Micro Module Technology Co., Ltd. Product Lineup

We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. 　Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.

We utilize our implementation technology to conduct prototype and evaluation of functional and performance samples in product development, as well as evaluation samples for construction methods and materials in implementation development, bare chip mounting on special substrates, and micro joining between substrates. In addition to the combinations of materials provided by customers during prototyping, we also propose the best construction methods and material combinations for the requested products. We are capable of mounting on special substrates and accept orders starting from just one prototype.

We provide one-stop support from design to medium-scale mass production of miniaturization and module development using bear chip implementation and micro-joining technology. We accommodate medium-scale mass production ranging from about 10 to 100,000 units per month. Since all processes after dicing are handled in-house, please feel free to consult us for requests for specific tasks or single items.

We have a track record of prototyping and implementing ultra-small sensors and camera modules using bear chip implementation and micro-joining technology. Additionally, we develop, manufacture, and sell our original camera modules under the "IKURA series."

We can develop and manufacture SiC power modules that achieve miniaturization to less than half compared to conventional Si devices and can withstand high temperatures of over 250°C, tailored to custom specifications. These modules can also be integrated into inverters for driving and controlling motors in electric and hybrid vehicles, as well as power conversion devices for solar power generation and emergency storage systems.

“IKURA-M12 Series” and “IKURA-M5” are USB camera modules equipped with a 2-megapixel (2M Pixel) CMOS sensor and compliant with the UVC (USB Video Class) format. Note: Not all UVC commands are supported. They support both YUV (uncompressed) output and MJPEG output, allowing flexible selection according to application requirements and system configurations. The IKURA-M12 Series features a compact 15 mm × 15 mm module size, and lenses can be selected from our standard lineup. The IKURA-M5 is an ultra-compact board-type camera module with a 13 mm × 13 mm footprint. Both models support low-light imaging when connected to an LED board, enabling image capture even in dark environments. 【Main Applications】 ・ Office Automation (OA) Equipment ・ Measuring Instruments ・ Machine Tools ・ AV Equipment ・ Home Appliances ・ Communication Equipment (excluding backbone network applications)

We implement semiconductor bare chips on various circuit boards using a variety of methods. It is possible to mount semiconductor bare chips and peripheral passive components on glass epoxy boards, ceramic boards, three-dimensional wiring boards (MID), flexible boards, glass boards, and silicon boards. Furthermore, we flexibly handle the development, prototyping, and small to medium-scale production of small modules and semiconductor packages, including BGA packages, power modules, and image sensor packages. We also perform specific tasks such as wire bonding only and special mounting, accepting orders starting from just one piece.

We have our own factory with a clean room located at our headquarters in Yokohama City. To conduct responsible development with an eye on quality, productivity, and cost during mass production, we are building an environment that allows for manufacturing verification, prototyping, and small-scale production.