Introducing the BAK deposition platform that allows for various chamber sizes and process automation options.
The "BAK Family," a deposition machine equipped with a new level of flexibility and process control, not only provides deposition work for power devices, wireless, LEDs, MEMS, and photonics but also represents a new generation of deposition equipment that achieves automatic substrate exchange and high throughput. From the compact BAK501 for universities and research institutions to the Multi BAK for mass production, we can propose a suitable BAK for all customers, from research and development to mass production. 【Features】 ■Selectable deposition distances from 0.5m to 2.0m ■Highly flexible processes that allow the use of multiple materials without vacuum break ■Fully automated options incorporating load locks and loading robots *For more details, please refer to the related links or feel free to contact us.
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Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.