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アドバンテック

number of employees350
addressTokyo/Taito-ku/Asakusa 6-16-3
phone03-6802-1021
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last updated:Apr 11, 2025
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Computer

Computer on Module

Computer-on-Module (COM) systems can support your core competency development and reduce the time and effort involved in designing new carrier boards. Advantech's COM series includes COM-HPC, COM-Express, SMARC, ETX, and Qseven, all of which offer design-in services for small form factor designs compatible with the latest Intel and AMD CPUs.

Advantech's computer-on-module products

"Achieving Rapid Application Development with the Latest Technology" A comprehensive introduction to Advantech's COM products and carrier boards.

Advantech has played a major role as a global leader in the embedded market. Since early on, it has proposed various industrial solutions, including ETX/XTX in 2006, COM Express 2.0 in 2010, and COM Express 3.0 (Type 7) in 2017. Currently, Advantech is collaborating with top companies belonging to PICMG to realize the new "COM-HPC" series. 【Catalog Contents】 ◆ Major Technology Leader Driving Industrial Standards ・ Cutting-edge computing achieving server-grade at the edge: COM-HPC ・ Large-scale deployment of IoT devices with x86 & RISC designs: SMARC ◆ Case Studies 【Network】 High-reliability COM Express Type 7 module for outdoor workstations that is easy to manage 【Medical】 Powering up ultrasound diagnostic equipment with the cutting-edge Quadro Flow Cooling System (QFCS) 【Defense】 Successfully reducing SWAP for military portable communications with computer-on-module 【In-flight Entertainment】 More flexible design and scalability for in-flight entertainment with COM Express

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[COM-HPC] Embedded CPU Board, SOM-8990

Cutting-edge computing that achieves server-grade performance at the edge with Intel Xeon!

【Main Features of the Product】 ◆ Intel Xeon D Processor (16Core/TDP 110W) ◆ Maximum 512GB Memory (x8 288pin RDIMM/LRDIMM) ◆ Up to 45 lanes PCIe Gen. 3 (x16, x8, x4, x1), 4x USB 3.0 ports, & 2x SATA III ports ◆ Up to 4x 10GBASE-KR ports, and 1x 1000BASE-T port ◆ COM Pin Layout: COM-HPC Server type ◆ Board Size: Size E 200 x 160 mm (0.65 x 0.52 in)

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COM Express embedded CPU board, SOM-7583

Server-grade specifications for big data analysis equipped with Intel Tiger Lake! (COM Express Mini)

Main Features of This Product ■ COM Express Mini Type 10 ■ Intel Tiger Lake UP3 Processor ■ 16GB LPDDR4X 4266MT/s and IBECC Support ■ USB4 Compliance Supported by Carrier Board Design ■ Onboard NVMe SSD ■ Operating Temperature: Standard 0 to 60°C, Extended -40 to 85°C

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AMD Ryzen V2000 equipped COM Express

Achieve powerful performance in a compact COM Express form factor!

SOM-6872 delivers excellent performance with 8 cores, 16 threads, turbo boost (up to 4.25GHz), and supports 4x 4K displays. It also features a diverse range of built-in I/O, providing outstanding graphics performance without the need for additional GPU cards. This solution is ideal for graphics-intensive applications such as digital signage, medical imaging, machine vision, and gaming. 【Key Features of This Product】 ◆ COM Express R3.0 Compact Type 6 module equipped with AMD Ryzen Embedded V2000 SoC ◆ Supports 2 x DDR4-3200 SODIMM dual-channel memory, up to 64GB of ECC/non-ECC memory ◆ USB 3.2 Gen2×2, PCIe x8 Gen3×1, PCIe x1 Gen3×8, GbE×1, SATA 3.0×2 ◆ Supports a wide operating temperature range (0 to 60°C) ◆ Supports 4 x 4K displays (DP++, HDMI, VGA, LVDS) ◆ Thermal solution "QFCS" enables 100% CPU performance without throttling

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COM Express with 11th Generation Intel Core

Excellent performance with the 11th generation Intel 10nm processor and Iris Xe graphics!

The "SOM-6883" is an AI acceleration-enabled product equipped with the 11th generation Intel Core processor based on a 10nm microarchitecture, combining both CPU and GPU. It offers excellent computing performance that is up to 25% faster compared to the previous model, along with 2.95 times the graphics performance, low power consumption, and immediate responsiveness for real-time communication. Additionally, it is the first COM Express Compact module to support up to four independent 4K outputs or two 8K HDR outputs, thanks to the Intel Iris Xe GPU, which can configure up to 96 GPU cores and dual video decoder boxes. 【Key Features of this Product】 ■ 11th Generation Intel Core Processor U Series ■ COM Express R3.0 Compact Module Type 6 pin layout ■ Dual channel with 1 x memory down and 1 x SODIMM ■ High-speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ■ Up to 64GB onboard NVMe x4 SSD, TPM 2.0

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【SMARC】Embedded CPU Board, SOM-2532

"Elkhart Lake equipped" x86 & RISC design for large-scale deployment of IoT devices!

