松尾ハンダ List of Products and Services

The "FLF01-BM(D)" is a laser method that excels in local rapid heating, efficiently releasing outgas even during short-term temperature rises, and achieving excellent finishing for laser soldering applications. There is no occurrence of flux or solder ball scattering, which is a concern due to rapid heating and expansion. Under various conditions, the wetting force of the flux after laser irradiation is good, allowing the flux to spread in a perfect circular shape. 【Features】 ■ Suitable for non-contact soldering with lasers ■ No occurrence of flux or solder ball scattering ■ Flux spreads in a perfect circular shape ■ No residue burning *For more details, please refer to the PDF document or feel free to contact us.

• Other consumables

The "FLF30-AZ" suppresses the growth of intermetallic compound layers due to the intentional addition of Ni, resulting in improved connection reliability. Additionally, it has transitioned from a conventional Ag3% alloy to an Ag1% alloy, and the reduction in the amount of expensive Ag has been mitigated by the new development of flux, which has improved wetting performance. 【Features】 ○ Suppresses the growth of intermetallic compound layers through intentional addition of Ni ○ Improved connection reliability ○ Significant cost reduction by reducing the amount of expensive Ag ○ Improved wetting performance due to the new development of flux ● For more details, please download the catalog or contact us.

• Solder

"STG (RMA type)" is a lead-free solder with flux ultra-low dispersion and residue cracking resistance. It is effective for bends and movable parts. The flux grade is equivalent to RMA, making it a highly reliable product. 【Features of STG】 ○ Significantly reduces flux dispersion. ○ Flux residues are less likely to crack and peel off. ○ The flux grade is equivalent to RMA, ensuring high reliability. ● For more details, please download the catalog or contact us.

• Solder

With innovations in implementation technologies such as SMT and high density, our solder paste continues to evolve. We offer a variety of lead-free and lead-containing solders, as well as fluxes that meet JIS standards, including A-grade, B-grade, low-spatter types, high-workability types, and high-reliability types. For more details, please contact us or refer to our catalog.

• Solder
• Other consumables

Lead-free solder paste FLF01-BZ is developed based on the concept of achieving an excellent total balance, particularly aiming to bring the occurrence of solder balls as close to zero as possible. It demonstrates good wetting properties even on difficult substrates such as nickel, and provides a smooth texture similar to whipped cream, allowing for easy release from the squeegee and achieving good printability. For more details, please contact us or refer to the catalog.

• Solder
• Other consumables

Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝

• Other semiconductors

A long-selling product with excellent reliability and high performance, backed by years of know-how.

• others

The residue can be easily removed by water washing fine flux.

• others

Flux specialized for wettability for devices.

• others

Lead-free solder with good initial wettability and fluidity.

• Solder

Solder with excellent insulation properties and high reliability.

• Solder

High-performance solder with excellent non-cleaning type wetting, spreading, and solder joint reliability.

• Solder

The addition of a new surfactant significantly improved the wettability of the lead-free solder paste.

• others

Pb-free dedicated halogen-free general-purpose post flux

• others

Lead-free solder paste with reduced occurrence of solder balls.

• others

This is an introduction to solder molded products handled by Matsuo Handa Co.

• Solder

Reduce halogenated substances contained in conventional flux to the limit, resulting in environmentally friendly lead-free solder.

• others
• Solder

Lead-free solder that significantly improves the issues of poor conductivity around the camera lens of mobile phones and within electronic components.

• others
• Solder

Especially in the case of flowing solder (pull solder), it demonstrates outstanding cutting performance, free-flowing and entry solder.

• others
• Solder

Low-cost solder containing next-generation recommended lead-free solder alloy.

• Solder

In the soldering process of fine copper wires, lead-free and resin-based solders can significantly suppress copper corrosion caused by solder alloys.

• Solder

Lead-free solder paste that significantly reduces the cleaning and removal processes for solder ball removal.

• Solder

Lead-free solder with good fluidity during high-temperature soldering.

• others
• Solder

Solder paste that suppresses the generation of solder balls (side balls and capillary balls) during reflow.

• Other electronic parts
• others