沖電気工業 List of Products and Services

Our company provides one-stop services from development to manufacturing, reliability, and evaluation. We are capable of handling design and manufacturing contracts (EMS) for CV-ECUs, which are difficult for major manufacturers to accommodate. With our high development and production technology cultivated through extensive experience, we support manufacturing from small quantities. For more details, please refer to the related links below. 【OKI-EMS's Commitment to Automotive Electronics】 ■ One-stop service provision from development to manufacturing, reliability, and evaluation ■ Achieving flexible production of various small quantities to respond to demand fluctuations ■ Smoothly reviewing production bases without investing management resources in factory construction, equipment investment, or securing personnel ■ Possessing a car electronics test lab to meet standard testing and evaluation needs *For more details, please refer to the PDF materials or feel free to contact us.

Our company provides high-quality and highly reliable design and manufacturing contract services using mechatronics technology cultivated through ATMs/printers and fluid control technology developed through contract manufacturing of medical, beauty, and beverage equipment. Utilizing control systems that leverage motors and sensors developed in high-precision financial mechatronic terminals, we offer various services for specimen transport and drug injection in medical device specimen testing equipment. Additionally, we combine the core technology of mechatronics, specifically media transport technology, with the know-how gained from our EMS business in medical and beauty devices to provide high-precision liquid transport. For more details, please refer to the related links below. 【Examples of medical specimen testing equipment】 ■ Clinical chemistry automatic analyzers - Quantitative analysis devices for chemical components and electrolytes in specimens such as blood and urine ■ Blood gas analyzers - Measurement of oxygen and carbon dioxide partial pressures and pH in blood ■ Immunoserological testing devices - Quantitative analysis of antigen/antibody levels or qualitative analysis of the presence of antigens/antibodies in specimens *For more details, please refer to the PDF materials or feel free to contact us.

Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the features and benefits of OKI's pattern design. Our scope of work ranges from simulation to artwork, allowing us to accommodate various circuit board designs tailored to customer needs. Leveraging approximately 10,000 design achievements from communication and measurement equipment to space and defense products, we can handle a diverse range of designs from single-sided boards to IVH and build-up. 【Features】 ■ Close contact with the manufacturing site to achieve high-difficulty design and production ■ Immediate assembly of relevant departments in case of issues to prevent circuit board defects ■ Accurate interpretation of circuit diagram intentions, proposing pattern designs that do not compromise electrical characteristics ■ All designers hold a Level 2 or higher certification in printed wiring board design skills *For more details, please refer to the PDF document or feel free to contact us.

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

Our company creates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction of mold expenses through router processing ■ Possible multilayer structure for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Resolving the following concerns】 ■ I would like to consider next-generation high-frequency application substrates ■ I want to reduce transmission loss and delay time ■ I want to match characteristic impedance accurately ■ I want to reduce the cost of high-speed high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company enables high-density component mounting such as narrow-pitch CSP. We offer specifications tailored to applications, including measures to prevent solder blowout during the mounting of via-in-pad structures. Please feel free to contact us when you need assistance. 【Specification Proposals】 ■ Increased wiring density for inner and outer layers → Build-up, IVH structure ■ Measures to prevent solder blowout during the mounting of via-in-pad structures → Pad-on-hole structure ■ High-density CSP mounting with a pitch of 0.65mm or less → Build-up, pad-on-hole structure An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, multi-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

The specifications required for the high performance of 5G-compatible communication devices and the development and design of infrastructure equipment and space industry equipment are significantly shifting towards higher sophistication and reliability. In particular, ensuring the absolute operational reliability of printed circuit boards is unavoidable. While redundant design of electrical circuits is possible, redundancy for a single printed circuit board is challenging. In response to such issues, our proposed printed circuit boards and assembly services have received high praise and have been adopted by a wide range of customers. We will continue to contribute as a trusted outsourcing manufacturer focused on solving challenges. Please feel free to contact us when needed. 【Service Overview】 ■ Manufacturing ・Development and Design ・Key Components ・Board Assembly ・Assembly Inspection ■ After-Service ・Standard Testing, Reliability Evaluation ・Maintenance * For more details, please refer to the PDF document or feel free to contact us. * We also respond to various consultations online.

