We will be exhibiting at "InterNepcon Japan" along with "ElectroTest Japan," which will be held at Tokyo Big Sight from January 25 to 27, 2023.

Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.

The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.

• Visual Inspection Equipment

Selectable image resolution tailored to inspection accuracy! Achieving fast and high-precision inspections.

The "Wafer Appearance Inspection Device (Before Dicing)" is a device capable of inspecting appearance defects that occur in the wafer process with high speed and high precision. Image resolution can be selected according to inspection accuracy (macro inspection with a resolution of approximately 10μm or higher). Additionally, the viewer software includes features such as inspection result map display, NG chip magnification display, and defect classification display (defect items/total inspections/OK/NG). 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ Capable of inspecting appearance defects occurring in the wafer process ■ Auto-focus function (optional) ■ Marking error check function for all units (optional) ■ ID reading and mapping data output function (optional) *For more details, please refer to the PDF document or feel free to contact us.

• Visual Inspection Equipment

Sekisui Filler Co., Ltd. will exhibit at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Automotive Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coatings - Optical adhesives We sincerely look forward to your visit.

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the AUTOMOTIVE ENGINEERING EXPOSITION 2026 YOKOHAMA. At this exhibition, we will be showcasing testing equipment such as Air Leak Tester for EV and Equipment Mounted Type Hydrogen Leak Detector. We sincerely hope you will take this opportunity to visit us. Yours sincerely, [Official Site] https://aee.expo-info.jsae.or.jp/en/yokohama/ [DATES] Wednesday, May 27, through Friday, May 29, 2026 10:00 a.m. - 5:00 p.m. [VENUE] PACIFICO Yokohama, Exhibition Hall, Booth No. ２７４ ※Online Exposition Website：Tuesday, May 19, through Tuesday, June 9, 2026

Our company will be exhibiting at the "JECA FAIR 2026 - 74th Electrical Construction Industry Exhibition" held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday), 2026. At this exhibition, we will introduce products such as the coreless current sensor (for reference), the "PAL-Plus typeE / PAL-Plus typeE2" suitable for simple electric power measurement in factories and facilities, and the management software "CEW-M4" that visualizes and manages power consumption and surplus capacity of equipment. 【Main Exhibited Products】 - Wire-wound coreless current sensor (for reference) - PAL-Plus typeE / PAL-Plus typeE2 - CEW-M4 Please take a look at our solutions that are easy to implement even in confined spaces or where power outage work is to be avoided, and that help solve on-site challenges. We sincerely look forward to your visit.

Troax Safety Systems Co., Ltd. will be exhibiting at "Robot Technology Japan." We plan to showcase various solutions that contribute to safety measures and productivity improvement in robot implementation sites. Please be sure to visit our booth. Venue: Aichi Sky Expo, D64 (Aichi Prefectural International Exhibition Center)