Advanced horizontal etching for PCB/PCM. VACU-Etch technology ensures 1-mil line uniformity by eliminating the puddle effect.
The Höllmüller ETCH by TSK Schill is a premier horizontal etching solution specifically engineered for high-end PCB and PCM (Photochemical Machining) production. It is designed to handle the most rigorous requirements for fine-line circuit formation. The system’s defining feature is the proprietary VACU-Etch technology. By optimizing fluid dynamics and using a vertical oscillation spray system, it physically eliminates the "puddle effect" (chemical stagnation) on the substrate surface. This allows for a perfectly uniform etch across the entire panel, enabling stable mass production of 1-mil (25μm) line/space definitions. Built with a robust 15mm thick polypropylene (PP) structure, the Höllmüller ETCH provides exceptional chemical resistance and thermal stability. It is the definitive choice for manufacturers of HDI boards, IC substrates, and high-precision metal parts who cannot compromise on yield or quality.
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basic information
[Process Performance] Etching Capability: Supports ultra-fine 1-mil (25μm) space/trace definitions. Uniformity: Achieves industry-leading etching factors (typically 2–10% variation) through VACU-Etch technology. Compatibility: Suitable for alkaline, acid, and ferric chloride etchants. [Technical Features] VACU-Etch System: Ensures rapid chemical exchange to prevent puddling and over-etching. Oscillation Spray: Vertical oscillation of spray bars ensures consistent coverage across the transport direction. Nozzle Design: High-impact nozzles arranged for maximum surface interaction. [Build & Maintenance] Structure: Heavy-duty 15mm reinforced Polypropylene (PP) or PVDF housing. Bayonet Spray Bars: Tool-less removal system for quick cleaning and minimized downtime. Control: Advanced Industrial PLC Control (Siemens S7-1500 etc.) for precise parameter management and stability.
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Applications/Examples of results
[Core Applications] High-End Electronics: IC Substrates, FC-BGA, and advanced HDI board manufacturing. Precision Machining: Photochemical Machining (PCM) for ultra-thin metal components. Next-Gen Power: Precise etching of thick copper for power semiconductor modules. [Proven Expertise] TSK Schill (Höllmüller legacy) is a global leader in horizontal wet chemistry, with over 900 etching systems successfully installed worldwide. [Why Höllmüller ETCH?] Our etching systems are recognized globally for their ability to deliver high-yield results where conventional horizontal lines fall short. By combining decades of German engineering with the latest in fluid control, we provide a reliable solution for the industry's shift toward miniaturization and higher density.
Detailed information
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An optional recycling unit enables in-line regeneration of the etchant, significantly reducing chemical waste.
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Company information
Our company is the official distributor in Japan for "TSK Schill GmbH," a manufacturer of PCB (printed circuit board) manufacturing equipment. We keep major spare parts (such as nozzle manifolds, pumps, filters, etc.) in stock domestically, allowing for the fastest possible same-day shipping, providing overwhelming support speed that can only be realized within Japan. If you have concerns like "I want to improve uniformity," "I can't avoid liquid unevenness with ultra-thin materials," or "Maintenance is taking too much time," TSK Schill and World Link will solve these issues all at once.
