D-process List of Products and Services

Our company, which specializes in W2W bonding, offers C2W processing services. We address issues such as alignment discrepancies in W2W and improve efficiency and power savings compared to conventional technologies, including wire bonding. We achieve high-precision and low-cost 3D packaging in HBM and FO-WLP. 【Features】 ■ C2W TB support through high-precision alignment ■ High-efficiency stacking through parallel C2W ■ Efficiency improvements through the expansion of C2W to W2W bonding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We offer "pre-bond CMP contract processing" at our company. As an example of our processing achievements in pre-bond CMP, we can work with materials used in semiconductors and compound semiconductors such as Si, Cu, W, Ta, TaN, SiO2, TEOS, GaAs, SiC, GaN, and InP. We are capable of both homogeneous bonding and bonding between these different materials. Before processing your wafers through our CMP contract processing, we will meet your needs with reliable technology backed by numerous in-house experiments. 【Example of Processing Achievements】 ■ Single Crystal Oxides - LiNbO3, LiTaO3, Al2O3 (Sapphire), etc. ■ Polycrystalline Materials - Poly-Si, SiC, Al2O3/YAG, etc. ■ Metals - Au, Pt, Ag, Cu, Ti, TiN, Ni, W, Al, Sn, Pb, Zn, etc. ■ Ceramics - Alumina, Ferrite, Zirconia *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

We offer "TSV CMP Contract Processing." By applying a CMP process using a slurry that ensures nearly 10 times the processing speed compared to the Cu slurry typically used for semiconductor Cu CMP, we can complete processing in a short time. With our CMP contract processing, we have achieved ultra-high precision and low cost through the establishment of ultra-fast Cu CMP. 【Features】 ■ Reduced processing time ■ Contributes to improved processing accuracy ■ Ultra-fast Cu CMP process ■ Minimization of dishing ■ Achieves ultra-high precision and low cost *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

This catalog is a comprehensive catalog of D-process, which conducts CMP and wafer direct bonding prototyping and mass production, along with the transfer of associated processes. It provides detailed information on contract processing for CMP, wafer bonding, seed layer formation, and plating, among others. [Contents (excerpt)] ■ Contract processing for CMP ■ Contract processing for wafer bonding ■ Contract processing for seed layer formation and plating ■ Other contract processing for processes ■ Back grinding (thinning) / Lapping / Diamond polishing ■ Edge treatment / Dicing *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract