simulation to a competitor's designed circuit board, we redesigned it in-house from a 3-layer to a single-layer build-up without compromising electrical and noise characteristics. Additionally, in a case where we utilized our small-diameter drilling technology to reduce crosstalk, the BGA extraction via section experienced reduced crosstalk. We proposed in advance that the coupling in the Z-axis direction between vias, which occurs in high-thickness boards, could be reduced through small-diameter φ0.15 drilling. [Case Studies] ■ Cost reduction and shortened delivery time by converting a 3-layer build-up to a single layer ■ Utilization of our small-diameter drilling technology to reduce crosstalk *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Based on the FITT (Fine pitch Through via Technology) method, we are promoting high-precision technology to achieve narrow pitch printed circuit boards in even higher multilayer and thicker board areas. With a board thickness of 7.65mm and a φ0.20 drill through processing, we can accommodate 0.50mm pitch BGA. This technology can be applied to semiconductor tester boards such as load boards, socket boards, and probe cards. 【Features】 ■ Accommodates 0.50mm pitch BGA with a board thickness of 7.65mm and φ0.20 drill through processing - Up to 76 layers ■ Accommodates 0.25mm pitch BGA with ultra-small diameter φ0.10 drill processing - Up to 26 layers with sequential structure possible ■ Achieves narrow pitch BGA compatible boards in even higher multilayer and thicker board areas *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

• Printed Circuit Board

The specifications required for the high performance of 5G-compatible communication devices and the development and design of infrastructure equipment and space industry equipment are significantly shifting towards higher sophistication and reliability. In particular, ensuring the absolute operational reliability of printed circuit boards is unavoidable. While redundant design of electrical circuits is possible, redundancy for a single printed circuit board is challenging. In response to such issues, our proposed printed circuit boards and assembly services have received high praise and have been adopted by a wide range of customers. We will continue to contribute as a trusted outsourcing manufacturer focused on solving challenges. Please feel free to contact us when needed. 【Service Overview】 ■ Manufacturing ・Development and Design ・Key Components ・Board Assembly ・Assembly Inspection ■ After-Service ・Standard Testing, Reliability Evaluation ・Maintenance * For more details, please refer to the PDF document or feel free to contact us. * We also respond to various consultations online.

• Circuit board design and manufacturing

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

At OKI Nextech, we provide comprehensive support from structural examination, design, and prototyping to mass production of devices. We possess environmental resistance technology that withstands harsh outdoor conditions (dustproof and waterproof standards, heat resistance technology, salt damage resistance, etc.). Through 3D-CAD design, we ensure quality from the design stage with 'structural analysis,' 'stress analysis' for strength confirmation, and 'thermal analysis' for temperature distribution and flow confirmation. *For more details, please refer to the PDF materials or feel free to contact us.

• Machinery and equipment installation/dismantling/relocation

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

At OKI Nextec, we provide high-value-added services that only a long-established EMS manufacturer can offer, such as alternative proposals for mounted components, optimal specifications for printed circuit boards, and quality assurance through design rules suitable for "monozukuri" (manufacturing). *For more details, please refer to the PDF materials or feel free to contact us.*

• Circuit board design and manufacturing

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

• others

At OKI Nextech, we can provide a consistent response from optimal configuration proposals for systems based on proven reference designs to hardware design and stack development. We also support the verification processes (conformance testing, interoperability testing) that are crucial for open standards. *For more details, please refer to the PDF materials or feel free to contact us.*

• Other embedded systems (software and hardware)

