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  3. カナメックス 厚木工場
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Electronic Components and Semiconductors
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カナメックス 厚木工場

addressKanagawa/Atsugi-shi/Aikou 2341
phone046-270-7373
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last updated:Dec 27, 2010
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カナメックス List of Products and Services

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Wet Process Equipment K-150/200

Wet process equipment K-150/200 (coating, developing, etching, stripping, cleaning)

The "K" series features new technologies and functions. It is an expandable wet processor that allows for easier and lower-cost upgrades to new workflows. It can be customized for any specifications in wet processes such as resist coating, developing, etching, stripping, and cleaning. We will develop the necessary functions through discussions with our customers, ensuring that we provide optimal equipment at a low cost without excessive specifications. Additionally, since both design and manufacturing are done in-house, we can respond quickly to specification changes after the equipment is installed.

  • Other process controls

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IPA steam drying device VD-200CBT IPA vapor

Equipped with a CO2 gas automatic fire extinguishing system.

This is an IPA vapor drying device that automatically raises and lowers a cassette containing the substrate using an elevator. The condensed IPA is collected into a recovery tank.

  • Other semiconductor manufacturing equipment

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G8 compatible sheet-type spin large mask cleaning device MSC-1500

By using a dedicated chamber for rinsing and drying, precise cleaning is possible.

This is a large mask cleaning device compatible with AGVs, featuring chemical treatment, rinsing, and drying. It also allows for dual-side cleaning due to its reversing mechanism.

  • Other semiconductor manufacturing equipment

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Single-leaf automatic multi-spin processor

By using a dedicated chamber for rinsing and drying, precise cleaning is possible.

Set the cassette in the loader and transport the substrate using a chemical-resistant clean robot. Chemical processing is done in Chamber A, rinsing in Chamber B, followed by spin drying, and then the processed cassette is stored in the unloader. This is a single-wafer automatic multi-spin processor.

  • Other semiconductor manufacturing equipment

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Leaf Automatic Spin Separation Device

The main body can accommodate two tanks for liquid supply or waste liquid (20L) internally.

This is a sheet-type automatic spin peeling device that sets the cassette in the loader, transports the substrate with a clean robot, and performs peeling treatment, rinsing, and spin drying.

  • Other semiconductor manufacturing equipment

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Leaf Spin Stripping Device WSR-200CBT/WSR-300CBT

Device dimensions: 1200W × 1100D × 2000H (200CBT) / 1500W × 1100D × 2000H (300CBT)

Set the substrate in the chuck manually, perform the peeling process, rinse, and spin dry.

  • Other semiconductor manufacturing equipment

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Leaf-type automatic multi-spin processor

By using a dedicated chamber for rinsing and drying, precise cleaning is possible.

The cassette is set in the loader, and the substrate is transported using a chemical-resistant clean robot. Chemical processing is performed in Chamber A, rinsing in Chamber B, followed by spin drying, and then the substrate is stored in the cassette set in the unloader. This is a single-wafer automatic multi-spin processor.

  • Other semiconductor manufacturing equipment

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Sheet-type automatic spin developing device

Device dimensions: 2000W × 1200D × 2000H (200WCBT) / 2000W × 1500D × 2000H (300WCBT)

This is a sheet-type automatic spin developing device that sets the set in the loader, transports the substrate with a clean robot, and performs paddle development, rinsing, and spin drying. It can accommodate two chemical supply tanks or waste liquid tanks (20L) on the side of the main body.

  • Other semiconductor manufacturing equipment

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Single-sheet spin developing machine WSD-200CBT/WSD-300CBT

Device dimensions: 1200W × 1100D × 2000H (200CBT) / 1500W × 1100D × 2000H (300CBT)

Set the substrate in the chuck manually, then perform paddle development, rinsing, and spin drying.

  • Other semiconductor manufacturing equipment

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Organic solvent-based spin development device WSD-200T

Device dimensions: 1700W × 1300D × 1400H

Set the substrate manually in the chuck, then perform paddle development, rinsing, and spin drying. A canister can be stored on the side of the main unit.

  • Other semiconductor manufacturing equipment

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Organic solvent-based spray developing device WSD-150

Device dimensions: 560W × 850D × 1300H

Set the substrate in the chuck manually, then perform spray development, rinsing, and spin drying.

  • Other semiconductor manufacturing equipment

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Wafer Mask Sheet Spin Cleaning Device

Wafer Mask Sheet Spin Cleaning Device

It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.

  • Other semiconductor manufacturing equipment

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