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Electronic Components and Semiconductors
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ワールドリンク

capital600Ten thousand
addressOsaka/Ikeda-shi/Asahi Hill 1-4-7
phone072-736-9959
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last updated:Feb 13, 2026
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ワールドリンク Product Lineup

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Horizontal transport PTH device | Uniform processing of high aspect ratio vias and yield improvement

Uniform electroless copper plating even with adjacent holes of different sizes. Prevents residue with 10μm filtration and optimal fluid control, ensuring stable transport of ultra-thin materials. Ideal for HDI substrates.

"Mastering Through-Hole Technology for High-Density HDI Board Connection Reliability" Höllmüller PTH by TSK provides maximum yield for high aspect ratio holes and vias in increasingly miniaturized HDI and multilayer boards. - Uniform Liquid Replacement and Processing Quality Even in complex layouts with adjacent large and small holes, our unique fluid control achieves uniform processing within all vias. This fundamentally supports connection reliability in the electroless copper plating process. - Stable Transport of Ultra-Thin Materials We have established a system that can stably transport ultra-thin materials, which are prone to damage, without wrinkles or folds. - Thorough Contamination Management (10μm Filtration) Equipped with an inline 10-micron cartridge filter. This enhances the cleanliness of the chemicals and thoroughly eliminates fine residues that can cause plating defects. - High Durability and Maintenance Design The main body adopts a robust PP (polypropylene) structure with a thickness of 15mm. Each module is equipped with a glass cover, balancing visibility of operational status and ease of maintenance.

  • Circuit board processing machine

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Laser processing machine for DCB/AMB substrates | Minimum hole diameter 30μm, accuracy 5μm

Achieves a minimum hole diameter of 30μm and a machining accuracy of ±5μm. Suppresses thermal effects on DCB and AMB substrates with a picosecond laser. For cutting, drilling, and pattern formation.

【The Definitive Solution for Heat Dissipation Substrate Processing for Next-Generation Power Semiconductors】 The CR20x0 series is the latest laser system from German company PSG, specialized in the precision processing of DCB (Direct Copper Bonding) and AMB (Active Metal Brazing) substrates, which are essential for power electronics. ■ Pico-Second Laser Processing Pursuing "Zero Thermal Damage" By employing ultra-short pulse lasers, thermal effects on ceramic and copper composite materials are minimized to the extreme. It prevents "cracks," "burrs," and "delamination" that could not be avoided with physical cutting tools or long-pulse lasers, ensuring a high-quality finish. ■ Overwhelming Processing Specifications Minimum Hole Diameter 30μm: Capable of processing extremely small vias with high circularity. Processing Accuracy ±5μm: Maintains extremely high positional accuracy over a wide range due to all-axis linear motor drive and high-resolution glass scales. Compatible with a Variety of Materials: Proven high performance with various ceramic materials such as Al2O3, AlN, and Si3N4.

  • Circuit board processing machine

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Hollmuller by TSK Desmia Device

Efficient cleaning and conditioning of holes and beers.

Höllmüller Desmear achieves yield improvement and reduction of maintenance effort by combining over 40 years of experience in system construction with many innovative technologies.

  • Printed Circuit Board

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Hollmuller by TSK Stripping Device

High aspect ratio structure zero residue stripping

The latest integrated recovery unit enables the rapid removal of stripped resist.

  • Circuit board processing machine

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Hollmuller by TSK Developing Equipment

Uniform and highly reproducible fine line developing

• Inheriting the world-standard wet process technology "Höllmüller" • To achieve sharp finishes on ultra-fine line edges, we employ specialized fluid control and vibration technology.

  • Circuit board processing machine

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High-precision laser drilling device (UV) with a minimum beer diameter of 5μm or more.

Laser system for drilling and routing large substrates using green laser.

In the manufacturing of UHDI (Ultra High Definition Substrates) and IC package substrates, we achieve both ultra-fine via processing that exceeds conventional limits and high throughput. With ultra-high precision of ±5μm, this directly contributes to improved yield.

  • Circuit board processing machine

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PSG Laser Depaneling Device

Fully automated inline high-speed laser depaneling machine that enables integration into assembly lines.

This is the laser depaneling device proudly offered by the Photonics Systems Group. With the double laser head option, it provides extremely fast throughput!

  • Circuit board processing machine

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Hollmuller by TSK Horizontal Wet Etching Equipment

Achieving excellent process uniformity and easy maintenance access!

• Etching of printed circuit boards (PCBs), PCM metal parts, and DCB/AMB • Etching treatment using alkaline, acidic, and ferric chloride solutions

  • Etching Equipment

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World Link LLC Business Introduction

"I want to increase uniformity more," "It's inevitable that liquid unevenness occurs with ultra-thin materials," such concerns can be resolved all at once!

Our company provides services as the domestic agent for "TSK SCHILL GmbH," a manufacturer of PCB (printed circuit board) manufacturing equipment, and "Photonics Systems Group," a manufacturer of laser equipment. We offer overwhelming support speed that can only be realized in Japan. We have the agility to "respond to customer inquiries on the spot." With the precise perspective cultivated as engineers and a network built across the globe, we will engage in honest business practices. 【Business Activities】 ■ Agency services for overseas semiconductor and PCB equipment manufacturers (TSK Schill GmbH, Photonics Systems Group) ■ iPhone repair services and sales of iPhone cases ■ Operation of an online shop ■ Purchase and sale of used iPhones (purchase of junk items → sale of parts) ■ Planning and sales of drones ■ VISA-related services *For more details, please download the PDF or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Used goods purchase

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