ヒューブレイン List of Products and Services

High-speed inspection is performed using logic dedicated to green sheet pattern inspection, and bad markings are automatically applied to defective areas.

Employees of Hubrain Co., Ltd. each have rich personalities and are always aiming to become higher-level engineers. The work of technological development always involves trial and error. We value an environment where we can challenge unknown fields with free thinking, without fearing failure. We believe that incorporating a performance-based evaluation system with a principle of positive thinking will nurture each individual's motivation, leading to good work. Although we are still a small group, we want to walk forward strongly with dreams of soaring high into the future. For more details, please contact us or refer to our catalog.

Hube Brain Co., Ltd.'s Shinshu Matsukawa office consistently designs and manufactures visual inspection machines for electronic components. The image processing unit is equipped with in-house products, and all image inspection logic is developed in-house, allowing us to respond to diverse needs in a short period. We have two screening rooms where we thoroughly conduct lighting tests and other evaluations that significantly affect the success of image inspections. We provide handlers suitable for image inspections. For more details, please contact us or refer to our catalog.

The tray appearance inspection device scans the camera with an XY-axis robot and continuously inspects each workpiece arranged on the tray at high speed. With a parallel configuration of a color camera and a high-resolution monochrome camera, it reliably detects even fine scratches and stains. After inspecting all the workpieces through imaging, it automatically ejects defective products from the tray and also performs the repacking of good products. Up to 100 different types can be set. For more details, please contact us or refer to the catalog.

The 2-stage type general-purpose flat appearance inspection device moves the camera and tray using an XY-axis robot to continuously inspect the workpieces arranged in the tray at high speed. By exchanging trays, it is possible to inspect either individual pieces or substrates within the tray. For individual piece inspection, it is possible to add mechanisms for defective product ejection, good product replenishment, and orientation alignment. For substrate inspection, bad marking can be performed. To enhance image inspection capability, it is designed for parallel processing with a high-pixel color camera and a monochrome camera. It reliably detects fine defects and stains. To increase inspection takt time, the system performs parallel processing on a separate stage for image processing and other functions. For more details, please contact us or refer to the catalog.

The PV module appearance inspection system captures images of PV modules using a high-resolution line sensor camera to detect defects and output NG signals, inspecting with high precision for issues such as "misalignment of output lines," "pitch between cells," and "chips and cracks in cells." We accept inquiries regarding all appearance inspection processes in the module manufacturing process, including glass inspection for modules and bubble inspection after resin sealing. Additionally, since we have developed our own inspection software, we can respond quickly to any additions or changes after delivery. Furthermore, as we manufacture the image processing unit and the transport components in-house, we can flexibly accommodate your requirements. For more details, please contact us or refer to our catalog.

The PV-Cell appearance inspection system captures images of PV cells using a high-resolution color camera to detect defects and output NG signals. Thanks to our unique technology, it is capable of canceling out the patterns of polycrystalline materials to detect fine defects. Inspections can be performed for printing patterns, cracks, chipping, dimensions, and it is also compatible with inline inspections. Depending on the application, high-resolution 2D cameras and line sensors can be selected for use. Additionally, because we have developed our own inspection software, we can respond quickly to any additions or changes after delivery. Furthermore, since the image processing unit and the transport components are manufactured in-house, we can flexibly accommodate your requirements. For more details, please contact us or refer to our catalog.

The sheet appearance inspection system detects black spots and dirt on continuously flowing plain sheets through image inspection. It is also capable of detecting fisheyes on resin sheets. The NG detection area is displayed with a square frame mark, and it can be enlarged for better visibility. Up to 10 NG images can be stored, allowing inspections to continue while displaying the NG images. Thanks to encoder pulse tracking, inspections can be performed with consistent accuracy even when the speed changes. The NG detection history can be printed and saved at the end of each roll, and images of the NG detection area are also saved, allowing for verification after the inspection is completed. Additionally, the variety registration function enables easy switching between different shapes of sheets for inspection. Furthermore, it detects pinholes, liquid splashes, wrinkles, and slurry lines on continuously flowing electrode foils (positive and negative). Labels can be affixed to the edges of the detected areas. For more details, please contact us or refer to the catalog.

The multifunctional image processing engine is a versatile image inspection machine that can meet various inspection requirements through a combination of different functions. It is equipped with convenient features such as rotation position tracking and polygon windows, allowing for highly flexible inspection settings to be easily configured. Leveraging the experience and know-how of a specialized image inspection manufacturer, it enables fast and high-precision inspections. While it comes standard with a monochrome 2D camera, options for a 1D camera, color camera, high-precision camera, and multiple camera connections are also available. It is possible to display marks for NG detection and to enlarge NG areas, as well as to store a certain number of NG image histories, allowing inspections to continue while displaying NG images. With Windows OS, file management is easy, and communication functions can be utilized. The variety registration function allows for easy switching between different types of work for inspection. For more details, please contact us or refer to the catalog.

The "Wafer Chip Appearance Inspection System HM-256 Series" features a standard 3CMOS 3.2 million pixel color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer and dicing processes. It can inspect appearance defects that occur during the wafer and dicing processes with high speed and precision, allowing for the inspection of various chip patterns. 【Features】 ■ Inspection with variable image resolution (1.5 to 5µ) for each type ■ Inspection at sub-micron resolution possible with an embedded microscope (optional) ■ Defect classification based on complex conditions of image features ■ Inspection using multiple recipes (different image resolutions, lighting, and judgment programs) in a single run *For more details, please download the catalog or feel free to contact us.

