FAシンカテクノロジー Product Lineup

The "Shotman" FSH-2533ST tabletop spray fracker is a tabletop-sized spray fracker. It utilizes an XY robot for spraying, enabling precise and highly reproducible application. Its compact size and operation on a 100V power supply make layout changes easy to implement.

• Soldering Equipment

The "Smart Dip L FXL-1" is a model compatible with L-sized circuit boards from the "Smart Dip Series," an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxidation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Additionally, the solder tank is made of cast iron (FC300) to enhance durability. Due to the low flow velocity of the generated waves, this method minimizes copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard automatic setup changeover using QR codes ■ Reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.

• Soldering Equipment

The "Smart Dip II FXM-2" is an inline model of the automatic soldering device from the "Smart Dip Series," which achieves high quality and high stability. It uses a stirring mechanism (our patented technology) to generate waves, promoting heat exchange and performing soldering. This maintains the advantages of reduced oxidation in the stagnant tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow velocity of the generated waves, this method is less likely to cause copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Possible reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.

• Soldering Equipment

The "Smart Dip Return Back Type FZH-4639" is an automatic soldering device that utilizes our patented technology. Thanks to the stirring mechanism (our patented technology), it enables uniform and reproducible soldering. The low flow velocity of the generated waves makes it less likely for copper erosion to occur with lead-free solder. The workpiece returns to the input port, allowing for one-man operation. The operator can remove the workpiece and prepare the next workpiece, such as inserting components, while it returns to their hands. 【Features】 ■ Low flow velocity soldering ■ Compatible with long leads ■ Supports cell production ■ Static tank + stirring soldering method ■ Minimal generation of oxides *For more details, please feel free to contact us.

• Soldering Equipment

The "SSF-200-B3" is a W-wave flow soldering machine that can perform flux application, preheating, soldering, and cooling in a space-saving manner. It allows for optimal condition settings tailored to the circuit board and fine condition adjustments for prototypes. The layout can be easily changed, enabling the construction of dedicated cell lines. 【Features】 ■ Usable for multiple purposes ■ Compatible with single-piece flow cell production ■ Numerical management of solder operation conditions is possible ■ High space efficiency ■ Space-saving design that does not take up much room, making it suitable for installation in laboratories for development and prototyping *For more details, please feel free to contact us.

• Soldering Equipment

The "Smart Dip II FXM-1" is an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxide generation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow rate of the generated waves, this method minimizes the occurrence of copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Reduces daily maintenance time ■ Low oxide generation allows for reduced running costs *For more details, please feel free to contact us.

• Soldering Equipment