Wafer Mask Sheet Spin Cleaning Device
It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.
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basic information
This is a compact spin cleaning device ideal for R&D purposes. By changing the chuck table, it can clean a wide variety of substrates. <Main Specifications> Compatible Work Size: Wafer: φ8 inches (MAX) Mask: 6025 (MAX) Pure water rinse, brush cleaning, megasonic cleaning (or two-fluid cleaning), N2 gas blow, spin drying (MAX 2000rpm), sequencer control, easy operation via touch panel (GOT), recipe function (20 types, 30 steps), each processing time and operation can be set via the touch panel (swing width, speed, spin rotation speed, etc.).
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Applications/Examples of results
Acceptance cleaning Pre-exposure cleaning Disk cleaning Stamping tool cleaning Particle removal Organic matter removal Post-CMP cleaning Post-backgrind cleaning MEMS
Company information
Kanamex Co., Ltd. has been engaged in the design and manufacturing of wet processing equipment related to photolithography in the semiconductor industry since its establishment. In today's electronics industry, particularly in the semiconductor front-end, advanced packaging technology, and FPD fields, there is an increasing demand for manufacturing processes that accommodate thinner, larger, and more advanced device substrates, as well as devices with higher functionalities, which require innovative manufacturing equipment. To meet the needs of the industry, our company is always alongside our customers, striving to improve customer satisfaction, maintaining a constant research and development mindset, and building innovative technologies to provide products and services that align with industry demands. We aim to conduct vibrant corporate activities as part of our management philosophy and will continue to work towards contributing to the development of society.
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