**Main Features of the Product** ◆ SMARC V2.1 standard module equipped with Intel Elkhart Lake processor ◆ Supports up to 16GB of LPDDR4 (3200MT/s) with IBECC, 2 to 4 core CPU for specific SKUs ◆ 3x independent displays: LVDS (1920 x 1200 @ 60Hz / eDP), DP++ (up to 4096×2160 @ 60 Hz), and HDMI (up to 3840x2160 @ 30 Hz, 4096×2160 @ 60 Hz) ◆ 4x PCIe x1, 2x GbE LAN supporting TSN, 2x USB 3.2 GEN2, 4x USB 2.0, 14x GPIO ◆ 1x UFS onboard, 1x SATA III ◆ Operating temperature: Standard 0 to 60°C, Extended -40 to 85°C ・Compatible with Advantech iManager & WISE-DeviceOn

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COM Express Embedded CPU Board SOM-9590

Equipped with Intel Xeon D, capable of operating in harsh environments! Robust COM Express Type 7 module.

【Main Features of the Product】 ◆ COM Express R3.0 Basic Module Type 7 pin layout ◆ Intel Xeon Processor D-1500 product family ◆ Size: 125 x 95 mm ◆ ECC-equipped solder-down memory ◆ High-speed Ethernet (dual 10GBASE-KR interface, 1x GbE) ◆ Rich expansion (PCIe x16, PCIe x8, 8 PCIe x1) ◆ Supports iManager, WISE-PaaS / DeviceOn, and embedded software APIs

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8th Generation Intel Core Embedded CPU Board

"Compact & Powerful" COM Express Computer-on-Module, SOM-6882

【Main Features of the Product】 ◆ Equipped with 8th Generation Intel Core Processor U-Series (Whiskey Lake) ◆ COM Express R3.0 Compact Module Type 6 Pinout ◆ 2x DDR4 SODIMM (up to 64GB) ◆ High-speed I/O: 4x USB3.1 (Gen2), 1x 6PCIe (Gen3), 4x SATA (Gen3) ◆ Storage: eMMC 32GB, with onboard TPM2.0 ◆ Supports iManager, embedded software API, WISE-PaaS/DeviceOn

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Embedded CPU board with Intel Atom C3000.

"Compact & Powerful" COM Express Computer-on-Module, SOM-5962

【Main Features of the Product】 ◆ COM Express R3.0 Basic Type 7 pin layout ◆ Size: 125 x 95 mm ◆ 2 to 16 core processors, maximum TDP 31W ◆ ECC-equipped dual-channel DDR4 2400, up to 128 GB ◆ High-speed Ethernet (4x 10GBASE-KR interfaces, 1x GbE) ◆ Rich expansion options: (4x PCIe 3.0, 1x GbE, 2x SATA 3.0, 4x USB 3.0) ◆ Supports iManager, embedded software API, and Wise-PaaS / RMM

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【COM-HPC】Embedded CPU Board, SOM-C350

Latest COM-HPC Client Size C computer-on-module equipped with 12th generation Intel Alder Lake.

COM-HPC Client Size C Module with Intel's Next-Generation Socket-Type CPU for Desktops 【Main Features of This Product】 ◆ COM-HPC Client Size C Module ◆ Intel's Next-Generation Socket-Type CPU for Desktops ◆ Up to 16 cores, 24 threads, TDP: 65W ◆ Up to 128GB of dual-channel DDR5 SODIMM (ECC/non-ECC) ◆ 16x PCIe Gen5 + 16x PCIe Gen4 + 10x PCIe Gen3 ◆ Supports iManager, Embedded Software API, and WISE-DeviceOn

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6th Generation Intel Core Embedded CPU Board

Advantech's COM Express Type 6 Computer-on-Module, SOM-5897

【Main Features of the Product】 ◆ Equipped with 6th generation Intel Xeon/Core i7/i5/i3/Celeron ◆ Size: 125 x 95 mm ◆ Dual DDR4 2133, 1.2V Low Power Memory, up to 32GB ◆ Supports XDP and TPM 2.0 ◆ Wide range of I/O connections: PCIe x1 (Gen3) x8 with LAN, TPM 2.0 ◆ Supports iManager SUSIAccess and embedded software API

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NVIDIA Jetson Orin NX AI System

AI system based on NVIDIA Jetson Orin NX for mobility

Ultra-slim design for security and safety applications of mobile devices.

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NVIDIA Jetson Orin NX - AI Inference System

NVIDIA Jetson Orin NX 16GB Lightweight AI Inference System (100 TOPS)

Low-power, compact AI inference system for real-time edge processing.

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GPU expansion module for AI applications compatible with the MIC-7 series.

NVIDIA MXM GPU expansion module for MIC-7 series compatible AI applications

The "MIC-770 V3 (sold separately)" and the expansion module: "MIC-75GF10" are compatible with MXM GPU cards and provide an exceptional industrial edge AI solution.

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Edge Intelligence - Edge AI Solution SOM-6873

AMD Ryzen Embedded 8000 equipped COM Express Compact Module Type 6

- COM Express R3.1 Compact module Type 6 pin configuration - High-performance CPU: AMD RYZEN Embedded 8000, Zen4 up to 8C/16T - Equipped with AMD Radeon RDNA3 graphics, capable of outputting 4K resolution on 4 screens - NPU: AMD XDNA, 16 TOPS - Memory: Dual channel DDR5/SO-DIMM rocket, up to 96GB - High-speed I/O: 2.5GbE, PCIe Gen 4, USB 3.2 Gen2, SATA3.0 - iManager, embedded software API, WISE-DeviceOn compatible *For more details, please download the PDF (English version) or feel free to contact us.

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Advantech Qualcomm Solution Book

Qualcomm introduces its latest embedded solutions.

[Advantech × Qualcomm] The Evolution of Intelligence at the Edge: Introducing Innovations in Embedded Platforms and Design-In Services.

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