マイクロモジュールテクノロジー List of Products and Services

We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.

We utilize our implementation technology to conduct prototype and evaluation of functional and performance samples in product development, as well as evaluation samples for construction methods and materials in implementation development, bare chip mounting on special substrates, and micro joining between substrates. In addition to the combinations of materials provided by customers during prototyping, we also propose the best construction methods and material combinations for the requested products. We are capable of mounting on special substrates and accept orders starting from just one prototype.

We provide one-stop support from design to medium-scale mass production of miniaturization and module development using bear chip implementation and micro-joining technology. We accommodate medium-scale mass production ranging from about 10 to 100,000 units per month. Since all processes after dicing are handled in-house, please feel free to consult us for requests for specific tasks or single items.

We have a track record of prototyping and implementing ultra-small sensors and camera modules using bear chip implementation and micro-joining technology. Additionally, we develop, manufacture, and sell our original camera modules under the "IKURA series."

We can develop and manufacture SiC power modules that achieve miniaturization to less than half compared to conventional Si devices and can withstand high temperatures of over 250°C, tailored to custom specifications. These modules can also be integrated into inverters for driving and controlling motors in electric and hybrid vehicles, as well as power conversion devices for solar power generation and emergency storage systems.

The "IKURA-M12 series" and "IKURA-M5" are USB camera modules that use a 2M_Pixel CMOS sensor and comply with the UVC format. (Not all UVC commands are supported.) They support YUV (uncompressed) output and MJPEG output, allowing for selection based on application needs. The "IKURA-M12 series" measures 15mm x 15mm, and the lens can be chosen from our standard products. The "IKURA-M5" is an ultra-compact board-type camera measuring 13mm x 13mm. Both can be connected to an LED board, enabling shooting in dark environments. 【Main Applications】 - Office automation equipment - Measuring instruments - Machine tools - AV equipment - Home appliances - Communication devices (excluding trunk lines)

We implement semiconductor bare chips on various circuit boards using a variety of methods. It is possible to mount semiconductor bare chips and peripheral passive components on glass epoxy boards, ceramic boards, three-dimensional wiring boards (MID), flexible boards, glass boards, and silicon boards. Furthermore, we flexibly handle the development, prototyping, and small to medium-scale production of small modules and semiconductor packages, including BGA packages, power modules, and image sensor packages. We also perform specific tasks such as wire bonding only and special mounting, accepting orders starting from just one piece.

We have our own factory with a clean room located at our headquarters in Yokohama City. To conduct responsible development with an eye on quality, productivity, and cost during mass production, we are building an environment that allows for manufacturing verification, prototyping, and small-scale production.