電子技研 List of Products and Services

<Features> ● Since plasma is generated inside a quartz glass tube, impurities such as particles do not fall onto the treated object, allowing for clean plasma treatment. ● The plasma generation unit has few consumable parts, and with regular maintenance, it can achieve a long lifespan of over 10,000 hours. ● Plasma treatment can be performed at atmospheric pressure, eliminating the need for a vacuum system and reducing capital investment. ● This device is divided into a plasma generation unit and a controller unit, allowing for easy integration of just the plasma generation unit into your existing or new equipment to build an inline system. ● It can perform pinpoint high-speed plasma treatment on targeted areas. ● It comes standard with input/output control functions for customer-side equipment, enabling control of plasma irradiation ON/OFF based on signals from the customer-side equipment.

• Other semiconductor manufacturing equipment

It is possible to reuse the separated permeate liquid from the equipment that collects abrasive particles from waste liquid according to your requirements. Additionally, the absence of heating, such as from heaters, reduces running costs. Maintenance is also easy, allowing for simple cleaning without burdening maintenance personnel. <Features> ★ It concentrates and reduces the volume of polishing waste liquids, such as slurries for semiconductors and back grinders, from a dilution concentration of 1/10 to 1/100. ★ The liquid that has passed through the membrane can be treated to a level equivalent to neutralized wastewater that can be discharged, municipal water, or primary pure water, depending on your requirements. ★ We offer three types of models based on the volume of waste liquid. ★ There are many options available, including automatic cleaning functions that reduce maintenance frequency and remote monitoring. ★ Its compact design allows for installation in existing factories without needing to choose a specific location. ★ It is possible to reduce running costs primarily through pump operation without heating treatment.

• Other semiconductor manufacturing equipment

Our company's modification technology provides surface modification treatments that cannot be achieved through conventional plasma surface treatment (such as organic material removal and temporary hydrophilicity enhancement) by firmly bonding functional groups to the substrate surface. 【Features】 ○ Non-roughening direct plating technology for low dielectric materials and difficult-to-plate materials Direct copper plating without roughening and without an intervening seed layer is possible on materials such as fluororesins, LCP, COP, and polyimide resins. ○ Non-roughening adhesive-free direct bonding technology for difficult-to-bond materials Direct bonding without the use of adhesives is possible between various fluororesins, LCP, COP, and difficult-to-bond resins, as well as between copper and aluminum. ○ Adhesive strength enhancement technology using adhesives By performing surface modification on substrates (metals, ceramics, resins), the adhesive strength of various adhesives can be improved. ○ Surface modification technology for powders - Improved dispersion and adhesion of carbon particles - Enhanced filling degree of various fillers into resins, etc.

• Plasma surface treatment equipment

The "PR Series" is a roll-to-roll processing device capable of plasma treatment under reduced pressure. It can firmly impart various functional groups (such as hydrophilic, lipophilic, adhesion improvement, etc.) to the surface of substrates, starting with resist ashing and insulating film etching, depending on the application. We have a demo unit at our headquarters and are accepting process evaluation treatments at any time. Please contact us for more details. 【Features】 ■ Roll-to-roll type ■ Plasma treatment under reduced pressure - Higher organic removal and surface modification effects compared to atmospheric pressure devices - Capable of processes that were not possible with atmospheric pressure devices (such as various functional group modifications) *For more details, please refer to the PDF materials or feel free to contact us.

• Plasma surface treatment equipment
• Vacuum Equipment
• Other surface treatment equipment

The handheld atmospheric pressure plasma irradiation device "HAPY series" is compact and can store all equipment inside an attaché case. Experiments can be conducted simply by connecting to a He gas cylinder / AC100V power supply. The gas remote discharge method minimizes electrical damage, allowing for safe plasma treatment of various materials. 【Features】 ○ Compact ○ Simple to use; experiments can be conducted by just connecting to a He gas cylinder / AC100V power supply ○ Easy to carry, attaché case size ○ Gas remote discharge method For more details, please contact us or download the catalog.

• Plasma surface treatment equipment
• Plasma Generator

The "PC-RIE series" is capable of providing various surface modification effects on different substrates and films. Of course, it can also perform treatments such as ashing, etching, and descumming as a general plasma treatment device. You can choose a version that suits your needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Functional group modification treatment ○ Reactive Ion Etching (RIE) For more details, please download the PDF or contact us.

• Plasma surface treatment equipment
• Vacuum Equipment
• Other surface treatment equipment

By processing various powders (carbon, metal, resin, ceramics, etc.) while stirring them in a reduced-pressure plasma, it is possible to uniformly modify the surface of fine particles while maintaining a dry environment. Three plasma modes can be selected, allowing for the realization of the optimal process tailored to the desired surface modification. 【Good news for those with these concerns】 ● Struggling with uniform kneading and mixing of powders ● Difficulty in dispersion in liquids ● Wanting to improve adhesion with coatings and binders 【Examples of powder treatment】 ● Nano carbon particles ⇒ Dispersion effect and hydrophilicity without using dispersants. ● PTFE particles ⇒ Imparting hydrophilicity to highly hydrophobic PTFE particles. ● Activated carbon particles ⇒ Increased adsorption capacity through roughening treatment that expands surface area. ● Ni particles ⇒ Surface shape changes through etching treatment. *This is a new technology with great potential. For more details, please download the PDF or contact us. 【We will be exhibiting at a trade show】 Exhibition name: Powder Technology Exhibition 2017 Dates: October 11 (Wed) - October 13 (Fri), 2017 Booth number: 5-65 If you are interested, please stop by!

