アローズエンジニアリング Product Lineup

At Arrows Engineering, we handle MEMS microscopes manufactured by IT Tech. The "TMIR-2000" can monitor MEMS wafers from both sides using microscope cameras, allowing for pattern misalignment and misregistration inspections. With newly developed software, the optical axes of the two cameras are aligned and synthesized in real-time, directly capturing any vertical overlap misalignment. Additionally, automatic line width measurement allows for sub-micron measurement of mark misalignment. 【Basic Configuration (Excerpt)】 ■ MEMS Microscope Main Unit ■ Triple Eyepiece Tube ■ 10x Eyepiece ■ XY Stage ■ Two Color Cameras ■ Inspection PC/19-inch Monitor/MEMS Inspection Software, etc. *For more details, please refer to the PDF document or feel free to contact us.

At Arrows Engineering, we handle the "Automatic Infrared Microscope" manufactured by IT Tech. This product performs image measurements of the pattern dimensions inside silicon using an infrared microscope, focusing visibly with AF on the surface of 8” bonded wafers. It is equipped with 2 cassettes, an edge grip chuck, and an edge aligner. 【Features】 ■ Target wafer: 8” ■ 2 cassettes ■ Positioning accuracy: ±1μm ■ Axis offset measurement: ±0.5μm ■ Line width measurement: 0.2μm *For more details, please refer to the PDF document or feel free to contact us.

At Arrows Engineering, we handle the AR film defect inspection equipment manufactured by IT Tech. The 'EX2001S' is a defect inspection machine for anti-reflective films on glass substrates. It performs high-speed scan inspections of the surfaces and backs of transparent substrates using an inverted microscope and line camera to detect defects. 【Features and Functions】 - The maximum substrate size is 400mm, with auto-focus inspection for transparent substrates. - Detected defects include white foreign matter (gaps) and black foreign matter on the AR film substrate. - Minimum detection resolution is 2.8μm (1.4μm). - Review inspections can be remotely controlled (camera/lighting/objective magnification/stage and focus). *For more details, please refer to the PDF document or feel free to contact us.

The "MR-200A" is a device that can measure the V-groove shape of the main roller and the wire height. After cleaning the roller set on the wire saw, the inspection device is attached to the core. The inspection device moves across the roller stage to measure all grooves, and the measurement values are saved as Excel and image files. 【Features】 ■ Inspect the groove depth without removing the roller from the machine and ensure it is not deeper than others when there is no wire. ■ Measure the wire height in a wound state to assess sinking. ■ Determine the criteria for roller replacement as a clue for quality improvement based on inspection results. ■ Conduct acceptance inspection after reprocessing the main roller. *For more details, please download the PDF or feel free to contact us.