We provide printed circuit boards with structures tailored to your applications. Increased wiring density for inner and outer layers → Build-up printed circuit boards Implementation of blind vias to prevent solder blowout → Pad-on-hole structure printed circuit boards Pitch of 0.65mm or less → Build-up or pad-on-hole structure printed circuit boards We can propose specifications according to your needs. Please feel free to consult us. 【Usage Scenarios】 ■ By Product / Minimum Through-Hole Pitch - Probe Card: 0.65mm - CSP Main Image: 0.40mm - Performance Board: 0.50mm - Burn-in Board: 0.40mm *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company supports information and industrial communication systems in the era of ultra-high-speed digital communication, leveraging over half a century of accumulated cable design and manufacturing technology. We offer a range of products including "robot cables," which are resistant to bending, sliding, and twisting, as well as "interface cables" and "fiber optic cables." 【Features】 ■ Robot Cables - Resistant to bending, sliding, and twisting - ORP available for sale starting from 10m ■ Interface Cables - Lineup for fixed and movable applications - USB 3.0 transmission speed of 5Gbps ■ Fiber Optic Cables - USB 3.0-AOC with a maximum transmission distance of 40m *For more details, please visit our external link page or feel free to contact us.

• cable

Our company, with a wealth of market product experience, is capable of customizing the design and production of weather resistance and corrosion resistance according to the intended use and installation environment. In today's world, where natural disasters are frequent, IP55 (dustproof and waterproof) compliance, airtight welding, and weather-resistant coatings have become standard features. Our company has numerous product achievements and can deliver including testing. We also carry out painting and silk screening consistently in-house. In addition to solvent, powder, and special coatings (such as anti-graffiti paint), we can also perform multi-color silk screening.

• Contract manufacturing

In high-speed, high-frequency compatible printed circuit boards, we will assist in the development of printed circuit boards aimed at 25Gbps to 100Gbps. We solve customer issues such as "I want to reduce transmission loss and delay time" and "I want to use materials suitable for the product." We will propose suitable materials (low dielectric, low loss tangent) based on measured data. 【Features】 ■ Proposal of suitable materials (low dielectric, low loss tangent) based on measured data ■ Support from the design stage with pre-simulation (single-ended, differential) ■ Proposals based on measured values of material transmission characteristics (loss, delay) ■ Proposal of composite structure circuit boards using high-frequency materials and FR-4 *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board

By utilizing the functional verification tool (ModelSim) and conducting simulations from the coding stage, we achieve high quality and reduced development time. *For more details, please refer to the PDF document or feel free to contact us.*

• Other embedded systems (software and hardware)

This is an introduction to ARM embedded board development cases. We propose a CPU board that pursues usability. - You are considering alternatives because the CPU board you are currently using has been discontinued. - You are looking for a CPU board that can utilize existing software assets. - You are searching for a CPU board that has a familiar OS already implemented. *For more details, please refer to the PDF document or feel free to contact us.*

• Embedded system design service

Our company provides EMS (Engineering and Manufacturing Services) for "Equipment Assembly and Inspection." We respond to customer demands with just-in-time production that accommodates small-batch, diverse production through our know-how, including supply chain management, and short delivery times. In addition to our quality and environmental management systems, "ISO9001" and "ISO14001," we have also obtained "ISO13485" for medical devices, ensuring we deliver high-quality and highly reliable products to our customers. 【Features】 ■ Discrimination skills to identify difficult-to-detect appearance defects and inspection and analysis technology utilizing various measuring instruments ■ In-house development of automatic measurement for analog radio equipment and adjustment technology for various radio devices in the MF/VHF/UHF/SHF bands ■ Assembly and adjustment technology for mechatronic products (we have an integrated line from sheet metal parts manufacturing to equipment production) *For more details, please refer to the PDF document or feel free to contact us.

• Assembly Machine

At OKI Nextech, we customize based on the circuit assets accumulated through basic technology development to meet our customers' requirements. We support everything from unit design to the final product design of panel computers and more. Our products are utilized in various controls such as industrial PCs, robot control, measuring instruments, as well as in medical terminals and financial terminals, with an annual production record of over 40,000 units. *We offer free loan of evaluation boards for preliminary verification. *For more details, please refer to the PDF materials or feel free to contact us.

