サンスター技研 List of Products and Services

The "PENGUIN FOAM SYSTEM" is a one-component foaming system that uses a dedicated machine foaming device called "Form Ply" to mix air into a one-component paste material, achieving uniform foaming. It enables various molding processes, including string-like application using sealing robots, injection molding, foaming filling, and casting. Additionally, it generates no harmful gases, contributing to waste reduction and improved working environments. 【Features】 ■ Automation with robots reduces labor and personnel costs - Shortens takt time and lowers costs - Easily accommodates complex shapes ■ Cures instantly at low temperatures (80°C) - Suitable for various plastics that may be at risk of thermal deformation ■ Environmentally friendly foaming improves quality through uniform and fine independent foaming *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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It is a high thermal conductivity material with a high filling of heat dissipation fillers using our company's unique polymer blending technology, and it has the following characteristics.

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Outgassing that occurs under high vacuum can adversely affect components and semiconductor devices. At Sunstar Technology, we focused on the mixing ratios of reactive diluents, hardeners, additives (for barrier layer formation), and main agents/hardeners to achieve ultra-low outgassing properties.

• Other polymer materials

It has excellent resistance to drop impact and temperature cycling, and an improvement in solder joint reliability is expected. We offer a lineup of underfills that are optimal for various applications such as mobile and automotive devices. For more details, please visit our company website.

• Other polymer materials

The urethane-based underfill resin 991 series is designed not only for the analysis of defective IC chips but also with the regeneration of high-value-added substrates in mind. The underfill material (residue) adhered to substrates can be easily removed with a solvent (N-methylpyrrolidone is recommended), making the leveling process simple. There is no risk of damaging the fine wiring of PCBs due to high thermal processing.

• Other polymer materials

The "Penguin Foam System" is a foaming system that uses a dedicated machine foaming device called "Form Ply" to mix air into a one-component paste material, achieving uniform foaming. It enables automatic string-like application (for irregular gaskets) by robots, various filling and molding processes, fine uniform independent foaming, and heating curing at low temperatures (80°C) in a short time. This system contributes to reducing the number of parts and automating processes, improving quality and reducing waste, making it an environmentally friendly system. ■ The foaming quality is stable as it is less affected by temperature and humidity. ■ Being a one-component foaming type, it offers good workability. *For more details, please contact us. □■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□■ For inquiries about other Sunstar Engineering products, please refer to the contact list at the URL below. http://jp.sunstar-engineering.com/corporate/contact.html □■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□■

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