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We would like to introduce a case where we received a request for high-speed transmission artwork (10Gbps × 8 lanes) to lens assembly. Considering the performance (characteristics of each signal), the capabilities of the wire bonder, and the shape of the lens, we determined the die pad shape, the position of the second bonding, and the pattern layout. We accurately aligned the center of the lens above the center of the two optoelectronic device emission areas that were precisely die-mounted, using image recognition to position the center of the microlens array one point at a time. [Case Overview] ■ Challenge - The center of the emission point of the bare chip must be aligned with the center of the lens with an accuracy of a few micrometers, but there is no budget for the production of special alignment jigs. ■ Result - The center of the emission area of the optoelectronic device directly below was aligned with the center of the lens directly above, achieving implementation without creating special jigs. *For more details, please refer to the related links or feel free to contact us.