Electronic Components and Semiconductors

SPUTTERCORE CO.,LTD.

Establishment25/Dec/2025
capital1000Ten thousand
addressOsaka/Yodogawa-ku, Osaka-shi/Room 707, 2nd Shin-Osaka Building, 6-3-32 Nishi-Nakajima
phone06-6732-9818
last updated：

SPUTTERCORE CO.,LTD. List of Products and Services

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当社の誇る製品 当社の誇る製品
合金ターゲット

合金ターゲット

合金ターゲット

C18150(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity > 98.0% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method * For more details, please download the PDF or feel free to contact us.

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C18200(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity: 99.97% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Aluminum Silicon (Al-Si) Target [Alloy Target]

In adjustment.

For more details, please download the PDF or feel free to contact us.

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Aluminum Titanium (Al-Ti) Target

Aluminum Titanium (Al-Ti) Target

■Al, Ti ratio tolerance:+/-0.3wt% ■Segment difference possible ■Surface finish<Ra1.6a ■No scars, no broken edges *For more details, please download the PDF or feel free to contact us.

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Aluminum Neodymium (Al-Nd) Target

Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.

■ Purity: 99.95% ■ Density (2.72 g/cm³) ■ Usable AlNd ratios (wt%): 90:10; 94:6; 98:2, etc. ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.*

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Tungsten Titanium (W-Ti) Target

Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.

■ Purity: 99.95% ■ Density (19.3 g/cm³) ■ Manufacturing Method: Powder metallurgy *For more details, please download the PDF or feel free to contact us.*

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Nickel-Vanadium (NiV) Target

Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.

■ Purity: 99.5% ~ 99.9% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Nickel-chromium (NiCr) target

Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!

■ Purity: 99.5% - 99.95% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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Nickel-Copper (NiCu) Target

Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.

■ Purity: 99.9% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

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