D-process Product Lineup

At D-process, experienced process engineers enable all types of planarization CMP processing. 【Processing Steps】 ○Step 1 Confidentiality agreement and technical discussions Selection of other applications ○Step 2 Basic evaluation using test wafers and development of the basic composition of the horizonor ○Step 3 Prototyping and optimization of the horizonor using actual device wafers ○Step 4 Mass production or technical transfer ●For other functions and details, please download the catalog.

• Processing Contract

Post-CMP cleaning of MEMS is a very delicate process. There are many MEMS devices with three-dimensional structures, making it extremely challenging to clean without damaging the structures themselves. By fully utilizing the cleaning technology for MEMS devices that we have developed over many years, it is possible to return MEMS devices to the existing line after CMP processing. ● For other functions and details, please download the catalog.

• Processing Contract

We can accommodate a wide range of production volumes, from small-scale spot prototypes of about 1 to 10 pieces to mass production of approximately 24,000 pieces per month. This includes ultra-fine CMP for MEMS devices, track media, and patterned media. ■ Features of Our CMP Contract Processing We secure a significant process margin by developing slurries in-house for all kinds of materials that are not currently addressed in the market. We achieve high precision in response to requirements such as polishing rate, processing selection ratio, and surface roughness. ■ Example of Material Achievements Metal materials: Au, Ag, Cu, Al, W, Ta, TaN, Ti, TiN, Ni, Ni-p, Ni-Fe, Cr, ZnO, etc. Insulating materials: SiO2, TEOS, various polymers, etc. Substrate materials: Si, SiC, GaN, Al2O3, Al2O3 composites, polymers, etc.

• Processing Contract