A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.
"CLUSTERLINE" is a film deposition family for semiconductor wafers and advanced packaging from Evatec. It features a cluster architecture with fully automated processing from cassette to cassette for wafers up to 12 inches. It provides film deposition solutions for semiconductor advanced packaging, wafer front-end processes, power devices, wireless, optical thin films, and optoelectronic integration, including metals, piezoelectric films, and insulating films. You can choose tools for single wafer processing or batch processing using a combination of single process modules (SPM) capable of PVD, ALD, PECVD, etching, etc., or batch process modules (BPM).
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basic information
**Features of the Single Process Module (SPM) Configuration** - Modular chuck design that enables rapid exchange between 100, 150, or 200mm substrates to achieve production flexibility and maximum uptime. - Up to 6 single process modules and up to 6 auxiliary modules for pre-processing and post-processing steps. - Auxiliary module functions such as wafer alignment, buffering, degassing, cooling, and ID readers. - Direct transport and processing capability for ultra-thin wafers with thicknesses down to 70 microns. **Features of the Batch Process Module (BPM) Configuration** - Simultaneous batch processing of up to 20+1 six-inch substrates. - Simultaneous batch processing of up to 15+1 eight-inch substrates. - Substrate rotation table with options for individual substrate rotation chucks. - Capability to accommodate up to 4 PVD sputtering sources and 1 plasma source. *For more details, please download the PDF (English version) or feel free to contact us.*
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Applications/Examples of results
Advanced semiconductor packaging, front-end wafer processes, power devices, wireless, optical thin films, and numerous achievements in optoelectronic integration. *For more details, please feel free to contact us.*
Detailed information
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CLUSTERLINE
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Company information
Evatec's technology has been utilized worldwide for 70 years since the establishment of Balzers AG in 1946. Now, Evatec's thin film manufacturing technology is revolutionizing our lives and ways of working. The Internet of Things (IoT) offers the potential to connect 7 trillion devices for a global population of 7 billion people, and Evatec's thin film manufacturing technology makes this possible. Semiconductor devices manufactured with Evatec's equipment enable millions of people around the world to connect through high-speed wireless networks, changing the way we work due to the evolution of AI. Additionally, autonomous driving made possible by AI semiconductors and high-precision sensing is transforming lifestyles, while power semiconductors allow various devices to operate with less power, addressing energy issues. We provide cutting-edge solutions for thin film manufacturing with high-performance electrical and optical properties, ranging from high-frequency filters essential for wireless communication, high-brightness LEDs for automotive and lighting applications, AI and optoelectronic integrated semiconductors for highly integrated data centers, to touch panels for mobile phones.
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