• Industrial PCs

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company provides EMS (design and manufacturing contract services) for "medical devices." We have obtained certification for the quality management system for medical devices (ISO 13485) and comply with IEC 62304 for improving software safety in medical devices, as well as risk management according to ISO 14971. We offer comprehensive manufacturing services for medical devices through thorough process validation across all value chains in manufacturing. 【Features】 ■ Compliance with IEC 62304 and risk management ISO 14971 ■ Provided as a one-stop service ■ Components for medical devices are also available ■ Comprehensive manufacturing services for medical devices *For more details, please refer to the related link page or feel free to contact us.

• EMS

We provide printed circuit boards that combine functional materials tailored to various characteristic requirements. By using a hybrid structure of functional materials such as low-loss materials and capacitor materials along with general materials, we achieve a balance between performance and cost. Additionally, we accommodate low-loss materials both domestically and internationally. 【Application Example】 <Embedded Capacitor> ■ Number of Layers: 20 layers ■ Base Material: Faradflex + Megtron6 ■ Application Example: Networks, semiconductor testing *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

Introducing the "Battery-less BLE Wireless Beacon." - It enables beacon transmission via Bluetooth Low Energy powered solely by solar energy. - It can be customized according to your requirements. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

At OKI Nextec, we develop custom power supplies for high-reliability equipment such as power control devices, wireless and communication devices, and broadcasting equipment with a short lead time. - Emergency short lead time response: design and production within 1.5 to 2 months - Support for special specifications (environmental resistance, wide temperature range, high voltage power supplies, customer circuit implementation, etc.) *For more details, please refer to the PDF materials or feel free to contact us.

• Switching Power Supply

Our company offers "electrode wire for wire electrical discharge machining" that has excellent straightness for automatic wire connection. Thanks to our unique heat treatment technology, we achieve stable mechanical and electrical properties. It has excellent straightness for automatic wire connection. The product is packaged in shrink wrap to prevent rust and dust, and from an environmental protection perspective, it is packaged only in cardboard without the use of polystyrene foam. 【Features】 ■ Management of roundness ■ High precision wire diameter ■ Stable properties ■ Excellent straightness ■ Environmentally friendly packaging ■ Collection and recycling of used wire and empty spools *For more details, please refer to the PDF document or feel free to contact us.

• Other cable related products

This is an introduction to printed circuit boards designed to solve issues related to high current, high voltage, and heat dissipation. They can be used for thick copper foil boards, metal core boards, and metal base boards. We can conduct high current (up to 400A) conduction tests in-house. 【Features】 ■ Pre-shipment inspection possible with dielectric strength testing ■ Multi-layer formation with conductor thickness up to 500μm ■ Production of products with 2.5mm metal is possible ■ In-house high current (up to 400A) conduction testing available *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

At OKI Next Tech, we provide the most suitable manufacturing processes for our customers' needs using the latest equipment. - We offer consistent support from circuit board assembly to equipment manufacturing. - We flexibly accommodate both small and large lots. - We can also conduct product evaluation and analysis. - Our advanced mounting technology supports the latest devices. *For more details, please refer to the PDF document or feel free to contact us.*

• Contract manufacturing

We will introduce a case where we supported the integration of various wireless modules using our EMS (design and manufacturing contract services) to achieve IoT implementation. The challenges faced by our customers included wanting to "wireless-enable existing lineup products" and "wanting to incorporate wireless technology into new development products but lacking the know-how." Therefore, leveraging the wireless communication technology cultivated in our information and communication business, we proposed IoT implementation using wireless modules tailored to the customer's product applications. [Challenges] ■ Wanting to integrate wireless modules into their own products to make them IoT devices ■ Wanting to wireless-enable existing lineup products ■ Wanting to incorporate wireless technology into new development products but lacking the know-how *For more details, please refer to the PDF document or feel free to contact us.

• LED Module

Oki Electric Industry Co., Ltd. delivers high value-added products to our customers by proposing the specifications of used parts and circuit boards, applying our unique design standards and manufacturing rules to achieve product quality. We align with our partner manufacturers on product specifications for printed circuit boards and wiring specifications for artwork design, and propose suitable specifications. By building a parts library and mounting design rules based on our unique standards, we can ensure quality during the design phase. Additionally, by reviewing after the production of prototypes, we minimize risks during mass production and maintain stable product supply. [Features] ■ Reduces customer burden ■ Improves product quality *For more details, please refer to the PDF materials or feel free to contact us.