The "Low-Cost Version Wafer and Chip Appearance Inspection System HMWF-A2000" is an appearance inspection device equipped with a high-resolution color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer processing and dicing. It can inspect appearance defects occurring in the wafer and dicing processes with high speed and precision, and is capable of inspecting a variety of chip patterns. 【Features】 ■ Capable of inspecting a variety of chip patterns. ■ Can capture features for each defect item through image processing and classify defects (categorization function). ■ The accumulated software technology significantly reduces the total cost of the device. *For more details, please contact us or download the catalog to view.

This product is a "Free Angle Appearance Inspection Device" equipped with a 2-axis rotating robot. The robot hand is equipped with arbitrary angle setting functionality and a rotating mechanism, allowing it to position the workpiece at angles and locations suitable for image inspection. It features a "parallel processing function" that inspects alternately using two hands, and a "full circumference inspection function" that transfers the workpiece from hand 1 to hand 2 for execution. The hand tip can accommodate various shapes such as chuck mechanisms and suction mechanisms, making it compatible with a variety of workpiece shapes. 【Features】 ■ Equipped with a 2-axis rotating robot ■ Lower price than conventional models ■ High-functionality image inspection system ■ Equipped with parallel processing and full circumference inspection functions ■ Compatible with various shapes *For more details, please refer to the PDF document or feel free to contact us.

The "High-Performance Tabletop Appearance Inspection Machine" is a compact tabletop inspection machine that uses a tabletop robot and has a footprint of 900×900 (mm) or less. Using our self-developed high-performance inspection software, it can accommodate various shapes of workpieces. The inspection results are displayed in real-time on a monitor in the form of an NG map, allowing for quick understanding of the product status. Despite its low price, it offers high-performance appearance inspection that is not inferior in quality. 【Features】 ■ Tabletop robot specification ■ Compatible with various shapes of workpieces ■ Easy inspection with a user-friendly interface ■ Inspection results displayed in real-time on a monitor in NG map format ■ Quick understanding of product status *For more details, please refer to the PDF document or feel free to contact us.

Our company manufactures appearance inspection equipment for optical communication and high-frequency components, devices, and modules, which are difficult to inspect due to their complex shapes. Leveraging the optical engineering capabilities we have cultivated over many years as a specialized manufacturer, along with our unique advanced image processing technology, we can accommodate products of various shapes. We are also building a production management system as part of IoT, which includes information communication with upper servers, feedback to previous processes, and large-capacity storage of inspection results (optional). 【Features】 ■ Flexible design allows imaging from angles suitable for detecting defects ■ By implementing a remote system, software can be edited from distant locations ■ Remote real-time checking of ladders to identify problematic areas ■ Broadly accommodates scratches, component bending, misalignment of mounted parts, adhesive failures, discoloration, and unevenness *For more details, please refer to the materials. Feel free to contact us with any inquiries.

The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.

The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.

Hubbrain Inc. will be exhibiting at the 37th Electro Test Japan held at Tokyo Big Sight. We plan to showcase our "Crack Inspection Device (with AI)", "Wafer Inspection Device", "Line Camera Photometric Stereo", and "Line Camera Type 3D Inspection Device". We sincerely look forward to your visit. 【Exhibited Products】 ■ Crack Inspection Device (with AI) ■ Wafer Inspection Device ■ Line Camera Photometric Stereo ■ Line Camera Type 3D Inspection Device *For more details, please refer to the PDF document or feel free to contact us.

The "Free Angle Multi-Surface Inspection Device" utilizes a robotic hand to inspect products from various angles, such as sides and edges, similar to visual inspection. It captures images of products on a tray using suction transport and enables high-precision judgment through a combination of proprietary software and AI image processing. With a simple change of the suction mechanism at the hand's tip, it can accommodate a wide range of product varieties and sizes, allowing for efficient inspections. 【Features】 ■ Well-suited for inspecting modular products and products with leads ■ Efficiently conducts inspections for small quantities of diverse products ■ Equipped with multiple optical systems, capable of detecting various defects ■ Supports automated inspections using loaders and unloaders ■ The supply section can also handle products in bulk *Please refer to the accompanying materials. Feel free to contact us with any inquiries.

The "DLP-type 2D + 3D sensor" is a product that performs high-speed 3D inspection of various products. The Z accuracy is 2μm, and it can accommodate XY sizes up to 1m x 1m, with a cycle time of up to 0.05 seconds. We also offer options that can be added to existing 2D inspections. Please feel free to contact us when you need assistance. [Support] ■ Development support for both hardware and software ■ Addressing blind spots in three-dimensional workpieces ■ Support for composite materials and brightness unevenness *For more details, please download the PDF or feel free to contact us.

We would like to introduce our "Wafer Appearance Inspection System." This system can inspect appearance defects that occur during the wafer process at high speed and with high precision. The inspection targets include LSI, LD, Di, LED, power semiconductors, compound semiconductors, and MEMS. Examples of defects inspected include chipping, cracking, scratches, pattern anomalies, foreign objects, coating defects, and misalignment. 【Features】 ■ Functions can be selected according to inspection requirements - Micro inspection, macro inspection - Color inspection, monochrome inspection - Area camera, line camera - Surface inspection, front and back inspection ■ High-precision inspection is possible with a wide range of optional features *For more details, please download the PDF or feel free to contact us.