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  1. Home
  2. Testing, Analysis and Measurement
  3. ヒューブレイン
  4. We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.
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  • Nov 10, 2022
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Nov 10, 2022

We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.

ヒューブレイン ヒューブレイン
We will be exhibiting our flagship wafer chip appearance inspection equipment, as well as crack inspection devices and 3D inspection devices that utilize original technology. 【37th ElectroTest Japan】 https://www.nepconjapan.jp/tokyo/en/about/et.html Date: January 25 (Wednesday) to 27 (Friday), 2023, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2, Booth: 16-48 ■ Exhibited Equipment (planned) - Wafer chip appearance inspection equipment - Crack inspection - 3D inspection - Many other devices will be available for viewing in videos.
Date and time Wednesday, Jan 25, 2023 ~ Friday, Jan 27, 2023
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight East Hall 2, Booth: 16-48
Entry fee Free You need to apply for an invitation ticket to the exhibition (free of charge).
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2022-10-17_14h45_45.png

Selectable image resolution! Wafer chip appearance inspection device (after dicing)

Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.

The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment

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2022-10-17_14h33_05.png

Wafer Appearance Inspection Equipment (Before Dicing)

Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.

The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.

  • Visual Inspection Equipment

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Related catalog(2)

Wafer chip appearance inspection device (after dicing)

Wafer chip appearance inspection device (after dicing)

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Wafer Appearance Inspection Device (Before Dicing)

Wafer Appearance Inspection Device (Before Dicing)

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[Seminar] Future Prospects of the Shipbuilding Industry

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[Lecturer] Professor Hiroyuki Kato, Faculty of Sociology, Department of Social Policy Science, Hosei University [Key Lecture Content] In this lecture, I will introduce perspectives on the shipbuilding industry. Japan's shipbuilding industry has a long history and can be seen as a "microcosm" of Japanese industry. Within about ten years after World War II, Japan's shipbuilding industry became the world leader in construction volume, and at one point, the construction volume of the seven major domestic companies accounted for more than half of the world's share. Although it has since been surpassed in construction volume by latecomers such as South Korea and China, it still maintains a certain level of competitiveness. Reflecting on the path taken by the shipbuilding industry, which serves as a "microcosm," the reasons for its continued strength, and the challenges it currently faces may provide insights when considering the future of various Japanese industries. [Lecture Items] 1. Characteristics of the shipbuilding industry 2. Shipyards seen through photos and videos 3. The shipbuilding industry depicted in films 4. Why is it still strong? 5. Points to consider for future developments 6. Q&A / Business card exchange

Feb 03, 2026

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[Seminar] Corporate Communication Strategies in the Era of Agent-type AI

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[Speaker] Maho Tanaka, Manager, Strategy Group, Business Consulting Division, Accenture Japan Ltd. [Key Lecture Content] AI is evolving beyond a mere tool for operational efficiency to become an entity responsible for execution, including information acquisition, comparison, judgment, contracts, and purchasing. As actions initiated by dialogues with general-purpose AI chatbots like ChatGPT become mainstream, corporate information is not reaching users directly, and the structure where decision-making and execution are completed on AI is rapidly expanding. In this lecture, based on this irreversible change, we will organize the reality that the competitive axis of companies is shifting from "appealing to consumers" to "how AI understands, selects, and executes." Furthermore, we will explain the key points of strategic transformation that management should consider in the era of agent-based AI, from organizing the information structure cited by AI to designing touchpoints that reclaim the initiative for judgment and execution for the company. [Lecture Items] 1. The impact of AI on information search and access 2. The impact on corporate marketing and communication 3. The ideal direction for corporate communication in the AI era 4. Introduction of our company’s case studies 5. Q&A session

Feb 03, 2026

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Event Information

I will be speaking at the WEB seminar hosted by FOOMA JAPAN official service FOOD TOWN.

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The overall theme of the webinar is: "The Two Barriers Hindering Automation in Food Factories" "Case Studies on Access Control and AI Image Recognition" Our company will be the first to present. For more details, please visit our website!

Feb 03, 2026

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[Seminar] The Cutting Edge of AI Glasses

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[Speaker] Yuki Kobayashi, CEO/Co-Founder of MESON Inc. [Key Lecture Content] In this presentation, we will explore "AI glasses," which have recently begun to attract significant attention as the next-generation user interface, explaining their essence and business impact. We will clarify the differences from previous XR devices and organize representative products currently available, while interpreting why AI glasses are becoming a realistic option against the backdrop of the evolution of generative AI and changes in societal acceptance. Furthermore, through market expansion and case studies primarily overseas, we will demonstrate why the years 2026 to 2028 will be a turning point for technology and business, and discuss the issues and risks that Japanese companies should currently address. [Lecture Items] 1. What are AI glasses? 2. Why AI glasses now? 3. Changes happening globally 4. How AI glasses will change work 5. Experience design as a decisive factor 6. The turning point for Japanese companies (Closing) 7. Q&A / Business card exchange *The content of the lecture may change based on the latest trends.

Feb 03, 2026

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[Seminar] "Professional Transformation" to "Live Newly" in the AI Era

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[Speaker] Andy Mochizuki, Director, Deloitte Tohmatsu TMT Division / Monitor Deloitte [Key Lecture Content] In an era where thinking is commoditized by AI, the source of value is determined not by "information" but by "existence," that is, "the meaning of your being." This course will start from the environmental changes surrounding the AI era, exploring the concept of redesigning work in a purpose-driven manner, the type of thinking required in the AI era (QADI cycle), and delving into the absolute differentiating factor that only humans possess—"embodiment." We will update our sense of purpose in the AI era and our collaborative relationship with AI, initiating a transformation to "live anew" from here. [Lecture Items] 1. Mapping Environmental Changes - "From the Era of Information Asymmetry to the Era of Existence Asymmetry" 2. Redesigning Work in a "Purpose-Driven" Manner 3. The "Thinking Models" Necessary in the AI Era 4. The "Body" as an Absolute Differentiating Factor 5. How to "Live Anew" in the Coming AI Era 6. Q&A / Business Card Exchange

Feb 03, 2026

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