千住金属工業 List of Products and Services

"D-SOL" is a high-reliability solder for automotive use that meets the stringent durability requirements demanded by automotive manufacturers. The powder adopts Type 5, ensuring readiness for fine pitch applications. Additionally, it is halogen-free (ROL0), reduces whisker formation, and prevents ion migration. It reduces malfunctions caused by leakage current with high electrical reliability. 【Features】 ■ High durability: Maintains the necessary electronic control ■ High density: Expert design anticipating future mounting needs ■ High productivity: Ensures required quality and workability ■ Reduces false reports through quality improvement ■ Enhances inspection quality of mounting, improving perpendicularity *For more details, please refer to the PDF document or feel free to contact us.

• Solder

The "LEO Series" is a Sn-Bi based low-temperature solder suitable for mounting heat-sensitive components and substrates. It uses a low melting point alloy that allows soldering at 200°C, contributing to energy savings, reducing tip wear, and enabling the use of inexpensive materials, which is expected to lower material and manufacturing costs. The emergence of this repairable material accelerates low-temperature mounting using Sn-Bi in reflow ovens. 【Features】 ■ Suppresses the occurrence of splatter ■ Contributes to energy savings and reduces tip wear, leading to cost reduction ■ Allows for good soldering even at a tip temperature of 210°C ■ Development of low-temperature dedicated flux LEO shows good corrosion resistance and insulation properties *For more details, please refer to the PDF document or feel free to contact us.

• Solder

"Clean Metal" is a resin-based sliding bearing that has a porous sintered bronze powder on a back steel. It features a three-layer structure that incorporates a low-friction fluorine-based resin. Additionally, the resin layer serves as a lubricant, allowing for use without oil. Our resin-based sliding bearings are available in types tailored to the required characteristics of low friction, high load, and high rotation. 【Features】 ■ Usable in a wide temperature range from -200°C to +280°C ■ Thin plate thickness enables lightweight and compact design ■ Resin layer, shape, and dimensions can be selected according to the usage environment and required characteristics *For more details, please refer to the PDF document or feel free to contact us.

• Plastic bearings

The "SNR-GT II Series" is a reflow oven equipped with a new flux recovery unit and cooling function that contributes to reducing downtime. We have newly developed a flux recovery system unique to our company, well-versed in the characteristics of solder paste. By selecting and combining multiple units, it maintains recovery efficiency over a long period and enables extended maintenance cycles. 【Features】 ■ Further improvement in productivity ■ Consideration for environmental harmony ■ High functionality made easy to use *For more details, please refer to the PDF document or feel free to contact us.

• Reflow Equipment

Uniform and fine crystal grain size reduces the vacancy concentration and decreases the air-related factors.

• Other metal materials

M705-BPS is a lead-free solder paste developed for fine bump formation. It demonstrates good printability and stencil release at fine pitch, ensuring a stable amount of solder. Additionally, there are no occurrences of voids within the bumps.

• Other metal materials

This is a reflow furnace for microball mounting equipped with features that are well-received in the SNR series.

• Other semiconductor manufacturing equipment

This is the latest reflow furnace for micro soldering that enables wafer-level solder bump formation and face-down mounting of bare chips.

• Other semiconductor manufacturing equipment

The strength is improved by about 1.5 times by reinforcing the ball with flux residue.

• Organic Natural Materials

Unlike the conventional paste method, it achieves cost reduction due to being maskless.

• Other processing machines

Copper core solder materials are solder materials equipped with a spacer function for applications that require package clearance, such as maintaining a constant height like in POP.

• Other semiconductor manufacturing equipment

We supply solder balls that cater to various fields through state-of-the-art equipment that pursues spherical accuracy and a strict management system, aimed at miniaturization and improvement of implementation quality.

• Other semiconductor manufacturing equipment

**Eco Solder Paste S70G** The lead-free solder paste "Eco Solder Paste" is a next-generation environmentally friendly solder paste that resolves issues associated with lead-free conversion, such as storage stability, supply stability, wettability, and heat resistance due to high melting points, compared to conventional solder pastes. □ Features - Maintains viscosity stability through storage and squeegeeing like conventional products - Improved heat resistance, reduced flux scattering, and enhanced reliability - Comprehensive improvement in mounting quality and productivity - Significantly improves suppression of BGA fusion defects - Increased direct electrical inspection post-mounting (Compared to our conventional products) **Lead-Free Solder Compatible Eco Reflow Oven SNR-825** Equipped with a Dragon Blow System and the latest flux recovery mechanism! Achieves high-quality soldering in lead-free applications. □ Features - Ultra-low ΔT achieved with the newly developed Dragon Blow System - Allows for temperature settings per heater, enabling high flexibility in profiles - Standard equipped with the latest flux recovery mechanism, resulting in almost no stickiness inside the oven - Maintains an oxygen concentration of 500 ppm or less inside the oven with a highly airtight muffle structure - Energy-saving due to high-efficiency insulation structure - Achieves high-quality soldering

• Reflow Equipment
• Evaporation Equipment
• Bonding Equipment

This is a notice from Senju Metal Industry Co., Ltd. regarding "local heating solder materials."

• Solder

Solder materials that pursue total cost reduction in flow soldering.

• Solder

This is a notice about "M40" from Senju Metal Industry Co., Ltd.

• Solder

This is an announcement about the "RAM Series" from Senju Metal Industry Co., Ltd.

• Solder

This is a notice from Senju Metal Industry Co., Ltd. regarding "solder materials with spacers."

• Solder

This is an announcement from Senju Metal Industry Co., Ltd. regarding the "HQS Ni Ball Applied Solder Preform."

• Solder

Halogen-Free Eco Solder Paste M705-SHF 【Features】 - No intentional addition of halogen compounds. - The chlorine, bromine, and fluorine content in the flux and solid content is each below 900ppm, with a total below 1500ppm. - Achieves the same surface cleaning effect as conventional products without using halogen-based materials in the flux active components. - Maintains long-term stability with a stable flux design, suitable for continuous work. 【Halogen-Free Flux Sparkle Flux ES-Z-15】 - No intentional addition of halogen compounds. - The chlorine, bromine, and fluorine content in the flux and solid content is each below 900ppm, with a total below 1500ppm. - Rosin-type flux. - Flux residue is less sticky and easy to handle. - No addition of antimony or red phosphorus. 【Halogen-Free Rosin-Containing Solder Eco Solder H2F】 - Halogen-free type flux with excellent workability. - No intentional addition of halogen compounds. - The chlorine, bromine, and fluorine content in the flux is each below 100ppm, with a total below 1500ppm.

• Bonding Equipment
• Other semiconductor manufacturing equipment
• Solder