Due to its excellent repairability, the underfill material adhered to the substrate can be easily removed. There is no risk of damaging the fine wiring on the substrate.
The urethane-based underfill resin 991 series is designed not only for the analysis of defective IC chips but also with the regeneration of high-value-added substrates in mind. The underfill material (residue) adhered to substrates can be easily removed with a solvent (N-methylpyrrolidone is recommended), making the leveling process simple. There is no risk of damaging the fine wiring of PCBs due to high thermal processing.
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basic information
【Features】 1. Compared to conventional heat-curing types, it allows for curing at low temperatures and in a short time. ⇒ The temperature required for curing is above 70°C, and it can cure in just a few tens of seconds for thin films. 2. It has excellent repairability. 3. It excels in moisture resistance and electrical insulation. 4. It has excellent storage stability at low temperatures (5-10°C). 5. It has excellent bending fatigue properties. 6. It is a cured product primarily composed of urethane resin, which has high impact/energy absorption capabilities. 7. Its low elasticity makes it ideal for connection reinforcement in ACF/flexible applications. 8. Since it cures at low temperatures, various heating systems can be selected based on the application.
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Applications/Examples of results
Smartphone/portable game console
Line up（2）
| Model number | overview |
|---|---|
| #991 | Cures at low temperature (80 degrees × 10 minutes) possible |
| #991D | High viscosity version of #991 |
Company information
Since its founding, the Sunstar Group has upheld the corporate philosophy of "always serving to enhance people's health and improve the quality of life," providing products and services that are needed in society. Our roots trace back to the manufacturing and sales of bicycle parts, which began in 1932.