Our company solves issues related to large currents, high voltages, and heat dissipation through a special structure. We address customer concerns such as defects caused by warping of printed circuit boards due to heat. Please feel free to contact us when you need our services. 【Features】 ■ Capable of conducting large currents (up to 400A) testing ■ Multi-layer structure with conductor thickness up to 500μm ■ Production of metal (with AL 2.5mm) products is possible ■ Proposals for suitable heat dissipation structures Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company is capable of providing copper coin (heat dissipation structure) wiring boards. With the advancement of high-performance 5G communication devices, managing the heat generated by high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. *Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Independently developed equipment for embedding copper coins, flexibly adapting to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

Our company generates many benefits through integrated flex-rigid technology. We solve issues such as "high initial costs that prevent prototyping" and "the desire to ensure high reliability." Flex-rigid substrates contribute to miniaturization and high-density design without connectors, reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company generates many benefits with flex-rigid integrated printed circuit boards (wiring boards). We solve issues such as "high initial costs preventing prototype development" and "wanting to ensure high reliability." We contribute to miniaturization and high density through connector-less designs, as well as reducing cable connection errors and wiring labor. 【Features】 ■ Support available from a single unit ■ Data receipt to shipment: possible in as little as 5 days ■ Cost reduction for molds through router processing ■ Multi-layer structure possible for flex layers ■ Use of liquid crystal polymer materials for flex layers *For more details, please refer to the PDF document or feel free to contact us.

Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

Our company will realize products that support the millimeter wave frequency range of 30 to 300 GHz. Do you have any concerns such as "I would like to consider next-generation millimeter wave radar-equipped devices"? We will support you in solving challenges for product commercialization. We will make proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. [We solve the following concerns] ■ I would like to consider substrates for millimeter wave radar applications. ■ I would like to consider substrates for next-generation high-frequency applications. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. An article about our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

At OKI Nextech, we customize based on the circuit assets accumulated through basic technology development to meet our customers' requirements. We support everything from unit design to the final product design of panel computers and more. Our products are utilized in various controls such as industrial PCs, robot control, measuring instruments, as well as in medical terminals and financial terminals, with an annual production record of over 40,000 units. *We offer free loan of evaluation boards for preliminary verification. *For more details, please refer to the PDF materials or feel free to contact us.

Introducing the "920MHz Band Multi-Hop Wireless." - No license required for long-distance transmission, improving the reliability of wireless communication through multi-hop. - Customizable according to customer requirements. *For more details, please refer to the PDF document or feel free to contact us.

At OKI Nextec, we develop custom power supplies for high-reliability equipment such as power control devices, wireless and communication devices, and broadcasting equipment with a short lead time. - Emergency short lead time response: design and production within 1.5 to 2 months - Support for special specifications (environmental resistance, wide temperature range, high voltage power supplies, customer circuit implementation, etc.) *For more details, please refer to the PDF materials or feel free to contact us.

OKI Nextec provides comprehensive support from the design to manufacturing and certification of wireless devices. We possess various wireless technologies, including high-spec wireless (broadcast base stations, business radios), low-power/weak wireless (specific low-power wireless, Bluetooth, LPWA wireless terminals), and public wireless (3G, 4G, LTE wireless terminals). *For more details, please refer to the PDF materials or feel free to contact us.

At OKI Nextec, we provide high-value-added services that only a long-established EMS manufacturer can offer, such as alternative proposals for mounted components, optimal specifications for printed circuit boards, and quality assurance through design rules suitable for "monozukuri" (manufacturing). *For more details, please refer to the PDF materials or feel free to contact us.*

At OKI Nextech, we offer testing equipment to customers who are having trouble setting up an environment for product shipment testing (functional inspection). By platforming shared functions, we achieve a reduction in the development period and costs of testing equipment. *For more details, please refer to the PDF document or feel free to contact us.

At OKI Nextech, we can provide a consistent response from optimal configuration proposals for systems based on proven reference designs to hardware design and stack development. We also support the verification processes (conformance testing, interoperability testing) that are crucial for open standards. *For more details, please refer to the PDF materials or feel free to contact us.*

Introducing the "Battery-less BLE Wireless Beacon." - It enables beacon transmission via Bluetooth Low Energy powered solely by solar energy. - It can be customized according to your requirements. *For more details, please refer to the PDF document or feel free to contact us.