• Other powder equipment
• Powder Molding Machine
• Other processing machines

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oil (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical processing chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safe specifications suitable for mass production equipment For more details, please contact us or download the catalog.

• Plasma surface treatment equipment

We provide maintenance and servicing for various electronic device manufacturing equipment. We offer support from 24-hour on-site assistance to regular spot inspections, tailored to meet your needs.

• Other semiconductor manufacturing equipment
• CVD Equipment
• Etching Equipment

We can accommodate everything from large chillers to older models. We also offer circuit board repairs. For more details, please contact us.

• Other semiconductor manufacturing equipment
• Thermostatic water bath
• Temperature and Humidity Control

The WET process device, LCD single-sheet etching device, performs etching, shower cleaning, and drying processes for LCD substrates through horizontal transport. The WET device technology from Denshi Giken Co., Ltd., including cleaning spins, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Achieves uniform processes through dip, spray, and oscillation function etching ○ Parallel processing of etching/shower cleaning/drying processes ○ High efficiency of natural drop effect and replacement through substrate inclined washing function For more details, please contact us or download the catalog.

• Circuit board processing machine
• Etching Equipment

The WET process device, LCD cassette cleaning device, cleans cassettes such as LCDs using high-pressure warm pure water spray, followed by drying through hot air blow and tornado spin rotation. The cleaning and spin technologies of Denshi Giken Co., Ltd. can meet the needs of a wide range of industries, including the semiconductor and LCD industries, medical industry, food industry, and others, for cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Achieves space-saving and energy-saving with a simple mechanical design ○ Performs comb cleaning using dedicated nozzles inside the cassette ○ Achieves high-level drying by combining compressed air and spin rotation ○ Adopts a chamber heating system with HOT-FFU For more details, please contact us or download the catalog.

• Other cleaning machines
• Circuit board processing machine

The WET process device LCD mask cleaning equipment cleans LCD masks using brushes and ultrasonic spray, and dries them through high-speed spin rotation. The cleaning and spin technologies of Denshi Giken Co., Ltd. can meet the needs of a wide range of industries, including semiconductors, LCDs, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Soft contact with mask substrates through intelligent control ○ Non-contact mask pattern using a mechanical side grip method ○ Double-sided cleaning technology equipped with an automatic mask inversion mechanism ○ Automatic retrieval and storage mechanism from the mask case ○ Scan spray cleaning using ultrasonic nozzles For more details, please contact us or download the catalog.

• Other cleaning machines
• Circuit board processing machine

The WET process equipment for single-sided substrate cleaning performs UV cleaning, brush cleaning, shower spray cleaning, ultrasonic cleaning, and drying treatment while transporting the substrate horizontally. The WET equipment technology from Denshi Giken Co., Ltd., including cleaning and other spins, can meet the needs of a wide range of industries such as semiconductors, LCDs, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Improved hydrophilicity before shower spray cleaning using UV/O3 ○ Parallel processing of UV cleaning, shower spray cleaning, drying, and other processes ○ High efficiency of natural drop and replacement through substrate inclined washing function For more details, please contact us or download the catalog.

• Circuit board processing machine
• Other cleaning machines

The WET process equipment single-wafer spin processor cleans and rinses the substrate through spin rotation and spraying, followed by drying with high-speed spin rotation. By arranging multiple units, it is easy to achieve multi-process operations (e.g., developing → etching → cleaning, drying). The WET equipment technology from Denshi Giken Co., Ltd., including spin cleaning, can meet the needs of various industries such as semiconductors, LCDs, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Excellent particle removal performance ○ Significant reduction in takt time through high-speed spin cleaning ○ Compact design achieved through space-saving For more details, please contact us or download the catalog.

• Circuit board processing machine
• Other cleaning machines

The WET process device Multi-Spin Processor performs developing/etching/drying processes on substrates using a spray method. The WET device technology from Denshi Giken Co., Ltd., including cleaning and other spin processes, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, starting with wafers and glass substrates, as well as cleaning printed circuit boards and metal substrates for various applications. 【Features】 - Achieves high precision and uniform processes through the combination of spin and spray - Transport by double-hand robot - Parallel processing of developing/etching/drying processes - Equipped with cup cleaning function - Realizes quick drying with N2 blow and high-speed spin rotation For more details, please contact us or download the catalog.

• Circuit board processing machine

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

• Plasma surface treatment equipment
• Vacuum Equipment

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

• Plasma surface treatment equipment
• Vacuum Equipment

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oils (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating the effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical treatment chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safety specifications suitable for use as a mass production device For more details, please contact us or download the catalog.

• Plasma surface treatment equipment