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  1. Home
  2. Industrial Machinery
  3. ニデックマシンツール(前:日本電産マシンツール) 本社・本工場
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Industrial Machinery
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ニデックマシンツール(前:日本電産マシンツール) 本社・本工場

EstablishmentAugust 2, 2021
capital300000Ten thousand
number of employees900
addressShiga/Ritto-shi/Six Jizo 130
phone077-553-3300
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last updated:Apr 24, 2023
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ニデックマシンツール(前:日本電産マシンツール) List of Products and Services

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Gear machining equipment for automotive, robotics, construction machinery, and other gear processing.

A leading company in gear processing. With a rich lineup of machines and cutting tools, we strongly support gear processing in various industries.

From rough machining to finishing machining, we offer a full lineup. - Thin and small module machining machines used for robot reducers - Gear grinding machines that finish external and internal gears with high precision We have a variety of models tailored to different applications and purposes. We also have models that can handle gears with a maximum diameter of 2000 mm for larger sizes. Furthermore, we provide cutting tools compatible with the machining machines. <Lineup> ■ Hob machines ■ Gear shavers ■ Skiving machines ■ Shaving machines ■ Gear grinding machines ■ Large gear machinery ■ Others (Shaving cutter tooth profile grinding machines)

  • Gear cutting machine/Gear finishing machine

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Linear Position Detector MPFA

A low-cost linear scale (linear encoder) that is not affected by dust, oil, or condensation. A tape scale capable of high-precision position detection without contact.

1. Compact design The scale is a stainless steel tape with a thickness of 0.4 mm. 2. Easy installation The scale can be cut to any desired length for use. The scale can be simply attached using the included double-sided tape. 3. Support for installation, adjustment, and operation verification We provide support software (free of charge). If installed on your PC, it can be easily verified. 4. Electromagnetic coupling position detection The electromagnetic coupling method, which has over 50 years of proven performance in linear scales for machine tools, is inherited in the linear scale for industrial machinery (MPFA).

  • Sensors

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Portal five-sided machining center [Supports various large part machining with a rich lineup]

High precision. The "MV-R series" gantry five-axis machining center pursued high productivity.

We have created a series with variations in size and functionality so that you can choose according to your needs. *For more details, please visit our website or feel free to contact us.*

  • Other processing machines

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Precision machining machine, small precision machining machine μV1

Achieving a "zero" processing surface boundary segment difference.

This is a high-speed cutting machine for precision molds, electrodes, and high-precision parts in fields such as IT, optics, medical devices, and semiconductor devices. In addition to its fundamental performance that maintains high precision over long periods, it achieves effective use of floor space and automation equipment through a flexible automation-compatible layout concept. In response to changes in the position of the tool's lowest point, which directly affects processing accuracy, images of the rotating tool captured by LED lighting and a high-resolution CCD camera are digitally processed. This allows for automatic determination of the stability of the tool's lowest point position after thermal displacement has converged, enabling tool length correction to be executed. 【Features】 ■ Our unique imaging-based tool measurement system ■ Achieves precision that cannot be reached through correction ■ Balances fine high precision with high efficiency ■ Ensures long-term high surface quality processing ■ Pursues 5-axis precision equivalent to that of 3-axis machines -Compact Precision Machining Machine μV1- Movement range (X × Y × Z axes)  450 × 350 × 300mm Maximum spindle speed  40,000min-1 ◆ For product details, click here https://www.nidec.com/jp/machine-tool/products/B700/M101/S100/NMTJ-precision_machine/

  • Other processing machines

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Room Temperature Wafer Bonding Device BOND MEISTER【Semiconductor Manufacturing】

A room temperature wafer bonding device that opens new horizons in the bonding process. Supporting device development with high reliability, bonding quality, and bonding support services!

Joining is performed by activating the surface of the joining materials with an ion beam in a vacuum. ■Application in MEMS wafer-level packaging - Packaging can be done at the wafer level before dicing, simplifying subsequent processes. - Since no heating is involved, thermal distortion is eliminated even for fine structures. - Increased productivity as there is no need for heating and cooling time. - Ideal for the development of stacked high-integration MEMS. ■Application to other high-functionality devices - Capable of joining a wide range of materials such as metals, quartz, sapphire, and oxide single crystals. - High yield is achievable due to the absence of thermal distortion. - Dissimilar materials can also be joined at room temperature, enabling previously impossible joints and enhancing design flexibility for devices. A lineup of equipment that maximizes the benefits of the room temperature joining process (all-in-one setup including alignment equipment, wafer transport robots, and bonding mechanisms). For more details, please contact us or download the 'catalog' for confirmation.

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