Horizontal transport PTH device | Uniform processing of high aspect ratio vias and yield improvement

Uniform electroless copper plating even with adjacent holes of different sizes. Prevents residue with 10μm filtration and optimal fluid control, ensuring stable transport of ultra-thin materials. Ideal for HDI substrates.

"Mastering Through-Hole Technology for High-Density HDI Board Connection Reliability" Höllmüller PTH by TSK provides maximum yield for high aspect ratio holes and vias in increasingly miniaturized HDI and multilayer boards. - Uniform Liquid Replacement and Processing Quality Even in complex layouts with adjacent large and small holes, our unique fluid control achieves uniform processing within all vias. This fundamentally supports connection reliability in the electroless copper plating process. - Stable Transport of Ultra-Thin Materials We have established a system that can stably transport ultra-thin materials, which are prone to damage, without wrinkles or folds. - Thorough Contamination Management (10μm Filtration) Equipped with an inline 10-micron cartridge filter. This enhances the cleanliness of the chemicals and thoroughly eliminates fine residues that can cause plating defects. - High Durability and Maintenance Design The main body adopts a robust PP (polypropylene) structure with a thickness of 15mm. Each module is equipped with a glass cover, balancing visibility of operational status and ease of maintenance.

Circuit board processing machine