日本エバテック List of Products and Services

"CLUSTERLINE" is a film deposition family for semiconductor wafers and advanced packaging from Evatec. It features a cluster architecture with fully automated processing from cassette to cassette for wafers up to 12 inches. It provides film deposition solutions for semiconductor advanced packaging, wafer front-end processes, power devices, wireless, optical thin films, and optoelectronic integration, including metals, piezoelectric films, and insulating films. You can choose tools for single wafer processing or batch processing using a combination of single process modules (SPM) capable of PVD, ALD, PECVD, etching, etc., or batch process modules (BPM).

• Sputtering Equipment
• Etching Equipment
• CVD Equipment

The "SOLARIS Family" is a high-speed film deposition system that enables film formation in as fast as 3 seconds per sheet, with a maximum disk diameter of 430mm. Combining the know-how gained from delivering over 5,000 high-speed optical disk systems and experience from more than 3,000 semiconductor PVD systems, it allows for ultra-fast thin film deposition. It can be applied to various sputter deposition processes, including optical filters, reflective films, transparent electrodes, scratch-resistant coatings, decorative coatings, and corrosion-resistant coatings, with the possibility of combining surface cleaning etching. It is also applicable for protective coatings for fuel cell metal separators, decorative coatings for automotive interior parts, and anti-reflective transparent electrode coatings for in-vehicle displays. 【Features】 - Introduces a "high-speed inline" sheet-type architecture for substrate film formation - Improves throughput and eliminates manual processing through robotic handling - Provides high-speed production solutions for various film deposition processes Additionally, Evatec offers PVD, ALD, PECVD, and etching solutions for metals, piezoelectric films, insulating films, etc., for semiconductor wafers, advanced packaging, MEMS, and wireless filters.

• Sputtering Equipment
• Etching Equipment

The "LLS EVO II" is a versatile batch sputtering system with a vertical and dynamic concept, capable of accommodating up to five different materials, and features a device that separates the substrate load chamber and process chamber (LC, PC). It supports various substrate sizes and shapes up to 200×230mm. It can be equipped with configurable power supplies to enhance process flexibility. The degassing and etching of substrates in the load chamber ensure high-purity processes in the process chamber, allowing for easy conversion to various substrate sizes in under five minutes, making it a flexible manufacturing device. 【Features (partial)】 ■ Up to five sputter sources with DC, DC pulse, RF, and RF/DC ■ Simultaneous sputtering from up to three cathodes ■ Reactive sputtering with oxygen and nitrogen ■ High vacuum system configuration with turbo pump, cryo pump, and water trap *For more details, please refer to the related links or feel free to contact us.

• Sputtering Equipment
• Etching Equipment

"HEXAGON" is a mass production dedicated wafer-level packaging platform that provides atmospheric degassing, etching, and metal deposition at a very low cost of ownership for applications such as FOWLP. High-speed wafer processing is made possible by wafer transport using a synchronous indexer. With wafer handling, during 24/7 production, the wafer sensing function within the chamber allows for accurate and reproducible positioning, enabling full-face etching and deposition processes. 【Features】 - Processing of wafers passivated with organic films that degas in large quantities - High-performance dual-end effectors achieving short wafer exchange times Atmospheric front-end module using robots - Wafer transport via synchronous indexer enabling high-speed wafer processing - Over 20,000 etching shield kit lifespan due to enhanced uptime and reduced maintenance *For more details, please refer to the related links or feel free to contact us.

• Sputtering Equipment
• Etching Equipment

The "BAK Family," a deposition machine equipped with a new level of flexibility and process control, not only provides deposition work for power devices, wireless, LEDs, MEMS, and photonics but also represents a new generation of deposition equipment that achieves automatic substrate exchange and high throughput. From the compact BAK501 for universities and research institutions to the Multi BAK for mass production, we can propose a suitable BAK for all customers, from research and development to mass production. 【Features】 ■Selectable deposition distances from 0.5m to 2.0m ■Highly flexible processes that allow the use of multiple materials without vacuum break ■Fully automated options incorporating load locks and loading robots *For more details, please refer to the related links or feel free to contact us.

• Evaporation Equipment

The "CLUSTERLINE600" is a PVD deposition system specialized for large panels. All platforms share a cluster architecture equipped with cassette-to-cassette processing and fully automated processing. 【Chamber Configuration】 ■ Degassing Chamber ■ Ion Etching ■ Ti Sputtering ■ Cu Sputtering *For more details, please download the PDF (English version) or feel free to contact us.

• Sputtering Equipment
• Etching Equipment