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  5. Visual Inspection Equipment
  6. Wafer Appearance Inspection Equipment (Before Dicing)

Wafer Appearance Inspection Equipment (Before Dicing)

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last updated:Oct 17, 2022

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Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.

The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.

    Visual Inspection Equipment
2022-10-17_14h33_05.png

Wafer Appearance Inspection Equipment (Before Dicing)

2022-10-17_14h33_05.png
2022-10-17_14h33_05.png 2022-10-17_14h34_30.png 2022-10-17_14h34_39.png 2022-10-17_14h34_50.png
  • Related Link - https://hu-brain.co.jp/products/%e3%82%a6%e3%82%a7…
  • Special site - Product/service details - https://pr.mono.ipros.com/hu-brain/product/

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【Specifications (Example)】 ■Camera  ・5 million pixel monochrome area camera (micro inspection)  ・12 million pixel monochrome area camera (macro inspection)  ・25 million pixel monochrome area camera (alignment) ■Device Size  ・1,350W × 1,350D × 1,800H mm  ・Excluding patrol light and HEPA filter *For more details, please refer to the PDF document or feel free to contact us.

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【Inspection Items】 ■ Scratches, discoloration, foreign substances, pattern misalignment, pattern defects, residual resist, coating defects, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Wafer Appearance Inspection Device (Before Dicing)

Wafer Appearance Inspection Device (Before Dicing)

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37th Electro Test Japan

We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.

  • Seminar・Event

We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.

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Testing, Analysis and Measurement

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At Hube Brain, each employee has a unique personality and is always striving for a higher level of technology. The work of technology development always involves trial and error. We value an environment where we can challenge unknown fields with free thinking, without fearing failure. We believe that adopting a positive mindset in everything, along with a performance-based evaluation system focused on ability and achievements, fosters individual motivation, which leads to good work.

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