石井工作研究所 Company Profile

Pursuing forward-looking technologies that lead the era. We will continuously create new value.

Our company primarily engages in the development, design, manufacturing, and sales of precision molds and equipment for semiconductor manufacturing. The semiconductor manufacturing process can be broadly divided into the front-end process, which involves processing semiconductor wafers, and the back-end process, which includes connecting and encapsulating individual separated semiconductors to lead frames, cutting and molding from the semiconductor lead frames, marking on the semiconductors, and product inspection. Currently, one of our flagship products is the lead processing machine that cuts and molds the leads (legs) of semiconductors. This lead processing machine is equipped with the world's first extremely compact press machine, "Soft Press," which achieves low noise below the press noise exposure standards and energy savings, significantly improving work efficiency and work environment in the semiconductor manufacturing process, and has received high praise.