Our company, with a wealth of market product experience, is capable of customizing the design and production of weather resistance and corrosion resistance according to the intended use and installation environment. In today's world, where natural disasters are frequent, IP55 (dustproof and waterproof) compliance, airtight welding, and weather-resistant coatings have become standard features. Our company has numerous product achievements and can deliver including testing. We also carry out painting and silk screening consistently in-house. In addition to solvent, powder, and special coatings (such as anti-graffiti paint), we can also perform multi-color silk screening.

At OKI Nextech, we provide comprehensive support from structural examination, design, and prototyping to mass production of devices. We possess environmental resistance technology that withstands harsh outdoor conditions (dustproof and waterproof standards, heat resistance technology, salt damage resistance, etc.). Through 3D-CAD design, we ensure quality from the design stage with 'structural analysis,' 'stress analysis' for strength confirmation, and 'thermal analysis' for temperature distribution and flow confirmation. *For more details, please refer to the PDF materials or feel free to contact us.

By utilizing the functional verification tool (ModelSim) and conducting simulations from the coding stage, we achieve high quality and reduced development time. *For more details, please refer to the PDF document or feel free to contact us.*

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

This is an introduction to ARM embedded board development cases. We propose a CPU board that pursues usability. - You are considering alternatives because the CPU board you are currently using has been discontinued. - You are looking for a CPU board that can utilize existing software assets. - You are searching for a CPU board that has a familiar OS already implemented. *For more details, please refer to the PDF document or feel free to contact us.*

At OKI Next Tech, we provide the most suitable manufacturing processes for our customers' needs using the latest equipment. - We offer consistent support from circuit board assembly to equipment manufacturing. - We flexibly accommodate both small and large lots. - We can also conduct product evaluation and analysis. - Our advanced mounting technology supports the latest devices. *For more details, please refer to the PDF document or feel free to contact us.*

Our company provides EMS (design and manufacturing contract services) for "medical devices." We have obtained certification for the quality management system for medical devices (ISO 13485) and comply with IEC 62304 for improving software safety in medical devices, as well as risk management according to ISO 14971. We offer comprehensive manufacturing services for medical devices through thorough process validation across all value chains in manufacturing. 【Features】 ■ Compliance with IEC 62304 and risk management ISO 14971 ■ Provided as a one-stop service ■ Components for medical devices are also available ■ Comprehensive manufacturing services for medical devices *For more details, please refer to the related link page or feel free to contact us.

Our company offers EMS (design and manufacturing contract services) for "printed circuit board assembly." We possess world-class assembly technology and have a wealth of experience in semiconductor testing equipment, communication infrastructure devices, and aerospace and electrical equipment that must withstand harsh environments. We quickly respond to the reliability requirements of special components, from tiny chips to large surface-mounted components, multi-pin press-fit connectors, ultra-multi-pole array connectors, and LGA for large heavy printed circuit boards. We propose assembly solutions tailored to our customers' product specifications. 【Features】 ■ High-precision reflow soldering for large heavy printed circuit board assembly ■ Hydrostatic soldering technology ■ High-speed X-ray inspection technology ■ Cleaning technology ■ LOT control *For more details, please refer to the PDF document or feel free to contact us.

We provide design and production contract services in high-end fields such as medical devices, aerospace, information and communication, industry, and measurement under the name 'Advanced M&EMS'. We will be exhibiting at the "22nd Printed Circuit Board EXPO" held from January 20 (Wednesday) to 22 (Friday), 2021! 【Overview of the "22nd Printed Circuit Board EXPO"】 Date: January 20 (Wednesday) to 22 (Friday), 2021 Venue: Tokyo Big Sight, West Hall 3 (4th floor of the West Exhibition Building), Booth No. W22-38 * A virtual (online) booth will also be prepared. We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth.

