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Advantech has played a major role as a global leader in the embedded market. Since early on, it has proposed various industrial solutions, including ETX/XTX in 2006, COM Express 2.0 in 2010, and COM Express 3.0 (Type 7) in 2017. Currently, Advantech is collaborating with top companies belonging to PICMG to realize the new "COM-HPC" series. 【Catalog Contents】 ◆ Major Technology Leader Driving Industrial Standards ・ Cutting-edge computing achieving server-grade at the edge: COM-HPC ・ Large-scale deployment of IoT devices with x86 & RISC designs: SMARC ◆ Case Studies 【Network】 High-reliability COM Express Type 7 module for outdoor workstations that is easy to manage 【Medical】 Powering up ultrasound diagnostic equipment with the cutting-edge Quadro Flow Cooling System (QFCS) 【Defense】 Successfully reducing SWAP for military portable communications with computer-on-module 【In-flight Entertainment】 More flexible design and scalability for in-flight entertainment with COM Express

【Main Features of the Product】 ◆ Intel Xeon D Processor (16Core/TDP 110W) ◆ Maximum 512GB Memory (x8 288pin RDIMM/LRDIMM) ◆ Up to 45 lanes PCIe Gen. 3 (x16, x8, x4, x1), 4x USB 3.0 ports, & 2x SATA III ports ◆ Up to 4x 10GBASE-KR ports, and 1x 1000BASE-T port ◆ COM Pin Layout: COM-HPC Server type ◆ Board Size: Size E 200 x 160 mm (0.65 x 0.52 in)

Main Features of This Product ■ COM Express Mini Type 10 ■ Intel Tiger Lake UP3 Processor ■ 16GB LPDDR4X 4266MT/s and IBECC Support ■ USB4 Compliance Supported by Carrier Board Design ■ Onboard NVMe SSD ■ Operating Temperature: Standard 0 to 60°C, Extended -40 to 85°C

SOM-6872 delivers excellent performance with 8 cores, 16 threads, turbo boost (up to 4.25GHz), and supports 4x 4K displays. It also features a diverse range of built-in I/O, providing outstanding graphics performance without the need for additional GPU cards. This solution is ideal for graphics-intensive applications such as digital signage, medical imaging, machine vision, and gaming. 【Key Features of This Product】 ◆ COM Express R3.0 Compact Type 6 module equipped with AMD Ryzen Embedded V2000 SoC ◆ Supports 2 x DDR4-3200 SODIMM dual-channel memory, up to 64GB of ECC/non-ECC memory ◆ USB 3.2 Gen2×2, PCIe x8 Gen3×1, PCIe x1 Gen3×8, GbE×1, SATA 3.0×2 ◆ Supports a wide operating temperature range (0 to 60°C) ◆ Supports 4 x 4K displays (DP++, HDMI, VGA, LVDS) ◆ Thermal solution "QFCS" enables 100% CPU performance without throttling

The "SOM-6883" is an AI acceleration-enabled product equipped with the 11th generation Intel Core processor based on a 10nm microarchitecture, combining both CPU and GPU. It offers excellent computing performance that is up to 25% faster compared to the previous model, along with 2.95 times the graphics performance, low power consumption, and immediate responsiveness for real-time communication. Additionally, it is the first COM Express Compact module to support up to four independent 4K outputs or two 8K HDR outputs, thanks to the Intel Iris Xe GPU, which can configure up to 96 GPU cores and dual video decoder boxes. 【Key Features of this Product】 ■ 11th Generation Intel Core Processor U Series ■ COM Express R3.0 Compact Module Type 6 pin layout ■ Dual channel with 1 x memory down and 1 x SODIMM ■ High-speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ■ Up to 64GB onboard NVMe x4 SSD, TPM 2.0

