山本鍍金試験器 Product Lineup

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-12 Zincate Zinc Analyzer."

• Analytical Equipment and Devices

This is a notice from Yamamoto Plating Testing Instruments Co., Ltd. regarding the "A-11 Zinc Cyanide Analyzer."

• Analytical Equipment and Devices

This is a notice from Yamamoto Plating Testing Instruments Co., Ltd. regarding the "A-09 Sulfamic Acid Nickel Analyzer."

• Analytical Equipment and Devices

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-08 Nickel Analyzer."

• Analytical Equipment and Devices

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-06 Surface Tension Meter."

• Testing Equipment and Devices
• Other measurement, recording and measuring instruments

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-04A Trichrome Meter Digital Model." In chrome plating, managing trivalent chromium and controlling the iron content as an impurity in hard chrome plating is extremely important. However, the titration method for redox analysis tends to have significant variability in the analytical values, making it difficult for the average person. The analysis method of this product adsorbs and removes hexavalent chromium from the chrome plating solution, allowing for the rapid and accurate measurement of trivalent chromium and iron content using reagents that produce a color change.

• Testing Equipment and Devices

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-03 Chromate Analyzer."

• Testing Equipment and Devices

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "A-01A Sulfamate Electric Meter Set."

• Testing Equipment and Devices

This is a set of the standard type inclined barrel plating device "Shachihoko(TM)." It includes the Shachihoko, heater, water tank, filter, anode plates, etc., making it very convenient for constructing fine plating processes (please specify the type of anode plates). The angle of the drum can be adjusted, allowing for adjustments based on the mixing condition and the occurrence of bubbles. Additionally, by changing the shape of the drum and the fineness of the mesh, it is possible to accommodate various items.

• Other surface treatment equipment
• Plating Equipment

■Features This is a high-performance programmable power supply with a minimum resolution of 10μA, equipped with prediction and calculation functions. It supports Japanese, English, and Chinese (*). CE marking has been implemented. ■Functions Power supply function, temperature control function, PC control, plating experiment prediction (*), data collection and analysis (*), and a slot for expansion functions.

• power supply

It consists of a special tank and fixtures that take into account the current density distribution and the circulation of the plating solution. By using dedicated fixtures, precise plating for semiconductors and MEMS can be performed. Continuous filtration is carried out while creating gentle convection from the bottom of the tank, and it has an overflow structure, available in a single-side overflow type and a two-side overflow type that allows for high-speed stirring. Paddle stirring is used for direct agitation. With 20 years of experience as a plating device for wafers, we have obtained numerous patents. We also accommodate custom requests starting from a single fixture, so please feel free to contact us.

• Other semiconductor manufacturing equipment
• Plating Equipment

It is possible to measure the stress at each plating time (film thickness) with a single measurement. Additionally, stress measurements can be conducted when re-plating on a previously plated film. It can measure fine stresses that conventional stress meters could not detect. It is used by inserting a dedicated stress meter board into the slot of the precision plating power supply YPP series.

• Voltage Meter
• Stress Analysis

This is a notice from Yamamoto Plating Testing Equipment Co., Ltd. regarding the "10-liter and 20-liter tank set."

• Other surface treatment equipment

You can conduct experiments with small sample sizes in a tabletop format. The tank capacity starts from 250ml, allowing tests with small amounts of liquid. * Tank capacities: M1: 300mL, M2: 500mL, M3: 1000mL You can combine it with small filters and heating devices according to your needs. * For those who wish to plate wafers without cutting them, there is also a separate plating experimental device for silicon wafers available.

• Other semiconductor manufacturing equipment
• Plating Equipment

■Features - A high-performance programmable power supply with a minimum resolution of 1mA, equipped with prediction and calculation functions. - Supports Japanese, English, and Chinese (*). - CE marking has been implemented. ■Functions Power supply function, temperature control function, PC control, plating experiment prediction (*), data collection and analysis (*), with slots for expansion functions. ■Applications 5 to 12 inch wafer semiconductors, sensors, MEMS, fine barrels, etc.

• power supply