• Circuit board design and manufacturing

Our company provides EMS (Engineering and Manufacturing Services) for "automotive electronics (car electronics)." We offer a one-stop service from development to manufacturing, reliability, and evaluation. We possess advanced FPGA technology for advanced driving technologies such as ADAS (Advanced Driver Assistance Systems) and ADS (Autonomous Driving Systems), which enhance vehicle safety and realize future autonomous driving. Recently, we have developed our own implementation lines and inspection technologies to accommodate the increasingly fine components of automotive electronics (0402, 0603 CHIP). For parts requiring high reliability, we can provide high-strength solder and coating solutions. 【Features】 ■ One-stop service provision ■ High-strength solder and coating solutions available ■ Realization of small-lot production of various types ■ Smooth review of production bases ■ Possession of a car electronics test lab *For more details, please refer to the related link page or feel free to contact us.

• EMS

OKI JIP Corporation is a company that provides printed circuit board assembly and equipment assembly testing services for electronic devices. By leveraging the printed circuit board assembly technology and equipment assembly technology cultivated in communication devices, we offer flexible manufacturing that can adapt to changes, serving as "our customers' virtual factory" and providing various contracted services to meet diverse needs. Additionally, we support integrated production services from printed circuit board assembly to equipment assembly and inspection. 【Business Description】 ■ Printed circuit board assembly and equipment assembly testing for electronic devices *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Our company offers EMS (design and manufacturing contract services) for "printed circuit board assembly." We possess world-class assembly technology and have a wealth of experience in semiconductor testing equipment, communication infrastructure devices, and aerospace and electrical equipment that must withstand harsh environments. We quickly respond to the reliability requirements of special components, from tiny chips to large surface-mounted components, multi-pin press-fit connectors, ultra-multi-pole array connectors, and LGA for large heavy printed circuit boards. We propose assembly solutions tailored to our customers' product specifications. 【Features】 ■ High-precision reflow soldering for large heavy printed circuit board assembly ■ Hydrostatic soldering technology ■ High-speed X-ray inspection technology ■ Cleaning technology ■ LOT control *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board

OKI Nextec provides comprehensive support from the design to manufacturing and certification of wireless devices. We possess various wireless technologies, including high-spec wireless (broadcast base stations, business radios), low-power/weak wireless (specific low-power wireless, Bluetooth, LPWA wireless terminals), and public wireless (3G, 4G, LTE wireless terminals). *For more details, please refer to the PDF materials or feel free to contact us.

• Wireless LAN

We would like to introduce the manufacturing services provided by Oki Electric Industry Co., Ltd. We offer integrated production capabilities from circuit board assembly to equipment manufacturing. We can flexibly accommodate small to large lot production with various types and quantities. In our SMT assembly service, we possess high-precision, high-performance assembly equipment, capable of assembling components from small chip parts sized 0402 to bottom electrode components such as BGA and QFN. Please feel free to contact us when you need our services. 【Service Contents】 ■ SMT Assembly Service ■ Through-Hole Component Assembly Service ■ Circuit Board Testing Service ■ Equipment Manufacturing Service *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We would like to introduce the cutting-edge technologies and solutions provided by Oki Electric Industry. We offer solutions utilizing various low-loss substrates and the technology for mixed laminates with standard FR4, starting with large substrates over 600mm. Please feel free to contact us when you need assistance. 【Overview of Large Substrates】 ■ Technology - Manufacturing of large substrates over 600mm ■ Solutions - Support for large substrates with a length of 600mm or more - Compatible with φ520 large probe cards ■ Applications - Semiconductor testing (load boards, burn-in, probe cards) *For more details, please refer to the PDF materials or feel free to contact us.

• Other contract services