**Main Features of the Product** ◆ SMARC V2.1 standard module equipped with Intel Elkhart Lake processor ◆ Supports up to 16GB of LPDDR4 (3200MT/s) with IBECC, 2 to 4 core CPU for specific SKUs ◆ 3x independent displays: LVDS (1920 x 1200 @ 60Hz / eDP), DP++ (up to 4096×2160 @ 60 Hz), and HDMI (up to 3840x2160 @ 30 Hz, 4096×2160 @ 60 Hz) ◆ 4x PCIe x1, 2x GbE LAN supporting TSN, 2x USB 3.2 GEN2, 4x USB 2.0, 14x GPIO ◆ 1x UFS onboard, 1x SATA III ◆ Operating temperature: Standard 0 to 60°C, Extended -40 to 85°C ・Compatible with Advantech iManager & WISE-DeviceOn

【Main Features of the Product】 ◆ COM Express R3.0 Basic Module Type 7 pin layout ◆ Intel Xeon Processor D-1500 product family ◆ Size: 125 x 95 mm ◆ ECC-equipped solder-down memory ◆ High-speed Ethernet (dual 10GBASE-KR interface, 1x GbE) ◆ Rich expansion (PCIe x16, PCIe x8, 8 PCIe x1) ◆ Supports iManager, WISE-PaaS / DeviceOn, and embedded software APIs

【Main Features of the Product】 ◆ Equipped with 8th Generation Intel Core Processor U-Series (Whiskey Lake) ◆ COM Express R3.0 Compact Module Type 6 Pinout ◆ 2x DDR4 SODIMM (up to 64GB) ◆ High-speed I/O: 4x USB3.1 (Gen2), 1x 6PCIe (Gen3), 4x SATA (Gen3) ◆ Storage: eMMC 32GB, with onboard TPM2.0 ◆ Supports iManager, embedded software API, WISE-PaaS/DeviceOn

【Main Features of the Product】 ◆ COM Express R3.0 Basic Type 7 pin layout ◆ Size: 125 x 95 mm ◆ 2 to 16 core processors, maximum TDP 31W ◆ ECC-equipped dual-channel DDR4 2400, up to 128 GB ◆ High-speed Ethernet (4x 10GBASE-KR interfaces, 1x GbE) ◆ Rich expansion options: (4x PCIe 3.0, 1x GbE, 2x SATA 3.0, 4x USB 3.0) ◆ Supports iManager, embedded software API, and Wise-PaaS / RMM

COM-HPC Client Size C Module with Intel's Next-Generation Socket-Type CPU for Desktops 【Main Features of This Product】 ◆ COM-HPC Client Size C Module ◆ Intel's Next-Generation Socket-Type CPU for Desktops ◆ Up to 16 cores, 24 threads, TDP: 65W ◆ Up to 128GB of dual-channel DDR5 SODIMM (ECC/non-ECC) ◆ 16x PCIe Gen5 + 16x PCIe Gen4 + 10x PCIe Gen3 ◆ Supports iManager, Embedded Software API, and WISE-DeviceOn

【Main Features of the Product】 ◆ Equipped with 6th generation Intel Xeon/Core i7/i5/i3/Celeron ◆ Size: 125 x 95 mm ◆ Dual DDR4 2133, 1.2V Low Power Memory, up to 32GB ◆ Supports XDP and TPM 2.0 ◆ Wide range of I/O connections: PCIe x1 (Gen3) x8 with LAN, TPM 2.0 ◆ Supports iManager SUSIAccess and embedded software API

Ultra-slim design for security and safety applications of mobile devices.

Low-power, compact AI inference system for real-time edge processing.

The "MIC-770 V3 (sold separately)" and the expansion module: "MIC-75GF10" are compatible with MXM GPU cards and provide an exceptional industrial edge AI solution.

- COM Express R3.1 Compact module Type 6 pin configuration - High-performance CPU: AMD RYZEN Embedded 8000, Zen4 up to 8C/16T - Equipped with AMD Radeon RDNA3 graphics, capable of outputting 4K resolution on 4 screens - NPU: AMD XDNA, 16 TOPS - Memory: Dual channel DDR5/SO-DIMM rocket, up to 96GB - High-speed I/O: 2.5GbE, PCIe Gen 4, USB 3.2 Gen2, SATA3.0 - iManager, embedded software API, WISE-DeviceOn compatible *For more details, please download the PDF (English version) or feel free to contact us.

[Advantech × Qualcomm] The Evolution of Intelligence at the Edge: Introducing Innovations in Embedded Platforms and Design-In Services.