カナメックス Product Lineup

The "K" series features new technologies and functions. It is an expandable wet processor that allows for easier and lower-cost upgrades to new workflows. It can be customized for any specifications in wet processes such as resist coating, developing, etching, stripping, and cleaning. We will develop the necessary functions through discussions with our customers, ensuring that we provide optimal equipment at a low cost without excessive specifications. Additionally, since both design and manufacturing are done in-house, we can respond quickly to specification changes after the equipment is installed.

• Other process controls

This is an IPA vapor drying device that automatically raises and lowers a cassette containing the substrate using an elevator. The condensed IPA is collected into a recovery tank.

• Other semiconductor manufacturing equipment

This is a large mask cleaning device compatible with AGVs, featuring chemical treatment, rinsing, and drying. It also allows for dual-side cleaning due to its reversing mechanism.

• Other semiconductor manufacturing equipment

Set the cassette in the loader and transport the substrate using a chemical-resistant clean robot. Chemical processing is done in Chamber A, rinsing in Chamber B, followed by spin drying, and then the processed cassette is stored in the unloader. This is a single-wafer automatic multi-spin processor.

• Other semiconductor manufacturing equipment

This is a sheet-type automatic spin peeling device that sets the cassette in the loader, transports the substrate with a clean robot, and performs peeling treatment, rinsing, and spin drying.

• Other semiconductor manufacturing equipment

Set the substrate in the chuck manually, perform the peeling process, rinse, and spin dry.

• Other semiconductor manufacturing equipment

This is a sheet-type automatic spin developing device that sets the set in the loader, transports the substrate with a clean robot, and performs paddle development, rinsing, and spin drying. It can accommodate two chemical supply tanks or waste liquid tanks (20L) on the side of the main body.

• Other semiconductor manufacturing equipment

Set the substrate in the chuck manually, then perform paddle development, rinsing, and spin drying.

• Other semiconductor manufacturing equipment

Set the substrate manually in the chuck, then perform paddle development, rinsing, and spin drying. A canister can be stored on the side of the main unit.

• Other semiconductor manufacturing equipment

Set the substrate in the chuck manually, then perform spray development, rinsing, and spin drying.

• Other semiconductor manufacturing equipment

It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.

• Other semiconductor manufacturing equipment