Our company provides EMS (Engineering and Manufacturing Services) for "automotive electronics (car electronics)." We offer a one-stop service from development to manufacturing, reliability, and evaluation. We possess advanced FPGA technology for advanced driving technologies such as ADAS (Advanced Driver Assistance Systems) and ADS (Autonomous Driving Systems), which enhance vehicle safety and realize future autonomous driving. Recently, we have developed our own implementation lines and inspection technologies to accommodate the increasingly fine components of automotive electronics (0402, 0603 CHIP). For parts requiring high reliability, we can provide high-strength solder and coating solutions. 【Features】 ■ One-stop service provision ■ High-strength solder and coating solutions available ■ Realization of small-lot production of various types ■ Smooth review of production bases ■ Possession of a car electronics test lab *For more details, please refer to the related link page or feel free to contact us.

We would like to introduce the analysis and reliability evaluation conducted by Oki Electric Industry Co., Ltd. Using the know-how accumulated over many years and well-equipped analysis and reliability evaluation facilities, we carry out rapid analysis and evaluation by our in-house engineers. In the visual observation of the mounting process, we observe solder joints using X-ray inspection equipment with CT functionality and monitor the heating process with a reflow simulator. Additionally, we also conduct analysis of mounting composition states and reliability evaluations. Please feel free to contact us if you have any inquiries. 【Analysis and Evaluation Contents】 ■ Visual observation of the mounting process ■ Analysis of mounting composition states ■ Compliance with RoHS and REACH ■ Reliability evaluation *For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce the manufacturing services provided by Oki Electric Industry Co., Ltd. We offer integrated production capabilities from circuit board assembly to equipment manufacturing. We can flexibly accommodate small to large lot production with various types and quantities. In our SMT assembly service, we possess high-precision, high-performance assembly equipment, capable of assembling components from small chip parts sized 0402 to bottom electrode components such as BGA and QFN. Please feel free to contact us when you need our services. 【Service Contents】 ■ SMT Assembly Service ■ Through-Hole Component Assembly Service ■ Circuit Board Testing Service ■ Equipment Manufacturing Service *For more details, please refer to the PDF document or feel free to contact us.

At Oki Electric Industry Co., Ltd., we provide enclosure design services. Our extensive "development achievements" enable us to shorten lead times and reduce costs. We have received satisfaction from your company's representatives through "reducing development burdens" and "timely market entry." From the early stages of development, we support our customers with reliable mass production product development considering "cost," "manufacturability," and "maintainability." Please leave the prototyping to mass production process setup to us. 【Features】 ■ Design enclosures tailored to your requirements ■ Achieve shorter lead times and lower costs ■ Support customers with reliable mass production product development *For more details, please refer to the PDF materials or feel free to contact us.

We propose to shorten the development period and reduce development costs for customers struggling with the setup of product shipment testing (functional inspection) environments by utilizing shared FCT. By separating dedicated and general-purpose components (shared across various boards), the development of testing equipment can be handled solely with dedicated components and control/inspection programs. Inspection logs can be saved, improving product traceability. Additionally, inspection results such as serial numbers, MAC addresses, measurement values, and pass/fail judgment results can be stored as logs, enabling effective traceability management of products. 【Features of Shared FCT】 ■ Can be handled solely with dedicated components and control/inspection programs ■ Proposals can be made for either hand press or air press depending on board size and pin count ■ Inspection logs can be saved ■ Improved product traceability *For more details, please refer to the PDF document or feel free to contact us.

Oki Electric Industry Co., Ltd. delivers high value-added products to our customers by proposing the specifications of used parts and circuit boards, applying our unique design standards and manufacturing rules to achieve product quality. We align with our partner manufacturers on product specifications for printed circuit boards and wiring specifications for artwork design, and propose suitable specifications. By building a parts library and mounting design rules based on our unique standards, we can ensure quality during the design phase. Additionally, by reviewing after the production of prototypes, we minimize risks during mass production and maintain stable product supply. [Features] ■ Reduces customer burden ■ Improves product quality *For more details, please refer to the PDF materials or feel free to contact us.

Our company offers EMS (design and manufacturing contract services) for "circuit design." Experienced project managers meticulously align specifications to understand customer needs. We have extensive experience in compliance with regulations such as PSE and VCC, providing design services that meet domestic technical standards. 【Services】 ■ FPGA design services ■ Industrial CPU board and custom services ■ Wireless technology ■ M2M/Iot services *For more details, please refer to the PDF document or feel free to contact us.